Last updated: July 05, 2026

Application No. 17/809,408

SEMICONDUCTOR DEVICE INCLUDING A BASE PLATE AND A CASE HAVING CONVEX AND CONCAVE PORTIONS THAT FIT TOGETHER

Final Rejection

Filed

Jun 28, 2022

Priority

Sep 28, 2021 — JP 2021-157892

Examiner

PURVIS, SUE A

Art Unit

2893

Tech Center

2800 — Semiconductors & Electrical Systems

Assignee

Mitsubishi Electric Corporation

OA Round

2 (Final)

Interview Optional

— +15.2% interview lift. Interview already conducted in this application's prosecution history. This examiner has a 65% grant rate with +15.2% interview lift. Since an interview has already been tried, recommend written response with narrowed claims based on precedent claim evolution patterns.

Based on 79 resolved cases, 2023–2026

Examiner Intelligence

PURVIS, SUE A View full profile →

Grants 65% of resolved cases

Career Allowance Rate

51 granted / 79 resolved

-3.4% vs TC avg

Strong +15% interview lift

Without

With

+15.2%

Interview Lift

resolved cases with interview

Typical timeline

3y 4m

Avg Prosecution

18 currently pending

Career history

110

Total Applications

across all art units

Statute-Specific Performance

§101

0.4%

-39.6% vs TC avg

§103

66.0%

+26.0% vs TC avg

§102

15.4%

-24.6% vs TC avg

§112

14.6%

-25.4% vs TC avg

Black line = Tech Center average estimate • Based on career data from 79 resolved cases

Prosecution Timeline

Jun 28, 2022

Application Filed

Apr 17, 2025

Non-Final Rejection mailed

Jul 17, 2025

Response Filed

Apr 03, 2026

Final Rejection mailed

Jun 25, 2026

Applicant Interview (Telephonic)

Jun 26, 2026

Examiner Interview Summary

Precedent Cases

Applications granted by this same examiner with similar technology

18/536,880

Patent 12672319

METAL OXIDE SEMICONDUCTOR HAVING EPITAXIAL SOURCE DRAIN REGIONS AND A METHOD OF MANUFACTURING SAME USING DUMMY GATE PROCESS

2y 6m to grant Granted Jun 30, 2026

18/586,336

Patent 12672235

SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS

2y 4m to grant Granted Jun 30, 2026

18/595,172

Patent 12668051

METHOD FOR REPAIRING DELAMINATION AND MOISTURE BY HEAT, PRESSURE AND ADHESIVE

2y 3m to grant Granted Jun 30, 2026

18/599,788

Patent 12668719

ADHESIVE MATERIAL AND ELECTROCHEMICAL APPARATUS CONTAINING SAME

2y 3m to grant Granted Jun 30, 2026

17/686,558

Patent 12588546

Semiconductor Device Comprising a Semiconductor Die and a Carrier both Covered by a Parylene Coating

4y 0m to grant Granted Mar 24, 2026

Study what changed to get past this examiner. Based on 5 most recent grants.

Strategy Recommendation AI-generated — please review before filing

Get a prosecution strategy drawn from examiner precedents, rejection analysis, and claim mapping.

Typically takes 5-10 seconds — AI-generated, attorney review required before filing

Prosecution Projections

3-4

Expected OA Rounds

65%

Grant Probability

80%

With Interview (+15.2%)

3y 4m (~0m remaining)

Median Time to Grant

Moderate

PTA Risk

Based on 79 resolved cases by this examiner. Grant probability derived from career allowance rate.