Technology area: Semiconductors, Circuits & Optics
52 pending office actions • 25 art units • 49 examiners • 0 of 52 (0%) have an AI response strategy ready • 165 patents granted in the last 365 days
Semiconductor Components Industries LLC has 52 pending office actions in Semiconductors, Circuits & Optics. The workload spans 48 distinct examiners and 24 distinct art units, demonstrating broad examination coverage with more substantial concentration at the art-unit level than at the examiner level.
VU, VU A is the busiest examiner, with 2 pending matters. That limited repeat assignment may support targeted review, but it does not define the portfolio. Counsel should organize the docket by art unit and technical issue, maintain centralized deadline controls, and tailor responses to the many separate examiner relationships.
Based on the USPTO statutory response window for each pending office action. 10 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 10 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §101 + other | 1 (2%) |
| §103 only | 16 (31%) |
| §102 only | 2 (4%) |
| §112 only | 1 (2%) |
| Double-patenting only | 2 (4%) |
| Multi-statute (no §101) | 29 (56%) |
| No statute on record | 1 (2%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| VU, VU A | 2 | 92.3% | +6.7% |
| ARROYO, TERESA M | 2 | 72.0% | +23.2% |
| CIESLEWICZ, ANETA B | 2 | 66.9% | +0.2% |
| MORLAN, ROBERT M | 1 | 74.3% | +15.6% |
| JEAN PIERRE, PEGUY | 1 | 94.3% | -0.8% |
| ALLGOOD, ALESA M | 1 | 82.5% | +18.5% |
| GONZALEZ, MILTON | 1 | 77.7% | +12.7% |
| JACKSON, STEPHEN W | 1 | 92.5% | +7.3% |
| LIN, AMIE CHINYU | 1 | 84.4% | +30.9% |
| RETEBO, METASEBIA T | 1 | 89.6% | +5.2% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 2 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18955820 | FAULT PROTECTION TESTING IN A HIGH-POWER SWITCHING SYSTEM | JACKSON, STEPHEN W | — |
| 18795699 | TAPE HEATING METHODS | VU, VU A | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18055123 | POWER ELECTRONICS PACKAGE WITH DUAL-SINGLE SIDE COOLING WATER JACKET | CIESLEWICZ, ANETA B | 16d overdue |
| 18341958 | ELECTROPLATING SYSTEMS AND METHODS | MENDEZ, ZULMARIAM | 12d |
| 17814566 | HETEROGENEOUS EMBEDDED POWER DEVICE PACKAGE USING DAM AND FILL | BULLARD-CONNOR, GENEVIEVE GRACE | 23d |
| 17814750 | POWER DEVICE INCLUDING METAL LAYER | NGUYEN, THANH T | 79d |
| 19241981 | LOCALLY UNIQUE MAC ADDRESS RESOLUTION | MORLAN, ROBERT M | — |
| 19042666 | LOW POWER PHASE DETECTION | JEAN PIERRE, PEGUY | — |
| 19034535 | INDUCTIVE ANGULAR POSITION SENSOR | ALLGOOD, ALESA M | — |
| 18933202 | JET ABLATION DIE SINGULATION SYSTEMS AND RELATED METHODS | VU, VU A | — |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 6 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 19241981 | LOCALLY UNIQUE MAC ADDRESS RESOLUTION | MORLAN, ROBERT M | — |
| 19034535 | INDUCTIVE ANGULAR POSITION SENSOR | ALLGOOD, ALESA M | — |
