Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812 2819 2896
This examiner grants 87% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18547344 | SEMICONDUCTOR SUBSTRATE, MANUFACTURING METHOD FOR SEMICONDUCTOR SUBSTRATE, AND ELECTRONIC DEVICE HAVING SEMICONDUCTOR SUBSTRATE | Final Rejection | SONY GROUP CORPORATION |
| 18676612 | SEMICONDUCTOR COMPONENT AND ELECTRONIC DEVICE | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 18745977 | DISPLAY DEVICE | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18061237 | INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) | Final Rejection | Intel Corporation |
| 18401185 | 3D CHIPLET INTEGRATION USING FAN-OUT WAFER-LEVEL PACKAGING | Non-Final OA | Meta Platforms Technologies, LLC |
| 18660895 | SEMICONDUCTOR STRUCTURES AND FABRICATING METHODS THEREOF | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18678538 | Semiconductor Device | Non-Final OA | Semiconductor Energy Laboratory Co., Ltd. |
| 18461086 | SEMICONDUCTOR DEVICE INCLUDING HYDROGEN INTRODUCTION LAYER PROVIDED ON SEMICONDUCTOR SUBSTRATE AND METHOD OF FORMING THE SAME | Final Rejection | Micron Technology, Inc. |
| 18491207 | DEVICES AND METHODS FOR FORMING DEVICES WITH LIDS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18472695 | Corner Reinforcement Structure for Package Interconnect | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18391914 | SEMICONDUCTOR DEVICE AND POWER AMPLIFIER INCLUDING THE SAME | Non-Final OA | Samsung Electro-Mechanics Co., Ltd. |
| 18379928 | INTERFACIAL LAYER SCALING PROCESSES FOR SEMICONDUCTOR DEVICES | Final Rejection | Applied Materials, Inc. |
| 18582902 | CHIP-TO-CHIP INTERCONNECT DESIGN | Non-Final OA | NVIDIA CORPORATION |
| 18676545 | SEMICONDUCTOR DEVICE WITH AN ACTIVE DEVICE REGION AND A CURRENT SENSOR REGION | Non-Final OA | Infineon Technologies Austria AG |
| 18420121 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING AN ELECTRICALLY INSULATING STRUCTURE IN A TRENCH | Non-Final OA | Infineon Technologies Austria AG |
| 18833836 | OPTOELECTRONIC SEMICONDUCTOR COMPONENT, CONVERSION ELEMENT AND MANUFACTURING METHOD | Non-Final OA | AMS-OSRAM INTERNATIONAL GMBH |
| 18585414 | PACKAGE STRUCTURE | Non-Final OA | Richtek Technology Corporation |
| 18350474 | PACKAGING STRUCTURE AND METHOD OF A PHOTOSENSITIVE MODULE | Final Rejection | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18604947 | ISOLATION STRUCTURE FOR MULTI-VOLTAGE INTEGRATED CIRCUIT | Non-Final OA | GlobalFoundries U.S. Inc. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy