DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Continued Examination Under 37 CFR 1.114
A request for continued examination under 37 CFR 1.114, including the fee set forth in 37 CFR 1.17(e), was filed in this application after final rejection. Since this application is eligible for continued examination under 37 CFR 1.114, and the fee set forth in 37 CFR 1.17(e) has been timely paid, the finality of the previous Office action has been withdrawn pursuant to 37 CFR 1.114. Applicant's submission filed on 10 February 2026 has been entered.
Claim Rejections - 35 USC § 103
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action:
A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made.
Claim(s) 1-3, 7, and 11-22 are rejected under 35 U.S.C. 103 as being unpatentable over Lin et al (US Publication 20080278917) in view of Wakaiki et al (US Publication 20200388550).
Regarding claim 1, Lin teaches a mounting structure for a semiconductor module, comprising:
a substrate including an obverse surface and a reverse surface facing away from each other in a thickness direction (Fig. 3, 120, top and bottom respectively);
a semiconductor module mounted on a side of the substrate toward which the obverse surface is directed (Fig. 3, 130);
a heat dissipating member that dissipates heat from the semiconductor module (Fig. 3, 110, para 34),
wherein the substrate has a cavity penetrating in the thickness direction (Fig. 3, cavity in 120 where 130 and 112 are positioned),
the heat dissipating member includes a body portion located opposite from the obverse surface of the substrate with respect to the reverse surface of the substrate, and a protruding portion received in the cavity (Fig. 3, 112 in cavity of 120),
the semiconductor module is bonded to the protruding portion (Fig. 3, 130 bonded to 112),
the semiconductor module includes a semiconductor element (Fig. 3, 130), a lead terminal electrically connected to the semiconductor element (Fig. 3, 140), and a resin member covering the semiconductor element (Fig. 3 150),
Lin does not specifically teach:
an insulating layer
the lead terminal includes a base portion protruding from the resin member and extending in a first direction intersecting the thickness direction, and an end portion extending along the thickness direction,
the end portion of the lead terminal penetrates the substrate
the insulating layer is disposed between the reverse surface of the substrate and the body portion of the heat dissipating member
Wakaiki teaches:
an insulating layer (Fig. 29, 11)
the lead terminal includes a base portion protruding from the resin member and extending in a first direction intersecting the thickness direction, and an end portion extending along the thickness direction (Fig. 29, 21a), [[and]]
the end portion of the lead terminal penetrates the substrate (Fig. 29, 21a penetrates 1), and
the insulating layer is disposed between the reverse surface of the substrate and the body portion of the heat dissipating member (Fig. 29, 11 disposed between 24 and 4).
It would have been obvious to one of ordinary skill in the art before the effective filing date of the present application for Lin to include an insulating layer and lead terminals as taught by Wakaiki in order to improve the reliability and operability of the device.
Regarding claims 2-3, Lin as modified teaches the limitations of claim 1 upon which claim 2 depends.
Lin does not specifically teach:
[claim 2] wherein the heat dissipating member includes a cooling passage through which a coolant flows.
[claim 3] wherein the cooling passage overlaps with the protruding portion as viewed in the thickness direction.
Wakaiki teaches:
[claim 2] wherein the heat dissipating member includes a cooling passage through which a coolant flows (Fig. 29, 42 of 4, para 113).
[claim 3] wherein the cooling passage overlaps with the protruding portion as viewed in the thickness direction (Fig. 29, 42 overlaps protruding portion in thickness direction).
It would have been obvious to one of ordinary skill in the art before the effective filing date of the present application for Lin to include the heat dissipating member and associated cooling passages as taught by Wakaiki in order to improve the thermal management properties of the device.
Regarding claim 7 , Lin as modified teaches the limitations of claim 1 upon which claim 7 depends.
Lin does not specifically teach wherein the end portion protrudes from the reverse surface of the substrate and is spaced apart from the heat dissipating member.
Wakaiki teaches wherein the end portion protrudes from the reverse surface of the substrate and is spaced apart from the heat dissipating member (Fig. 29, 21a protrudes through the reverse surface of 1 spaced apart from 4).
It would have been obvious to one of ordinary skill in the art before the effective filing date of the present application for Lin to include the end portion protruding through a reverse surface of the substrate as taught by Wakaiki in order to improve the physical robustness of the device.
Regarding claim 11, Lin as modified teaches the limitations of claim 1 upon which claim 11 depends.
Lin teaches wherein the cavity comprises a through hole having a closed edge as viewed in the thickness direction (Fig. 4a, cavity 222).
Regarding claim 12 Lin as modified teaches the limitations of claim 1 upon which claim 12 depends.
Lin teaches wherein the cavity comprises a cutout portion having an open edge as viewed in the thickness direction (Fig. 4a, cavity 222).
Regarding claim 13 Lin as modified teaches the limitations of claim 1 upon which claim 13 depends.
Lin does not specifically teach a fastening member that fastens the substrate and the heat dissipating member with a space therebetween.
Wakaiki teaches a fastening member that fastens the substrate and the heat dissipating member with a space therebetween (Fig. 33, 20).
It would have been obvious to one of ordinary skill in the art before the effective filing date of the present application for Lin to include the fastener as taught by Wakaiki in order to improve the manufacturing and maintenance properties of the device.
Regarding claim 14 Lin as modified teaches the limitations of claim 1 upon which claim 14 depends.
Lin teaches wherein the protruding portion includes a bonding surface that is bonded to the semiconductor module (Fig. 3, 112 bonded to 130).
Regarding claim 15 Lin as modified teaches the limitations of claim 14 upon which claim 15 depends.
Lin teaches wherein the bonding surface is flush with the obverse surface (Fig. 3, bond surface of 112 and 130 flush).
Regarding claim 16 Lin as modified teaches the limitations of claim 14 upon which claim 16 depends.
Lin teaches wherein the bonding surface is offset from the obverse surface in the thickness direction toward which the obverse surface is directed (Fig. 3, bond surface of 112 and 130).
Regarding claim 17 Lin as modified teaches the limitations of claim 14 upon which claim 17 depends.
Lin teaches wherein the bonding surface is located within the cavity in the thickness direction (Fig. 3, bond surface of 112 and 130 is within cavity).
Regarding claims 18-22, Lin as modified teaches the limitations of claim 1 upon which claim 18 depends.
Lin does not specifically teach:
[claim 18] wherein the first direction is perpendicular to the thickness direction.
[claim 19] wherein the end portion is greater in length than the base portion.
[claim 20] wherein the end portion extends into the insulating layer.
[claim 21] further comprising an electroconductive material embedded in the insulating layer, wherein the end portion extends into the electroconductive material.
[claim 22] wherein the end portion includes an extremity terminates partway through the insulating layer in the thickness direction.
Wakaiki teaches:
[claim 18] wherein the first direction is perpendicular to the thickness direction (Fig. 29, 21a penetrates 1 in the first direction).
[claim 19] wherein the end portion is greater in length than the base portion (Fig .29, 21a vertical longer than horizontal).
[claim 20] wherein the end portion extends into the insulating layer (Fig. 29, 21a into 11).
[claim 21] further comprising an electroconductive material embedded in the insulating layer, wherein the end portion extends into the electroconductive material (Fig. 29, 14).
[claim 22] wherein the end portion includes an extremity terminates partway through the insulating layer in the thickness direction (Fig. 29, 21a and 7h, Fig. 5, LT, para 97).
It would have been obvious to one of ordinary skill in the art before the effective filing date of the present application for Lin to include the end portions as taught by Wakaiki in order to improve the reliability and operability of the device.
Claim(s) 4 and 5 are rejected under 35 U.S.C. 103 as being unpatentable over Lin et al (US Publication 20080278917) and Wakaiki et al (US Publication 20200388550), as applied to claim 1 above, and further in view of Hashizume (US Patent 9831162B2).
Regarding claims 4 and 5, Lin as modified teaches the limitations of claim 1 upon which claim 4 depends.
Lin does not specifically teach:
[claim 4] wherein the semiconductor module includes an island portion to which the semiconductor element is bonded.
[claim 5] wherein the island portion includes an exposed surface that is exposed from the resin member, and the exposed surface is bonded to the protruding portion.
Hashizume teaches:
[claim 4] wherein the semiconductor module includes an island portion to which the semiconductor element is bonded (Fig. 6, 20).
[claim 5] wherein the island portion includes an exposed surface that is exposed from the resin member, and the exposed surface is bonded to the protruding portion (Fig. 6, 20b).
It would have been obvious to one of ordinary skill in the art before the effective filing date of the present application for Lin as modified to include the island portion as taught by Hashizume in order to improve the variety electronic device types in the thermal package.
Claim(s) 9 and 10 are rejected under 35 U.S.C. 103 as being unpatentable over Lin et al (US Publication 20080278917) and Wakaiki et al (US Publication 20200388550), as applied to claim 1 above, and further in view of Takayama, US20140217608.
Regarding claims 9 and 10, Lin as modified teaches the limitations of claim 1 upon which claims 9 and 10 depend.
Lin does not specifically teach:
[claim 9] wherein the insulating layer contains a gel material.
[claim 10] wherein the insulating layer contains a ceramic material.
Takayama teaches
[claim 9] wherein the insulating layer contains a gel material (Fig. 1, bonding portion 20, glass resin with B2O3).
[claim 10] wherein the insulating layer contains a ceramic material (paras 32 and 47-48, aluminum oxide).
It would have been obvious to one of ordinary skill in the art before the effective filing date of the present application for Lin as modified to include the insulation layer materials as taught by Takayama in order to improve the manufacturing and environmental properties of the device.
Response to Arguments
Applicant’s arguments with respect to claim 1 have been considered but are moot because the new ground of rejection does not rely on any reference applied in the prior rejection of record for any teaching or matter specifically challenged in the argument.
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to NICHOLAS HUTSON whose telephone number is (571)270-1750. The examiner can normally be reached Mon-Fri 8am-5pm.
Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice.
If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Jeff Natalini can be reached at 571 272 2266. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000.
/NICHOLAS LELAND HUTSON/ Examiner, Art Unit 2818
/JEFF W NATALINI/ Supervisory Patent Examiner, Art Unit 2818