Tech Center 2800 • Art Units: 2811 2812
This examiner grants 89% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17234385 | NORMALLY OFF III NITRIDE TRANSISTOR | Non-Final OA | Texas Instruments Incorporated |
| 17915522 | DISPLAY DEVICE, AND DISPLAY PANEL AND MANUFACTURING METHOD THEREOF | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18481221 | WINDOW AND DISPLAY DEVICE INCLUDING THE SAME | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18557062 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 17946017 | COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR (CMOS) APPARATUS WITH SELF-ALIGNED BACKSIDE CONTACT | Non-Final OA | International Business Machines Corporation |
| 17943751 | HEIGHT CONTROL IN NANOSHEET DEVICES | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18509344 | DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE | Non-Final OA | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. |
| 18557468 | METHOD AND DEVICE FOR FILLING A REAR-SIDE CAVITY OF A SEMICONDUCTOR ASSEMBLY | Non-Final OA | Robert Bosch GmbH |
| 18468366 | AIRGAPS IN TOP LAYERS OF SEMICONDUCTOR DEVICES | Non-Final OA | QUALCOMM Incorporated |
| 18504398 | SEMICONDUCTOR FABRICATION PROCESSES FOR DEFECT REDUCTION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18110330 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18103846 | METHODS FOR CORRECTING WARPAGE WITH STRESS FILMS AND PACKAGE STRUCTURES THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18569659 | METHOD FOR PRODUCING AT LEAST ONE PHOTOVOLTAIC CELL FOR CONVERTING ELECTROMAGNETIC RADIATION INTO ELECTRICAL ENERGY | Non-Final OA | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. |
| 18171988 | SEMICONDUCTOR DEVICE | Non-Final OA | KABUSHIKI KAISHA TOSHIBA |
| 18431112 | SEMICONDUCTOR DEVICES | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 17881842 | SEMICONDUCTOR DEVICE HAVING NEEDLE-SHAPED FIRST FIELD PLATE STRUCTURES AND NEEDLE-SHAPED SECOND FIELD PLATE STRUCTURES | Non-Final OA | Infineon Technologies Austria AG |
| 18164249 | Semiconductor Structure for Improved Radio Frequency Thermal Management | Non-Final OA | Wolfspeed, Inc. |
| 18528009 | LIGHT EMITTING DIODE | Non-Final OA | Taiwan-Asia Semiconductor Corporation |
| 18164390 | LED PACKAGE FOR UV LIGHT AND PROCESS | Non-Final OA | Ams-OSRAM International GmbH |
| 18492427 | MICRO LIGHT EMITTING DEVICE AND MICRO LIGHT EMITTING APPARATUS USING THE SAME | Non-Final OA | XIAMEN SAN'AN OPTOELECTRONICS CO., LTD. |
| 18320063 | HETEROJUNCTION STRUCTURE WITH VARYING LAYER COMPOSITION | Final Rejection | Infineon Technologies Canada Inc. |
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