Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2811 2815 2817 2829 2845 2893 2898 2899
This examiner grants 64% of resolved cases
Sue A. Purvis is an examiner in Tech Center 2800 and Art Unit 2800. She has handled 89 resolved cases. Her allowance rate is 64.0 percent, which indicates that a majority of applications in her docket reach a grant. This rate provides a clear baseline for applicants.
The interview lift is 11.8 percent. This suggests that conducting an interview is a productive strategy for increasing the likelihood of a grant. The 11.8 percent lift provides a meaningful boost to the allowance rate, making it a recommended tactic for practitioners.
The median days to allowance is 1244. This timeframe is the typical duration for successful applications in her docket. With 89 resolved cases, the data is statistically significant. The 1244-day median and 64.0 percent allowance rate suggest a standard and predictable prosecution path.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18189940 | MOTHER SUBSTRATE INCLUDING A PLURALITY OF DISPLAY DEVICE AND METHOD FOR FABRICATING DISPLAY DEVICE | Final Rejection | Samsung Display Co., LTD. |
| 17990333 | MULTI-LAYERED OXIDE BASED FLASH MEMORY DEVICE USED FOR NEUROMORPHIC COMPUTING SYSTEM | Final Rejection | KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY |
| 18527430 | DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18467961 | SEMICONDUCTOR ELEMENTS WITH FIELD SHIELDING BY POLARIZATION DOPING | Final Rejection | Robert Bosch GmbH |
| 17853487 | EDGE DELAMINATION AND CRACK PREVENTION METHODS FOR SINX AND TI-CU ENABLED PACKAGES | Final Rejection | Intel Corporation |
| 17644802 | Semiconductor Die, Heat Spreader, Semiconductor Package, Semiconductor Device, and Methods | Final Rejection | Intel Corporation |
| 17345969 | SELECTIVE ROUTING THROUGH INTRA-CONNECT BRIDGE DIES | Final Rejection | INTEL CORPORATION |
| 18000794 | SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR STORAGE DEVICE | Final Rejection | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18612001 | WIRING STRATEGY FOR STACK FET S/D CONTACTS | Non-Final OA | International Business Machines Corporation |
| 18402618 | MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED MEMORY DEVICES AND ELECTRONIC SYSTEMS | Final Rejection | Lodestar Licensing Group LLC |
| 18176474 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR STORAGE DEVICE | Non-Final OA | Kioxia Corporation |
| 18103698 | SEMICONDUCTOR PACKAGE INCLUDING BALL GRID ARRAY CONNECTIONS WITH IMPROVED RELIABILITY | Non-Final OA | Taiwan Semiconductor Manufacturing Company |
| 18643137 | SELECTIVE PLASMA ASSISTED DEPOSITION OF A MOLYBDENUM SILICIDE | Non-Final OA | Applied Materials, Inc. |
| 18370536 | IN-SITU SIDEWALL PASSIVATION TOWARD THE BOTTOM OF HIGH ASPECT RATIO FEATURES | Final Rejection | Applied Materials, Inc. |
| 18561435 | ELECTRONIC COMPONENT | Final Rejection | TDK CORPORATION |
| 18619594 | ELECTRONIC DEVICE INCLUDING A POLYMER SUPPORT LAYER | Final Rejection | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18185548 | EDGE SEALS FOR SEMICONDUCTOR DEVICES | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18714370 | SYSTEM-IN-PACKAGE ASSEMBLY, AND PACKAGING METHOD AND MANUFACTURING METHOD THEREFOR | Non-Final OA | SPREADTRUM COMMUNICATIONS (SHANGHAI) CO., LTD. |
| 18512837 | FULL-COLOR LED STRUCTURE AND PREPARATION METHOD OF FULL-COLOR LED STRUCTURE | Final Rejection | Enkris Semiconductor, Inc. |
| 17731853 | NANOWIRE/NANOSHEET DEVICE WITH SUPPORT PORTION, METHOD OF MANUFACTURING THE SAME AND ELECTRONIC APPARATUS | Final Rejection | INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES |
| 18591815 | POWER MODULE WITH IMPROVED SEMICONDUCTOR DIE ARRANGEMENT FOR ACTIVE CLAMPING | Non-Final OA | Littelfuse Semiconductor (Wuxi) Co., Ltd. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy