Prosecution Insights
Prosecution Insights
Tech Center 1700 • Art Units: 1722 1737 1795
This examiner grants 77% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18153568 | COMPOSITION FOR DEVELOPING AND METHOD OF FORMING PATTERN USING THE SAME | Non-Final OA | Samsung Electronics Co, Ltd. |
| 17405138 | PHOTORESIST COMPOSITIONS, METHODS FOR FORMING PATTERN USING THE SAME, AND METHODS FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18742227 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | Final Rejection | ASAHI KASEI KABUSHIKI KAISHA |
| 17994766 | PHOTOSENSITIVE COMPOSITION, FILM, COLOR FILTER, SOLID-STATE IMAGING ELEMENT, AND IMAGE DISPLAY DEVICE | Non-Final OA | FUJIFILM Corporation |
| 17946148 | PHOTOSENSITIVE MATERIAL, TRANSFER FILM, MANUFACTURING METHOD OF CIRCUIT WIRING, MANUFACTURING METHOD OF TOUCH PANEL, AND PATTERN FORMING METHOD | Non-Final OA | FUJIFILM Corporation |
| 17814718 | CONDUCTIVE COMPOSITE, RESIST COATING MATERIAL, RESIST, AND METHOD FOR FORMING RESIST PATTERN | Non-Final OA | Mitsubishi Chemical Corporation |
| 18147472 | LIGHT RESPONSIVE PHOTORESISTS AND METHODS | Non-Final OA | Intel Corporation |
| 18782565 | RESIN, PHOTORESIST COMPOSITION, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18757949 | PHOTORESIST FOR SEMICONDUCTOR FABRICATION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18232225 | PHOTORESIST COMPOSITION AND METHOD OF FORMING PHOTORESIST PATTERN | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18312199 | COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 17585033 | METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND PHOTORESIST COMPOSITION | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18095235 | RESIST COMPOSITION AND PATTERN FORMING PROCESS | Non-Final OA | Shin-Etsu Chemical Co., Ltd. |
| 17944654 | CHEMICALLY AMPLIFIED RESIST COMPOSITION AND PATTERNING PROCESS | Non-Final OA | Shin-Etsu Chemical Co., Ltd. |
| 17545062 | ALCOHOL COMPOUND, CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS | Final Rejection | Shin-Etsu Chemical Co., Ltd. |
| 18335852 | PHOTO LIGAND DESIGN FOR EUV OR E-BEAM METALLIC PHOTORESISTS | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17734975 | POLYMER CROSSLINK DE-CROSSLINK PROCESSES FOR RESIST PATTERNING | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17868563 | RESIST UNDERLAYER COMPOSITION AND METHOD OF FORMING PATTERNS USING THE COMPOSITION | Non-Final OA | SAMSUNG SDI CO., LTD. |
| 18266620 | COMPOUND, LEVELING AGENT, COATING COMPOSITION, RESIST COMPOSITION, AND ARTICLE | Non-Final OA | DIC Corporation |
| 18222666 | PHOTORESIST COMPOSITION AND METALLIZATION METHOD | Non-Final OA | DuPont Electronic Materials International, LLC |
| 17913610 | LIGHT-SENSITIVE RESIN ORIGINAL PRINTING PLATE FOR LETTERPRESS PRINTING | Non-Final OA | TOYOBO CO., LTD. |
| 18085082 | PHOTORESIST UNDERLAYER COMPOSITION | Non-Final OA | ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. |
| 18277113 | RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMATION METHOD | Non-Final OA | JSR CORPORATION |
| 17913016 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, AND METHOD FOR PRODUCING WIRING BOARD | Non-Final OA | Showa Denko Materials Co., Ltd. |
| 18195200 | SUBSTRATE PROCESSING COMPOSITION AND SUBSTRATE PROCESSING METHOD USING THE SAME | Non-Final OA | SK Inc. |
| 17777638 | REPLACEMENT LIQUID OF LIQUID FILLING BETWEEN RESIST PATTERNS, AND METHOD FOR PRODUCING RESIST PATTERNS USING THE SAME | Final Rejection | Merch Patent GmbH |
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