Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2811 2815 2817 2829 2845 2893 2898 2899
This examiner grants 66% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18652000 | BEOL FABRICATION METHOD INCLUDING REMOVING DUMMY LINES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18435168 | INTEGRATED CIRCUIT DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18000794 | SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR STORAGE DEVICE | Final Rejection | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18527430 | DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 17931306 | SEMICONDUCTOR DEVICE | Final Rejection | KABUSHIKI KAISHA TOSHIBA |
| 18467961 | SEMICONDUCTOR ELEMENTS WITH FIELD SHIELDING BY POLARIZATION DOPING | Final Rejection | Robert Bosch GmbH |
| 18420678 | LIGHT EMITTING DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18189940 | MOTHER SUBSTRATE INCLUDING A PLURALITY OF DISPLAY DEVICE AND METHOD FOR FABRICATING DISPLAY DEVICE | Final Rejection | Samsung Display Co., LTD. |
| 17751025 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE DISPLAY DEVICE | Final Rejection | Samsung Display Co., LTD. |
| 17076870 | APPLICATION OF SELF-ASSEMBLED MONOLAYERS FOR IMPROVED VIA INTEGRATION | Final Rejection | Intel NDTM US LLC |
| 18561435 | ELECTRONIC COMPONENT | Final Rejection | TDK CORPORATION |
| 17673728 | SEMICONDUCTOR PACKAGE STRUCTURE WITH MULTIPLE WAVEGUIDES | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18510630 | SELECTIVE FEATURE MODIFICATION USING DIRECTIONAL DEPOSITION | Non-Final OA | Applied Materials, Inc. |
| 18370536 | IN-SITU SIDEWALL PASSIVATION TOWARD THE BOTTOM OF HIGH ASPECT RATIO FEATURES | Final Rejection | Applied Materials, Inc. |
| 18402618 | MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED MEMORY DEVICES AND ELECTRONIC SYSTEMS | Final Rejection | Lodestar Licensing Group LLC |
| 18612001 | WIRING STRATEGY FOR STACK FET S/D CONTACTS | Non-Final OA | International Business Machines Corporation |
| 18588760 | STAGGERED THREE-DIMENSIONAL CHIP STACKING | Non-Final OA | International Business Machines Corporation |
| 18832418 | METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT AND OPTOELECTRONIC COMPONENT | Non-Final OA | AMS-OSRAM INTERNATIONAL GMBH |
| 18520946 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | NANYA TECHNOLOGY CORPORATION |
| 17736071 | TRANSISTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | Final Rejection | United Microelectronics Corp. |
| 17731853 | NANOWIRE/NANOSHEET DEVICE WITH SUPPORT PORTION, METHOD OF MANUFACTURING THE SAME AND ELECTRONIC APPARATUS | Final Rejection | INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES |
| 18512837 | FULL-COLOR LED STRUCTURE AND PREPARATION METHOD OF FULL-COLOR LED STRUCTURE | Non-Final OA | Enkris Semiconductor, Inc. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy