Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812 2819 2896
This examiner grants 87% of resolved cases
Mohsen Ahmadi is an examiner in Tech Center 2800 and Art Unit 2812, with 468 resolved cases. The examiner maintains an allowance rate of 86.8%, which indicates a high likelihood of success for the 468 cases in his record. This 86.8% rate suggests that a large majority of applications reaching a final resolution result in an allowance. This provides a positive signal for practitioners filing in this specific art unit. The volume of 468 cases offers a reliable basis for these metrics.
The interview lift is 9.7%, suggesting that conducting an interview has a modest but clear positive impact on the probability of allowance. This 9.7% lift indicates that direct communication can be a helpful tool for advancing prosecution. The median days to allowance is 831, establishing a clear timeframe for successful prosecution. With a median of 831 days, applicants can anticipate a relatively efficient duration for the 86.8% of cases that are allowed. This 831-day figure is a key data point for planning.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18630248 | INTEGRATED CIRCUITS HAVING HIGHLY COMPACT DEVICES THEREIN, AND MEMORY DEVICES USING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18745977 | DISPLAY DEVICE | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18676612 | SEMICONDUCTOR COMPONENT AND ELECTRONIC DEVICE | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 18061237 | INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) | Final Rejection | Intel Corporation |
| 18660895 | SEMICONDUCTOR STRUCTURES AND FABRICATING METHODS THEREOF | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18547344 | SEMICONDUCTOR SUBSTRATE, MANUFACTURING METHOD FOR SEMICONDUCTOR SUBSTRATE, AND ELECTRONIC DEVICE HAVING SEMICONDUCTOR SUBSTRATE | Final Rejection | SONY GROUP CORPORATION |
| 18833836 | OPTOELECTRONIC SEMICONDUCTOR COMPONENT, CONVERSION ELEMENT AND MANUFACTURING METHOD | Non-Final OA | AMS-OSRAM INTERNATIONAL GMBH |
| 18420121 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING AN ELECTRICALLY INSULATING STRUCTURE IN A TRENCH | Non-Final OA | Infineon Technologies Austria AG |
| 18401185 | 3D CHIPLET INTEGRATION USING FAN-OUT WAFER-LEVEL PACKAGING | Non-Final OA | Meta Platforms Technologies, LLC |
| 18582902 | CHIP-TO-CHIP INTERCONNECT DESIGN | Non-Final OA | NVIDIA CORPORATION |
| 18461086 | SEMICONDUCTOR DEVICE INCLUDING HYDROGEN INTRODUCTION LAYER PROVIDED ON SEMICONDUCTOR SUBSTRATE AND METHOD OF FORMING THE SAME | Final Rejection | Micron Technology, Inc. |
| 18641017 | SEMICONDUCTOR DEVICE WITH HEAT DISSIPATION LAYER AND METHOD OF FABRICATING THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18391914 | SEMICONDUCTOR DEVICE AND POWER AMPLIFIER INCLUDING THE SAME | Non-Final OA | Samsung Electro-Mechanics Co., Ltd. |
| 18379928 | INTERFACIAL LAYER SCALING PROCESSES FOR SEMICONDUCTOR DEVICES | Non-Final OA | Applied Materials, Inc. |
| 18404200 | SEMICONDUCTOR LIGHT-EMITTING DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18660465 | STACKED MICRO-DISPLAY STRUCTURE AND MANUFACTURING PROCESS THEREFOR | Non-Final OA | SEMICONDUCTOR INTEGRATED DISPLAY TECHNOLOGY CO., LTD. |
| 18350474 | PACKAGING STRUCTURE AND METHOD OF A PHOTOSENSITIVE MODULE | Final Rejection | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18604947 | ISOLATION STRUCTURE FOR MULTI-VOLTAGE INTEGRATED CIRCUIT | Non-Final OA | GlobalFoundries U.S. Inc. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy