Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812 2819 2896
This examiner grants 86% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18242359 | DISPLAY DEVICE | Final Rejection | LG Display Co., Ltd. |
| 17749311 | POWER MODULE INTEGRATED CIRCUIT PACKAGE | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18472350 | SEMICONDUCTOR DEVICE | Non-Final OA | DENSO CORPORATION |
| 18114106 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18379928 | INTERFACIAL LAYER SCALING PROCESSES FOR SEMICONDUCTOR DEVICES | Non-Final OA | Applied Materials, Inc. |
| 17895916 | THROUGH GLASS VIAS (TGVS) IN GLASS CORE SUBSTRATES | Non-Final OA | Intel Corporation |
| 18461086 | SEMICONDUCTOR DEVICE INCLUDING HYDROGEN INTRODUCTION LAYER PROVIDED ON SEMICONDUCTOR SUBSTRATE AND METHOD OF FORMING THE SAME | Non-Final OA | Micron Technology, Inc. |
| 18391351 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING SAME | Non-Final OA | ROHM CO., LTD. |
| 17909813 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | Final Rejection | ROHM CO., LTD. |
| 18171282 | DISPLAY DEVICES WITH STRAY LIGHT PREVENTION MECHANISMS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18472312 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | MIRISE Technologies Corporation |
| 18350474 | PACKAGING STRUCTURE AND METHOD OF A PHOTOSENSITIVE MODULE | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18073356 | SEMICONDUCTOR DEVICE | Final Rejection | WILL SEMICONDUCTOR (SHANGHAI) CO. LTD. |
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