Prosecution Insights
Last updated: April 18, 2026
Application No. 17/913,016

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, AND METHOD FOR PRODUCING WIRING BOARD

Non-Final OA §102§103
Filed
Sep 20, 2022
Examiner
CHU, JOHN S Y
Art Unit
1737
Tech Center
1700 — Chemical & Materials Engineering
Assignee
Showa Denko Materials Co. Ltd.
OA Round
3 (Non-Final)
77%
Grant Probability
Favorable
3-4
OA Rounds
3y 1m
To Grant
82%
With Interview

Examiner Intelligence

Grants 77% — above average
77%
Career Allow Rate
740 granted / 959 resolved
+12.2% vs TC avg
Moderate +5% lift
Without
With
+5.1%
Interview Lift
resolved cases with interview
Typical timeline
3y 1m
Avg Prosecution
65 currently pending
Career history
1024
Total Applications
across all art units

Statute-Specific Performance

§101
0.2%
-39.8% vs TC avg
§103
48.2%
+8.2% vs TC avg
§102
29.9%
-10.1% vs TC avg
§112
12.1%
-27.9% vs TC avg
Black line = Tech Center average estimate • Based on career data from 959 resolved cases

Office Action

§102 §103
DETAILED CORRESPONDENCE This Office action is in response to the amendment received March 31, 2026. Any bold text is new language in the office action. Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale or otherwise available to the public before the effective filing date of the claimed invention. (a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention. Claim Rejections - 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. The factual inquiries set forth in Graham v. John Deere Co., 383 U.S. 1, 148 USPQ 459 (1966), that are applied for establishing a background for determining obviousness under 35 U.S.C. 103 are summarized as follows: 1. Determining the scope and contents of the prior art. 2. Ascertaining the differences between the prior art and the claims at issue. 3. Resolving the level of ordinary skill in the pertinent art. 4. Considering objective evidence present in the application indicating obviousness or nonobviousness. Claims 1-13 are rejected under 35 U.S.C. 103 as being unpatentable over OKADE et al (10,104,781) in view of GOTO et al (2018/0364566), ITO et al (2015/0219993), HATA et al (2009/0233230) and KUBOTA et al (2013/0334461) and KUBOTA (2015/0227042). The claimed invention now recites the following: PNG media_image1.png 370 678 media_image1.png Greyscale OKADE et al report a photosensitive resin composition for circuit board comprising a hydroxymethyl methacrylate/styrene copolymer wherein the content of the styrene is reported to be in an amount of 45 % and 50% by mass, a photopolymerization initiator, and a sensitizer that include an anthracene-based structure, see Example 1 for the binder polymer in column 22, lines 34-39, the photopolymerizable compound reported in column 23, lines 59-67, and a sensitizing dye including anthracene compounds in column 14, lines 5-8, see below: PNG media_image2.png 116 370 media_image2.png Greyscale PNG media_image3.png 162 378 media_image3.png Greyscale PNG media_image4.png 200 384 media_image4.png Greyscale PNG media_image5.png 152 392 media_image5.png Greyscale GOTO et al report sensitizers for photopolymerizable composition used in circuits, para. [0230] and. The composition contains a dibutoxyanthracene and thioxanthone based sensitizers, see para. [0145] below: PNG media_image6.png 148 370 media_image6.png Greyscale HATA et al report films comprising photopolymerizable monomers for wiring boards, wherein the photopolymerization monomer include 2,2 bis-{(4-methacryloxypolyethoxy) cyclohexyl} propane, see the structure on page 4 and para. [0055]. The composition has improved adhesion, sensitivity and resolution, see page 11, para. [0132] to [0153]. With respect to claim 11, HATA further disclose the use of polymerization inhibitor such as t-butylcatechol as reported in para. [0085], in an amount meeting new claims 11-13 see below: PNG media_image7.png 114 374 media_image7.png Greyscale PNG media_image8.png 118 368 media_image8.png Greyscale With respect to claim 12, KUBOTA et al report functionally equivalent sensitizers for photopolymerization composition in para. [0221] to include diphenyl anthracene thioxanthone, phenothiazines, and chlorothioxanthone which are also reported in GOTO et al para [0145] above, see para. [0221] below: PNG media_image9.png 