DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Response to Arguments
The amendments to the claims and specification necessitated the new rejections and objections recited below. The examiner notes that the term processor is now recited in the claims. The limitations associated with the processor as written are interpreted as a matter of an intended us or that the processor of the prior art need be merely capable of performing the recited functions. If the processor of the prior art is required to perform the functions then the claim limitations where the processor is recited must be followed with the processor is configured to perform the functions. It is noted that the examiner contacted applicant in an interview to inquire about permission to make an examiner amendment to insert the claim language for the processor, but after reviewing the amended specification. It was decided to hold the examiner’s amendment in abeyance so that applicant could amend the processor language along with the other amendments as necessary after receipt of this action.
The amendments to the claims has necessitated the withdrawal of the double patenting rejections.
Applicant’s assertion that the back pressure adjuster adjusts the pressure of the gas and the second pressure adjuster pressurizes the etching chamber and the etchant supply part see the remarks page 13 second full paragraph. These arguments necessitated the reevaluation of the prior art of Tanaka et al (US 6,186,171).
Drawings
The drawings are objected to under 37 CFR 1.83(a). The drawings must show every feature of the invention specified in the claims. Therefore, the back pressure adjuster, etchant supply part and third pressure adjuster must be shown or the feature(s) canceled from the claim(s). No new matter should be entered.
The amended specification (dated December 5, 2025) on page 10 lines 3-7 refer to Figs. 4A and 4B but the drawings only recite Fig. 4.
Etchant supply part 112 is shown in Fig. 5, but is not illustrated in Figures 1, 2, and 4. It is noted that the specification recites that the etchant supply part is element 112 while the etchant pump is element 120.
The specification recites pipes 161, 162 in page 8 lines 11-15 as part of the second pressure adjusting unit 160, but does not illustrate pipes 161 and 162 in the Figures.
It is also noted that third pressure adjuster 170 is not shown in Fig. 4.
Corrected drawing sheets in compliance with 37 CFR 1.121(d) are required in reply to the Office action to avoid abandonment of the application. Any amended replacement drawing sheet should include all of the figures appearing on the immediate prior version of the sheet, even if only one figure is being amended. The figure or figure number of an amended drawing should not be labeled as “amended.” If a drawing figure is to be canceled, the appropriate figure must be removed from the replacement sheet, and where necessary, the remaining figures must be renumbered and appropriate changes made to the brief description of the several views of the drawings for consistency. Additional replacement sheets may be necessary to show the renumbering of the remaining figures. Each drawing sheet submitted after the filing date of an application must be labeled in the top margin as either “Replacement Sheet” or “New Sheet” pursuant to 37 CFR 1.121(d). If the changes are not accepted by the examiner, the applicant will be notified and informed of any required corrective action in the next Office action. The objection to the drawings will not be held in abeyance.
Claim Objections
Claims 1-9 are objected to because of the following informalities:
The etchant supply part collects the etchant from the etching chamber instead of in the etching chamber. This suggested language clarifies that the etchant supply part ensures the circulation of the etchant (from and to the etching chamber). Appropriate correction is required.
Claim Interpretation
The terms first pressure adjusting unit, second pressure adjusting unit, and third pressure adjusting unit are no longer interpreted under 35 USC 112 ¶ f (means plus function) as the terms were amended to first pressure adjuster, second pressure adjuster, and third pressure adjuster respectively.
First pressure adjuster is recited in claims 1-9 and is recited as first pressure adjusting unit in the amended specification, (see page 7 line 21, page 9 lines 7 and 14, page 10 lines 12, 14, and 21) dated December 5, 2025 as element 150 and is illustrated in Figs. 1,2, and 4. See Fig. 4 where element 150 is illustrated as a valve.
Second pressure adjuster is recited in claims 1-9 and is recited in the specification amended December 5, 2025, as second pressure adjusting unit 160 (see page 7 line 22, page 8 line 11, page 9 lines 7 and 14, page 10 lines 12, 14, and 21, page 11 line 17). Based on the recitations and the illustration of the second pressure adjuster adjust pressure through pipes 161, 162 in page 8 lines 11-15 and/or pipe 161 (page 11 lines 17-19), the second pressure adjuster is interpreted as a valve, switches, a flow rate controller/flow regulator, pressure regulator, or any structure that can perform the function of pressurizing the etching chamber.
Third pressure adjuster is recited in claims 6 and 7 and is recited in the specification amended December 5, 2025, as third pressure adjusting unit 170 on page 10 line 19 and page 11 line 19. Based on the recitations and the illustration of the third pressure adjuster is interpreted as interpreted as a valve, switches, a flow rate controller/flow regulator, pressure regulator, or any structure that can perform the function of independently applying a pressure to the back pressure adjuster.
The term processor is recited in claims 1-9 and according to the amended specification page 15 lines 11-15 is a computer, microprocessor, and integrated circuit, and a logic device capable of being programmed.
