Tech Center 2800 • Art Units: 2812
This examiner grants 88% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18515441 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18464539 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18318587 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17915522 | DISPLAY DEVICE, AND DISPLAY PANEL AND MANUFACTURING METHOD THEREOF | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 17234385 | NORMALLY OFF III NITRIDE TRANSISTOR | Non-Final OA | Texas Instruments Incorporated |
| 18515571 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18481221 | WINDOW AND DISPLAY DEVICE INCLUDING THE SAME | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 17978323 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18557062 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18242943 | CONTACT RESISTANCE REDUCTION FOR DIRECT BACKSIDE CONTACT | Non-Final OA | Applied Materials, Inc. |
| 18361255 | STACKED FIELD EFFECT TRANSISTOR HYBRID GATE CUT | Non-Final OA | International Business Machines Corporation |
| 17946017 | COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR (CMOS) APPARATUS WITH SELF-ALIGNED BACKSIDE CONTACT | Non-Final OA | International Business Machines Corporation |
| 17943751 | HEIGHT CONTROL IN NANOSHEET DEVICES | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18504398 | SEMICONDUCTOR FABRICATION PROCESSES FOR DEFECT REDUCTION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18306101 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18173039 | PACKAGE STRUCTURE, PACKAGE-ON-PACKAGE STRUCTURE, AND MANUFACTURING METHOD OF INTEGRATED FAN-OUT PACKAGE | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18110330 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18103846 | METHODS FOR CORRECTING WARPAGE WITH STRESS FILMS AND PACKAGE STRUCTURES THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18468366 | AIRGAPS IN TOP LAYERS OF SEMICONDUCTOR DEVICES | Non-Final OA | QUALCOMM Incorporated |
| 18465997 | SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18569659 | METHOD FOR PRODUCING AT LEAST ONE PHOTOVOLTAIC CELL FOR CONVERTING ELECTROMAGNETIC RADIATION INTO ELECTRICAL ENERGY | Non-Final OA | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. |
| 17881842 | SEMICONDUCTOR DEVICE HAVING NEEDLE-SHAPED FIRST FIELD PLATE STRUCTURES AND NEEDLE-SHAPED SECOND FIELD PLATE STRUCTURES | Non-Final OA | Infineon Technologies Austria AG |
| 18461700 | THREE DIMENSIONAL INTEGRATED CIRCUIT AND FABRICATION THEREOF | Non-Final OA | National Yang Ming Chiao Tung University |
| 18231453 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18340503 | Topside Cooling for Semiconductor Device | Final Rejection | Wolfspeed, Inc. |
| 18528009 | LIGHT EMITTING DIODE | Non-Final OA | Taiwan-Asia Semiconductor Corporation |
| 18319786 | DIRECT HYBRID BOND PAD HAVING TAPERED SIDEWALL | Non-Final OA | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 18492427 | MICRO LIGHT EMITTING DEVICE AND MICRO LIGHT EMITTING APPARATUS USING THE SAME | Non-Final OA | XIAMEN SAN'AN OPTOELECTRONICS CO., LTD. |
| 18320063 | HETEROJUNCTION STRUCTURE WITH VARYING LAYER COMPOSITION | Final Rejection | Infineon Technologies Canada Inc. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy