Tech Center 2800 • Art Units: 1713 1716 1718 1792 2899
This examiner grants 66% of resolved cases
Sylvia MacArthur serves as an examiner in Tech Center 2800 and Art Unit 1713. The examiner has 969 resolved cases on record. The allowance rate for these 969 resolved cases is 65.7 percent. This 65.7 percent rate suggests a moderate likelihood of success for patent applications in Art Unit 1713. The median days to allowance for this examiner is 1332, which is the typical time for reaching a grant.
The interview lift is 25.9 percent. This 25.9 percent lift indicates that conducting an interview provides a positive increase in the probability of allowance. For practitioners, this lift suggests that direct communication with the examiner in Tech Center 2800 can be a helpful step in the prosecution process. The 1332 median days to allowance helps applicants plan their timelines effectively.
With 969 resolved cases, the data provides a solid foundation for predicting future outcomes. The 65.7 percent allowance rate and the 25.9 percent interview lift are key indicators for practitioners. Using the 1332-day median, applicants can set realistic expectations for the time required to secure a patent. These figures offer a comprehensive view of the examiner's performance in Art Unit 1713.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18538419 | INTERNAL PRESSURE CONTROL APPARATUS AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18423577 | TOOLS AND METHODS FOR SUBTRACTIVE METAL PATTERNING | Non-Final OA | Intel Corporation |
| 17790009 | MIXED METAL BASEPLATES FOR IMPROVED THERMAL EXPANSION MATCHING WITH THERMAL OXIDE SPRAYCOAT | Final Rejection | LAM RESEARCH CORPORATION |
| 18663606 | HEAT CLEANING SYSTEM AND METHOD FOR CMP PAD BY-PRODUCT CONTROL | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18667673 | POLISHING APPARATUS | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18209649 | SUBSTRATE SUPPORT | Non-Final OA | Applied Materials, Inc. |
| 18139057 | ORIFICE SURROUNDED LOW PRESSURE HYDROXYL COMBUSTION | Non-Final OA | Applied Materials, Inc. |
| 17786520 | SURFACE PROFILING AND TEXTURING OF CHAMBER COMPONENTS | Final Rejection | APPLIED MATERIALS, INC. |
| 18958534 | SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD | Non-Final OA | Tokyo Electron Limited |
| 18663644 | SUBSTRATE PROCESSING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18392102 | SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS | Final Rejection | Tokyo Electron Limited |
| 18483608 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE GRIPPING DEVICE | Non-Final OA | Tokyo Electron Limited |
| 18552108 | SUBSTRATE LIQUID-TREATMENT DEVICE | Final Rejection | Tokyo Electron Limited |
| 18540731 | SUBSTRATE TREATMENT APPARATUS AND PLASMA DENSITY CONTROL METHOD | Non-Final OA | SEMES CO., LTD. |
| 18469755 | APPARATUS FOR TREATING SUBSTRATE | Final Rejection | SEMES CO., LTD. |
| 18200017 | CHAMBER INSULATION PLATE AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME | Non-Final OA | SEMES CO., LTD. |
| 17979149 | DETECTING UNIT AND SUBSTRATE TREATING APPARATUS INCLUDING THE SAME | Non-Final OA | SEMES CO., LTD. |
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