240 372 media_image9.png Greyscale . With respect to new claim 13, OKADA et al report the following photopolymerizable compound in column 12, lines 10-44 such as trimethylolpropane tri(meth)acrylate, see below: PNG media_image10.png 564 380 media_image10.png Greyscale KUBOTA et al is cited to disclose the use of equivalent unsaturated compounds, see para [0077] and [0078] wherein either vinyl compound FA-023M and FA-024M can be used, see below. FA-024M is the commercial name for the newly amended compound in claim 1. PNG media_image11.png 162 380 media_image11.png Greyscale Claim 2-4 are met by OKUDE et al above in column 23, lines 59-67. Claim 5, report in column 10, lines 7-21 of OKADA et al structures having a value of 2 to 20 for m1, n2 and m2, and n2 in Chemical Formula (4a), meeting the oxyethylene group being less than 10 and 10 or more. Also see HATA et al page 3, para. [0023] in Formula (III). Claim 6 is met by the disclosed Mw in column 8, lines 27-40 wherein the most preferred range is 23,000 to 60,000, 25,000 or more. Claim 7 is met by column 14, lines 9-20 in OKADE et al. Claim 8 is reported in Example 1 of OKADE et al. The method of claims 9 and 10 are met by the method in column 25 to column 26 for the manufacture of photosensitive element and the evaluation of sensitivity and developability. It would have been prima facie obvious to one of ordinary skill in the art of photosensitive composition to duplicate Example 1 of OKADA et al adding a sensitive such as an anthracene base compound such as any of the sensitizing dyes like dibutoxyanthracene, as reported in GOTO et al with known photopolymerizable monomers as reported in OKADE et al and HATA et al with the reasonable expectation of same or similar results for high adhesion, sensitivity and resolution. And it would have been prima facie obvious to one of ordinary skill in the art of photosensitive compositions to use photopolymerization inhibitor such as t-butylcatechol, sensitizers such as 9,10-diphenylanthracene and photopolymerizable compounds like trimethylolpropane triacrylate with the reasonable expectation of same or similar results for high adhesion, sensitivity and resolution. And it would have been prima facie obvious to one of ordinary skill in the art of photosensitive compositions to use any of the equivalent polymerizable compounds such substituting FA-024M in for FA-023M in the composition of OKADA et al and reasonably expect same or similar results for high adhesion, sensitivity and resolution. Any inquiry concerning this communication or earlier communications from the examiner should be directed to JOHN S CHU whose telephone number is (571)272-1329. The examiner can normally be reached M-F, IFP-Flex. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Mark Huff, can be reached at telephone number 571-272-1385. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of an application may be obtained from the Patent Application Information Retrieval (PAIR) system. Status information for published applications may be obtained from either Private PAIR or Public PAIR. Status information for unpublished applications is available through Private PAIR only. For more information about the PAIR system, see http://portal.uspto.gov/external/portal. Should you have questions about access to the Private PAIR system, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. /John S. Chu/ Primary Examiner, Art Unit 1737 J. Chu April 4, 2026
Read full office action

Prosecution Timeline

Sep 20, 2022
Application Filed
Jun 25, 2025
Non-Final Rejection — §102, §103
Sep 19, 2025
Response Filed
Dec 03, 2025
Final Rejection — §102, §103
Feb 19, 2026
Examiner Interview Summary
Feb 19, 2026
Applicant Interview (Telephonic)
Mar 31, 2026
Request for Continued Examination
Apr 03, 2026
Response after Non-Final Action
Apr 04, 2026
Non-Final Rejection — §102, §103 (current)

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2y 5m to grant Granted Feb 10, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

3-4
Expected OA Rounds
77%
Grant Probability
82%
With Interview (+5.1%)
3y 1m
Median Time to Grant
High
PTA Risk
Based on 959 resolved cases by this examiner. Grant probability derived from career allow rate.

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