| 19018146 | HARMONIC DISTORTION REDUCTION IN INDUCTIVE POSITION SENSORS | GONZALEZ, MILTON | — |
| 18917293 | SECURE SERIAL BUS WITH AUTOMOTIVE APPLICATIONS | LIN, AMIE CHINYU | — |
| 18529657 | METHODS FOR MANUFACTURING POWER SEMICONDUCTOR DEVICES AND POWER SEMICONDUDCTOR STRUCTURES | ARROYO, TERESA M | — |
| 18193847 | SEMICONDUCTOR PACKAGE HAVING WETTABLE FLANKS AND RELATED METHODS | ARROYO, TERESA M | — |
| Art Unit | Apps |
|---|---|
| 2893 | 8 |
| 2818 | 5 |
| 2812 | 4 |
| 2899 | 4 |
| 2897 | 3 |
| 1714 | 3 |
| 2898 | 3 |
| 2858 | 2 |
| 2838 | 2 |
| 3645 | 2 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 19241981 | LOCALLY UNIQUE MAC ADDRESS RESOLUTION | MORLAN, ROBERT M | 2469 | §102§103 | Non-Final OA | — | Pending | Jun 18, 2025 |
| 19042666 | LOW POWER PHASE DETECTION | JEAN PIERRE, PEGUY | 2845 | §102§103 | Non-Final OA | — | Pending | Jan 31, 2025 |
| 19034535 | INDUCTIVE ANGULAR POSITION SENSOR | ALLGOOD, ALESA M | 2858 | §103§112 | Non-Final OA | — | Pending | Jan 22, 2025 |
| 19018146 | HARMONIC DISTORTION REDUCTION IN INDUCTIVE POSITION SENSORS | GONZALEZ, MILTON | 2852 | Other | Non-Final OA | — | Pending | Jan 13, 2025 |
| 18955820 | FAULT PROTECTION TESTING IN A HIGH-POWER SWITCHING SYSTEM | JACKSON, STEPHEN W | 2838 | DP | Non-Final OA | — | Pending | Nov 21, 2024 |
| 18933202 | JET ABLATION DIE SINGULATION SYSTEMS AND RELATED METHODS | VU, VU A | 2897 | §102§103 | Non-Final OA | — | Pending | Oct 31, 2024 |
| 18917293 | SECURE SERIAL BUS WITH AUTOMOTIVE APPLICATIONS | LIN, AMIE CHINYU | 2436 | §101§102§103 | Final Rejection | — | Pending | Oct 16, 2024 |
| 18891830 | IMPROVED VOLTAGE BUFFER | RETEBO, METASEBIA T | 2836 | §102§103 | Non-Final OA | — | Pending | Sep 20, 2024 |
| 18799472 | IMAGE SENSOR PACKAGE HAVING A LIGHT BLOCKING MEMBER | RAHMAN, KHATIB A | 2818 | §102§103 | Non-Final OA | — | Pending | Aug 09, 2024 |
| 18796826 | SYSTEM AND METHOD FOR GATE THRESHOLD VOLTAGE MEASUREMENT | AGARED, GABRIEL T | 2837 | §102§103 | Final Rejection | — | Pending | Aug 07, 2024 |
| 18795699 | TAPE HEATING METHODS | VU, VU A | 2897 | §103 | Non-Final OA | — | Pending | Aug 06, 2024 |
| 18791299 | LOW ENERGY PHOTON DETECTION WITH CMOS IMAGERS | DANG, PHILIP | 2488 | §103 | Non-Final OA | 26d | Pending | Jul 31, 2024 |
| 18787369 | OXIDATION AND CORROSION PREVENTION IN SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE ASSEMBLIES | MIHALIOV, DMITRI | 2812 | §103§112 | Non-Final OA | — | Pending | Jul 29, 2024 |
| 18775336 | METHOD OF FABRICATING SUPER-JUNCTION BASED VERTICAL GALLIUM NITRIDE JFET AND MOSFET POWER DEVICES | BOOTH, RICHARD A | 2812 | DP | Non-Final OA | — | Pending | Jul 17, 2024 |
| 18755366 | SEMICONDUCTOR DEVICE PACKAGE WITH CLIP INTERCONNECT AND DUAL SIDE COOLING | MUSE, ISMAIL A | 2812 | §102§103 | Non-Final OA | — | Pending | Jun 26, 2024 |
