Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
DETAILED ACTION
This action is responsive to the application No. 17/895,916 filed on 08/25/2022.
Election/Restrictions
Applicant’s election without traverse of Group I (claims 1-10) in the reply filed on 12/01/2025 is acknowledged.
Information Disclosure Statement
Acknowledgment is made of Applicant’s Information Disclosure Statement (IDS) form PTO-1449. These IDS has been considered.
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claims 1 and 7-10 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by US Pub # 2020/0154566 to Iwai et al. (Iwai).
Regarding independent claim 1, Iwai discloses a package substrate (Fig. 7: 500), comprising:
a core (Fig. 7: 11), wherein the core comprises glass (¶0033);
a first layer (41) under the core (11);
a second layer (40) over the core (11);
a via (51) through the core (11), the first layer (41), and the second layer (40), wherein a width of the via (51) through the core (11) is equal to a width of the via (51) through the first layer (41) and the second layer (40);
a first pad (34) under the via (51); and
a second pad (24) over the via (51).
Regarding claim 7, Iwai discloses comprising:
a first buildup layer (Fig. 7: 31) under the first layer (41); and
a second buildup layer (Fig. 7: 21) over the second layer (40).
Regarding claim 8, Iwai discloses wherein the first pad (34) is in the first buildup layer (31), and wherein the second pad (24) is in the second buildup layer (21).
Regarding claim 9, Iwai discloses wherein a width of the first pad (34) and the second pad (24) is greater than a width of the via (51) through the first layer (41) and the second layer (40).
Regarding claim 10, Iwai discloses wherein a centerline of a portion of the via (Fig. 7: 51) through the core (11) is aligned with a centerline of the via (51) through the first layer (41) and the second layer (40) (See Examiner’s Mark-up below).
PNG
media_image1.png
597
873
media_image1.png
Greyscale
Claim Rejections - 35 USC § 103
The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action:
A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made.
The factual inquiries for establishing a background for determining obviousness under 35 U.S.C. 103 are summarized as follows:
1. Determining the scope and contents of the prior art.
2. Ascertaining the differences between the prior art and the claims at issue.
3. Resolving the level of ordinary skill in the pertinent art.
4. Considering objective evidence present in the application indicating obviousness or nonobviousness.
Claim 2 is rejected under 35 U.S.C. 103 as being unpatentable over Iwai in view of US Pub # 2022/0192017 to Ko.
Regarding claim 2, Iwai disclose all of the limitations of claim 1 from which this claim depends.
Iwai fails to explicitly disclose wherein the first layer and the second layer comprise a photoimageable dielectric (PID).
Ko discloses wherein the first layer (Fig. 4A: 12) and the second layer (12) comprise a photoimageable dielectric (PID).
It would have been obvious to a person having ordinary skill in the art before the effective filing date of the invention to have provided the dielectric layer of Iwai with the material of the dielectric layer as taught by Ko in order to transmit signal (¶36), as PID materials were well known for use in package substrate build-up layers at the time of the invention.
Claim 3 is rejected under 35 U.S.C. 103 as being unpatentable over Iwai in view of US Pub # 2022/0093517 to Aleksov et al. (Aleksov).
Regarding claim 3, Iwai disclose all of the limitations of claim 1 from which this claim depends.
Iwai fails to explicitly disclose wherein the first layer and the second layer comprise silicon and nitrogen.
Aleksov discloses wherein the first layer and the second layer (Fig. 44: 108) comprise silicon and nitrogen.
It would have been obvious to a person having ordinary skill in the art before the effective filing date of the invention to have provided the dielectric layer of Iwai with the material of the dielectric layer as taught by Aleksov in order to improve the strength of the mechanical interface (¶0047).
Claim 4 is rejected under 35 U.S.C. 103 as being unpatentable over Iwai in view of US Pub # 2020/0273763 to Tsuchida.
Regarding claim 4, Iwai disclose all of the limitations of claim 1 from which this claim depends.
Iwai fails to explicitly disclose wherein the first layer and the second layer comprise titanium and nitrogen.
Tsuchida disclose wherein the first layer and the second layer comprise titanium and nitrogen (Fig. 2: 20).
It would have been obvious to a person having ordinary skill in the art before the effective filing date of the invention to have provided the dielectric layer of Iwai with the material of the dielectric layer as taught by Tsuchida in order to enhance the adhesion with the glass plate (¶0062).
Claims 5-6 are rejected under 35 U.S.C. 103 as being unpatentable over Iwai in view of US Pub # 2023/0207332 to Strong et al. (Strong).
Regarding claim 5, Iwai disclose all of the limitations of claim 1 from which this claim depends.
Iwai fails to explicitly disclose wherein the via comprises an hourglass shaped cross-section through the core.
Strong discloses wherein the via (Fig. 4A: 417) comprises an hourglass shaped cross-section (¶0036) through the core (¶410).
It would have been obvious to a person having ordinary skill in the art before the effective filing date of the invention to have provided the via of Iwai with the hourglass shaped cross-section as taught by Strong in order to increase pad to via contact area, relieve stress within the core material.
Regarding claim 6, Iwai discloses wherein the via (51) comprises rectangular cross- sections (Fig. 7) through the first layer (41) and the second layer (40).
Conclusion
The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. US Pub # 2005/0064707 to Sinha, US Pub # 2005/0150683 to Farnworth et al., US Pub # 2005/0230835 to Sunohara et al., US Pub # 2007/0044999 to Shibata et al., US Pub # 2013/0240259 to Yoshimura and US Pub # 2016/0111380 to Sundaram et al.
Any inquiry concerning this communication or earlier communications from the examiner should be directed to MOHSEN AHMADI whose telephone number is (571)272-5062. The examiner can normally be reached M-F: 9:00am-5:00pm.
Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice.
If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, William F Kraig can be reached at 571-272-8660. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000.
/MOHSEN AHMADI/Primary Examiner, Art Unit 2896
Prosecution Insights