Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 1722 1737 1752 1795 2881
This examiner grants 77% of resolved cases
John S Y Chu works in Art Unit 1722 of Tech Center 2800 and has 981 resolved cases. The allowance rate is 76.8 percent. This percentage reflects the frequency of grants within the examiner's portfolio. The median days to allowance is 1075, which measures the time from the initial filing to the final issuance.
The interview lift is 5.4 percent. This figure indicates the increase in the probability of success for cases that include an interview. Practitioners can use this 5.4 percent lift to evaluate the impact of oral advocacy. The 981 cases provide a robust foundation for these observations in Art Unit 1722.
The 1075 median days to allowance acts as a guide for prosecution timelines in Tech Center 2800. With an allowance rate of 76.8 percent, the data shows the frequency of successful outcomes. These metrics offer a clear perspective on the examiner's historical performance. The record of resolved cases helps in understanding the procedural environment.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18377365 | PHOTORESIST COMPOSITION FOR EXTREME ULTRAVIOLET, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18212913 | PHOTORESIST COMPOSITION AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18098233 | PHOTOSENSITIVE POLYMER CAPABLE OF MULTI-STEP DEPROTECTION REACTION, PHOTORESIST COMPOSITION INCLUDING THE PHOTOSENSITIVE POLYMER, AND METHOD OF MANUFACTURING THE INTEGRATED CIRCUIT DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17938338 | PHOTORESIST COMPOSITIONS AND METHODS FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17909999 | NEGATIVE TYPE PHOTOSENSITIVE COMPOSITION COMPRISING REFLECTANCE MODIFIER | Non-Final OA | Merck Patent GmbH |
| 18214200 | PATTERN FORMING METHOD, METHOD FOR PRODUCING ELECTRONIC DEVICE, AND KIT | Non-Final OA | FUJIFILM Corporation |
| 18059198 | ON-PRESS DEVELOPMENT TYPE LITHOGRAPHIC PRINTING PLATE PRECURSOR, METHOD OF PREPARING LITHOGRAPHIC PRINTING PLATE, AND LITHOGRAPHIC PRINTING METHOD | Non-Final OA | FUJIFILM Corporation |
| 18059205 | LAMINATE | Non-Final OA | FUJIFILM Corporation |
| 17946148 | PHOTOSENSITIVE MATERIAL, TRANSFER FILM, MANUFACTURING METHOD OF CIRCUIT WIRING, MANUFACTURING METHOD OF TOUCH PANEL, AND PATTERN FORMING METHOD | Final Rejection | FUJIFILM Corporation |
| 17902404 | TRANSFER FILM, PHOTOSENSITIVE MATERIAL, PATTERN FORMING METHOD, MANUFACTURING METHOD OF CIRCUIT BOARD, AND MANUFACTURING METHOD OF TOUCH PANEL | Final Rejection | FUJIFILM Corporation |
| 17935185 | PHOTOSENSITIVE STRUCTURAL BODY AND METHOD OF PRODUCING THE PHOTOSENSITIVE STRUCTURAL BODY, AND INKJET RECORDING HEAD | Final Rejection | CANON KABUSHIKI KAISHA |
| 18291075 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | Non-Final OA | Resonac Corporation |
| 19070505 | SEMICONDUCTOR PHOTORESIST COMPOSITION, METHOD FOR PREPARING THEREOF AND METHOD OF FORMING PATTERNS USING THE COMPOSITION | Non-Final OA | SAMSUNG SDI CO., LTD. |
| 18379860 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING THE SAME AND COLOR FILTER | Final Rejection | SAMSUNG SDI CO., LTD. |
| 18244370 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING THE SAME, AND COLOR FILTER | Non-Final OA | SAMSUNG SDI CO., LTD. |
| 18479181 | SPIN-ON ADHESION PROMOTER COMPOSITION AND METHOD FOR HIGH NUMERICAL APERTURE EXTREME ULTRAVIOLET LITHOGRAPHY | Non-Final OA | International Business Machines Corporation |
| 18005594 | PHOTORESISTS FROM SN(II) PRECURSORS | Non-Final OA | Lam Research Corporation |
| 18782565 | RESIN, PHOTORESIST COMPOSITION, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18312199 | COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 17726036 | PHOTORESIST COMPOSITION WITH NOVEL SOLVENT | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18093537 | ADDITIVES FOR METALLIC PHOTORESIST | Non-Final OA | Taiwan Semiconductor Manufacturing Company |
| 17429015 | FLEXOGRAPHIC PRINTING RAW PLATE AND MANUFACTURING METHOD OF FLEXOGRAPHIC PRINTING PLATE | Non-Final OA | ASAHI KASEI KABUSHIKI KAISHA |
| 18379106 | EUV PHOTORESIST AND UNDERLAYER ADHESION MODULATION | Non-Final OA | Applied Materials, Inc. |
| 17950685 | HIGH RESOLUTION LATENT IMAGE PROCESSING, CONTRAST ENHANCEMENT AND THERMAL DEVELOPMENT | Non-Final OA | Tokyo Electron Limited |
| 18487617 | METHOD OF FORMING LINE PATTERN IN SEMICONDUCTOR DEVICE | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 17652515 | PHOTO-SENSITIVE COMPOSITION FOR INSULATING FILM FOR TOUCH PANEL OF ORGANIC LIGHT EMITTING DISPLAY DEVICE | Non-Final OA | DUK SAN NEOLUX CO., LTD. |
| 18256899 | RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN | Final Rejection | TOKYO OHKA KOGYO CO., LTD. |
| 17759396 | RESIST PATTERN FORMATION METHOD | Final Rejection | TOKYO OHKA KOGYO CO., LTD. |
| 17814718 | CONDUCTIVE COMPOSITE, RESIST COATING MATERIAL, RESIST, AND METHOD FOR FORMING RESIST PATTERN | Non-Final OA | Mitsubishi Chemical Corporation |
| 18404506 | ONIUM SALT, CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION, AND RESIST PATTERN FORMING PROCESS | Non-Final OA | Shin-Etsu Chemical Co., Ltd. |
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