| 18738193 | MANAGING THE GROWTH OF SILICON CARBIDE CRYSTALS | SONG, MATTHEW J | 1714 | §102§103 | Non-Final OA | — | Pending | Jun 10, 2024 |
| 18676316 | SEMICONDUCTOR PACKAGE AND RELATED METHODS | ENAD, CHRISTINE A | 2811 | §102§103 | Non-Final OA | — | Pending | May 28, 2024 |
| 18661875 | MANAGING GROWTH OF SILICON CARBIDE CRYSTALS | BRATLAND JR, KENNETH A | 1714 | §102§103§112 | Non-Final OA | — | Pending | May 13, 2024 |
| 18652203 | HIGH PHOTON RATE SPAD DEVICE | FLORES, MARK ANTHONY | 3648 | §102§103 | Non-Final OA | — | Pending | May 01, 2024 |
| 18647326 | METHOD OF TESTING A POWER TRANSISTOR | FREDERIKSEN, DAVID B | 2858 | §103 | Non-Final OA | — | Pending | Apr 26, 2024 |
| 18637126 | OPERATING MODE CONTROL TECHNIQUE FOR POWER FACTOR CORRECTION CIRCUITS | CORDOVA RODRIGUEZ, ULARISLAO | 2838 | §103 | Non-Final OA | — | Pending | Apr 16, 2024 |
| 18701585 | TERMINATION STRUCTURES FOR MOSFETS | BENTON, CHLOE ELAINE | 2899 | §102§103§112 | Non-Final OA | — | Pending | Apr 15, 2024 |
| 18634120 | SPLIT-GATE TRENCH SEMICONDUCTOR DEVICE HAVING STEPPED SHIELD ELECTRODE AND METHOD OF MANUFACTURING | SQUIRES, BRETT STEPHEN | 2899 | §102§103 | Non-Final OA | — | Pending | Apr 12, 2024 |
| 18631649 | HIDDEN ULTRASONIC SENSING SYSTEMS SUITABLE FOR ADVANCED DRIVER ASSISTANCE | ABULABAN, ABDALLAH | 3645 | §103 | Non-Final OA | — | Pending | Apr 10, 2024 |
| 18621338 | PARTITIONED LEADFRAME FOR MULTI-DIE DISCRETE ELECTRONIC COMPONENTS | ARMAND, MARC ANTHONY | 2813 | §103 | Non-Final OA | — | Pending | Mar 29, 2024 |
| 18621005 | METHODS AND SYSTEMS OF LIGHT DETECTING AND RANGING | HULKA, JAMES R | 3645 | §102§103 | Non-Final OA | — | Pending | Mar 28, 2024 |
| 18608662 | POWER DEVICE MODULE WITH DUMMY PAD DIE LAYOUT | AU, BAC H | 2898 | §102§103 | Final Rejection | — | Pending | Mar 18, 2024 |
| 18606922 | METHODS FOR SINGULATING SEMICONDUCTOR DIE FROM SILICON CARBIDE SUBSTRATES | ZARNEKE, DAVID A | 2891 | §102§103 | Non-Final OA | — | Pending | Mar 15, 2024 |
| 18592273 | MULTI-CHIP SEMICONDUCTOR MODULE WITH BALANCED SWITCHING | SANDVIK, BENJAMIN P | 2812 | §103 | Non-Final OA | — | Pending | Feb 29, 2024 |
| 18441484 | DIRECT-COOLING FOR SEMICONDUCTOR DEVICE MODULES | MUNOZ, ANDRES F | 2818 | §102§103 | Final Rejection | — | Pending | Feb 14, 2024 |
| 18534065 | SEMICONDUCTOR DEVICES WITH SIDEWALL RECESSES | HENRY, CALEB E | 2818 | §102 | Final Rejection | 22d | Pending | Dec 08, 2023 |
| 18529657 | METHODS FOR MANUFACTURING POWER SEMICONDUCTOR DEVICES AND POWER SEMICONDUDCTOR STRUCTURES | ARROYO, TERESA M | 2893 | §103 | Non-Final OA | — | Pending | Dec 05, 2023 |
| 18488628 | ARC PREVENTION FOR BONDED WAFERS OF A CHIP STACK | FAN, SU JYA | 2818 | §103 | Final Rejection | — | Pending | Oct 17, 2023 |
| 18479316 | IMAGE SENSOR CHARGE DIRECTION STRUCTURES AND METHODS | BRADFORD, PETER | 2897 | §103 | Non-Final OA | — | Pending | Oct 02, 2023 |
| 18478115 | PACKAGE TRAYS FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS | BRASFIELD, QUINTON A | 2814 | §102§103 | Non-Final OA | — | Pending | Sep 29, 2023 |
| 18478296 | WIRE-IN-DAM PACKAGES AND RELATED SYSTEMS AND METHODS | SWANSON, ANDREW L | 2896 | §102 | Non-Final OA | — | Pending | Sep 29, 2023 |
| 18473998 | POWER MODULE STRUCTURE WITH CLIP SUBSTRATE MEMBER | SRINIVASAN, SESHA SAIRAMAN | 2817 | §103 | Final Rejection | — | Pending | Sep 25, 2023 |
| 18462082 | IMAGE SENSOR PACKAGES AND RELATED METHODS | KOLB, THADDEUS J | 2817 | §102§103 | Final Rejection | — | Pending | Sep 06, 2023 |
| 18446127 | COPPER PAD METALLIZATION SYSTEMS AND RELATED METHODS | STEPHENSON, KENNETH STEPHEN | 2898 | §103 | Final Rejection | 19d overdue | Pending | Aug 08, 2023 |
| 18353148 | COMPACT DIRECT-BONDED METAL SUBSTRATE PACKAGE | CIESLEWICZ, ANETA B | 2893 | §103 | Final Rejection | — | Pending | Jul 17, 2023 |
| 18341958 | ELECTROPLATING SYSTEMS AND METHODS | MENDEZ, ZULMARIAM | 1794 | §102§103 | Non-Final OA | 12d | Pending | Jun 27, 2023 |
| 18308467 | MOLDED POWER MODULES | KLEIN, JORDAN M | 2893 | §103 | Final Rejection | 28d | Pending | Apr 27, 2023 |
| 18193847 | SEMICONDUCTOR PACKAGE HAVING WETTABLE FLANKS AND RELATED METHODS | ARROYO, TERESA M | 2893 | §102§103 | Non-Final OA | — | Pending | Mar 31, 2023 |
| 18185548 | EDGE SEALS FOR SEMICONDUCTOR DEVICES | PURVIS, SUE A | 2893 | §102§103§112 | Non-Final OA | — | Pending | Mar 17, 2023 |
| 18182552 | INTEGRATED SUBSTRATES AND RELATED METHODS | HIBBERT, DANIEL JOHNATHAN | 2899 | §103 | Non-Final OA | — | Pending | Mar 13, 2023 |
| 18174837 | SANDWICH PACKAGE FOR MICROELECTRONICS | HUTSON, NICHOLAS LELAND | 2818 | §102§103 | Non-Final OA | — | Pending | Feb 27, 2023 |
| 18055123 | POWER ELECTRONICS PACKAGE WITH DUAL-SINGLE SIDE COOLING WATER JACKET | CIESLEWICZ, ANETA B | 2893 | §103§112 | Final Rejection | 16d overdue | Pending | Nov 14, 2022 |
| 18053796 | SEMICONDUCTOR CRYSTAL GROWTH USING SOURCE POWDER FROM CRUCIBLE WALL | QI, HUA | 1714 | §112 | Non-Final OA | 16d overdue | Pending | Nov 09, 2022 |
| 17822403 | IMAGE SENSOR BALL GRID ARRAY PACKAGE | LASASSO, VICTOR JOSEPH | 2898 | §103 | Non-Final OA | 53d | Pending | Aug 25, 2022 |
| 17814566 | HETEROGENEOUS EMBEDDED POWER DEVICE PACKAGE USING DAM AND FILL | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §102§103§112 | Final Rejection | 23d | Pending | Jul 25, 2022 |
IP Author helps IP teams respond to office actions faster with AI-generated responses, examiner analytics, and prosecution intelligence.
Start Free TrialSemiconductor Components Industries LLC has 52 pending office actions as of October 2026, spread across 25 art units and 49 examiners.
Vu A Vu has the most, with 2 of Semiconductor Components Industries LLC's pending office actions.
Mostly Semiconductors, Circuits & Optics (USPTO Tech Center 2800), based on where its pending office actions are examined.
