Tech Center 2800 • Art Units: 2811 2812
This examiner grants 89% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18777300 | IMAGE SENSOR WITH VARYING GRID WIDTH | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18751384 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18428264 | VERTICAL SEMICONDUCTOR DEVICES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18529346 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18113715 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18292313 | PHOTODETECTOR, METHOD OF MANUFACTURING PHOTODETECTOR, AND ELECTRONIC APPARATUS | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18557062 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18395641 | METHOD FOR MAKING A SEMICONDUCTOR DEVICE USING A DOUBLE SIDE MOLDING TECHNOLOGY | Non-Final OA | STATS ChipPAC Pte. Ltd. |
| 18443311 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Samsung Display Co., Ltd. |
| 18372990 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., LTD. |
| 17978323 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18532685 | METHODS OF MANUFACTURING SEMICONDUCTOR DIE STACK STRUCTURES | Non-Final OA | SK hynix Inc. |
| 18110330 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18373098 | SHIFTED MULTI-VIA CONNECTION FOR HYBRID BONDING | Non-Final OA | Tokyo Electron Limited |
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