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claims 1-9 are rejected under 35 U.S.C. 102 (a)(1) as being anticipated by Tanaka et al (US 6,186,171).
Regarding claim 1. Tanaka et al teaches an etching apparatus comprising: a processor (CPU 90) an etching chamber (inner tank 21) in which a target object (wafer W) is etched by an etchant; an etchant supply part (outer tank 22 and drain pipe 24) which collects the etchant in the etching chamber 21 and supplies the etchant to the etching chamber using an etchant pump, (circulating pump P1/26); a first pressure adjuster (check valve 80) configured via processor 90 to inject a gas into the etchant pump (circulating pump P1/26) to apply an operation pressure; a second pressure adjuster (valve 25) configured via processor 90 to pressurize the etching chamber and the etchant supply part at the same predetermined pressure; a back pressure adjuster (air adjustment means 50 = 51A and 52A) configured via processor 90 to adjust a pressure of the gas discharged when the etchant pump operates; and a valve (check valve 80) configured via processor 90 to control an order and a direction in which the gas is injected into or discharged from the etchant pump P1. See Fig. 2 below of Tanaka et al.
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Regarding claim 2. The etching apparatus of claim 1, further comprising the processor (CPU 90) is configured to selectively control one or more among the first pressure adjuster 80, the second pressure adjuster (valve 25), the valve 80, etchant pump (circulation pump P1/26), and the back pressure adjuster (air adjustment means 50 = 51A and 52A) to perform an etching process. See paragraph that joins columns 5 and 6 of Tanaka et al.
Regarding claim 3. The etching apparatus of claim 1, wherein a second pipe 41b branched off from a pipe 41a connected from the second pressure adjuster (valve 25) to an etching part including the etching chamber (inner tank 21) and the etchant supply part (outer tank 22 and drain pipe 24) is connected to the back pressure adjuster (air adjustment means 50 = 51A and 52A). See Figs. 2 and 3 of Tanaka et al.
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Regarding claim 4. The etching apparatus of claim 3, wherein the same pressure as the pressure applied to the etching part (etching chamber/inner tank 21) and the etchant supply part (outer tank 22 and drain pipe 24) through the second pressure adjuster (valve 25) is applied to the back pressure adjuster (air adjustment means 50 = 51A and 52A) through the second pipe 41b. The prior art of Tanaka et al is inherently capable of achieving this process parameter via the combined use of the valves, CPU, and pumps recited in the apparatus. See col. 6 lines 8-26 and lines 45-58 of Tanaka et al.
Regarding claim 5. The etching apparatus of claim 2, wherein the processor (CPU 90) controls the first pressure adjuster (check valve 80) to apply a pressure greater than the pressure applied to the back pressure adjuster (air adjustment means 50 = 51A and 52A) to the etchant pump 26. See Fig. 2 above of Tanaka et al.
Regarding claim 6. The etching apparatus of claim 2, further comprising a third pressure adjuster (air pressure adjustment means 51B and 51C) which independently applies a pressure to the back pressure adjuster (air adjustment means 50 = 51A and 52A), wherein the processor (CPU 90) controls the third pressure adjuster (air pressure adjustment means 51B and 51C) apply the same pressure as the pressure applied to the etching part through the second pressure adjuster (valve 25) to the back pressure adjuster (air adjustment means 50 = 51A and 52A). See Fig. 2 above of Tanaka et al.
Regarding claim 7. The etching apparatus of claim 6, wherein the processor (control unit (CPU 90)) controls the first pressure adjuster 80 to apply a pressure greater than the pressure applied from the second pressure adjuster (valve 25) or the third pressure adjuster (check valve 80). See Fig. 2 above of Tanaka et al.
Regarding claim 8. The etching apparatus of claim 1, wherein: discharging pipes of the gas discharged through different paths (see 41b, and 41c) from the etchant pump 26 through the valve are merged into one pipe; and one back pressure adjuster (air adjustment means 50 = 51A and 52A) is formed in the one pipe formed by merging the discharging pipes of the gas. See Figs. 2 and 3 (both above) of Tanaka et al.
Regarding claim 9. The etching apparatus of claim 1, wherein the etchant supply part (outer tank 22 and drain pipe 24) collects the etchant in the etching chamber (inner tank 21) in a natural drainage manner through gravity. See Fig. 2 of Tanaka et al.
Conclusion
The prior art made of record and not relied upon is considered pertinent to applicant's disclosure.
Campion et al (US 2014/0290090) teaches a drying chamber with several valves and pumps that adjust pressures.
Shi et al (US 2005/0020089) teaches an etching chamber with a circulation pump 108 with several valves that regulate the flow of processing fluids.
Any inquiry concerning this communication or earlier communications from the examiner should be directed to SYLVIA MACARTHUR whose telephone number is (571)272-1438. The examiner can normally be reached M-F 8:30-5 pm.
Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice.
If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Parviz Hassanzadeh can be reached at 571-272-1435. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
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/SYLVIA MACARTHUR/Primary Examiner, Art Unit 1716