DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Continued Examination Under 37 CFR 1.114
A request for continued examination under 37 CFR 1.114, including the fee set forth in 37 CFR 1.17(e), was filed in this application after final rejection. Since this application is eligible for continued examination under 37 CFR 1.114, and the fee set forth in 37 CFR 1.17(e) has been timely paid, the finality of the previous Office action has been withdrawn pursuant to 37 CFR 1.114. Applicant's submission filed on 4/28/26 has been entered.
Claim Rejections - 35 USC § 112
The following is a quotation of 35 U.S.C. 112(b):
(b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention.
The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph:
The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention.
Claims 20-23 are rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention.
Claim 20 recites the limitation “the pad pattern has a second thickness between an upper surface and the lower surface of the pad pattern in the direction” in lines 21-22. There is insufficient antecedent basis for the limitation of “the direction” in the claim. For the purposes of examination, the examiner interprets “the direction” in line 22 as - - a direction perpendicular to a lower surface to the first semiconductor chip - -. However, appropriate correction and/or clarification is requested. Claims 21 and 23 inherit the 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, rejections based on their dependencies on claim 20.
Claim 20 recites the limitation “the metal layer has a third thickness, which is smaller than the second thickness between an upper surface and a lower surface of the metal layer in the direction” in lines 23-24. There is insufficient antecedent basis for the limitation of “the direction” in the claim. For the purposes of examination, the examiner interprets “the direction” in line 24 as - - a direction perpendicular to a lower surface to the first semiconductor chip - -. However, appropriate correction and/or clarification is requested. Claims 21 and 23 inherit the 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, rejections based on their dependencies on claim 20.
Allowable Subject Matter
Claims 1, 3-8 and 11-14 are allowed.
Claim 1 contains allowable subject matter because of the limitation the pad pattern has a second thickness between an upper surface and a lower surface of the pad pattern in the direction, the metal layer has a third thickness between an upper surface and a lower surface of the metal layer in the direction, and the pad thickness is a sum of the second thickness and the third thickness, and wherein a width of the opening is smaller than a width of the pad pattern, a width of the metal layer is smaller than the width of the pad pattern, and the metal layer is in contact with a sidewall of the passivation layer defining the opening in combination with the other elements of the claim. Claims 3-8 depend on claim 1.
Claim 11 contains allowable subject matter because of the limitation one of the interconnection patterns comprises a side surface facing a side surface of the pad structure, wherein the one of the interconnection patterns has a first thickness between an upper surface and a lower surface thereof in the direction, wherein the pad thickness is greater than the first thickness, wherein the pad pattern has a second thickness between an upper surface and the lower surface of the pad pattern in the direction, wherein the metal layer has a third thickness, which is smaller than the second thickness between an upper surface and a lower surface of the metal layer in the direction, and wherein the pad thickness is a sum of the second thickness and the third thickness in combination with the other elements of the claim. Claims 12-14 depend on claim 11.
Response to Arguments
Applicant’s arguments with respect to claims 20-21 and 23 have been considered but are moot in view of the new ground(s) of rejection.
Examiner notes that withdrawn claim 18 depends on cancelled claim 15. Even assuming claim 18 depended on claim 11 as argued by Applicant (pp 11) in the Remarks, Examiner notes that the subject matter of claim 18 (“the third thickness of the metal layer is greater than the second thickness of the pad pattern”) directly conflicts with the subject matter of claim 11 (“the metal layer has a third thickness, which is smaller than the second thickness…”).
Conclusion
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/REEMA PATEL/Primary Examiner, Art Unit 2812 4/15/2026
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