Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2818
This examiner grants 55% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18121158 | PACKAGE AND METHOD OF FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18003095 | INTERPOSER, CIRCUIT DEVICE, METHOD OF MANUFACTURING INTERPOSER, AND METHOD OF MANUFACTURING CIRCUIT DEVICE | Final Rejection | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18305539 | POWER CONVERTER AND POWER CONVERTER MANUFACTURING METHOD | Final Rejection | FUJI ELECTRIC CO., LTD. |
| 17976373 | SEMICONDUCTOR MODULE | Final Rejection | FUJI ELECTRIC CO., LTD. |
| 17954166 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18254251 | METHOD FOR PRODUCING AN ELECTROTECHNICAL ARRANGEMENT, ELECTRONIC CONTROL UNIT AND ELECTROTECHNICAL ARRANGEMENT | Final Rejection | Robert Bosch GmbH |
| 17926414 | MOUNTING STRUCTURE FOR SEMICONDUCTOR MODULE | Non-Final OA | ROHM CO., LTD. |
| 18305442 | POWER DELIVERY FOR MULTI-CHIP-PACKAGE USING IN-PACKAGE VOLTAGE REGULATOR | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18269940 | METHOD OF MANUFACTURING POWER SEMICONDUCTOR MODULE, AND POWER SEMICONDUCTOR MODULE MANUFACTURED THEREBY | Final Rejection | AMOSENSE CO., LTD. |
| 18220891 | MULTICHIP INTERCONNECTING PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF | Final Rejection | Nantong ACCESS Semiconductor CO.,LTD. |
| 18144236 | SEMICONDUCTOR PACKAGE | Non-Final OA | JMJ Korea Co., Ltd. |
| 17798648 | ENHANCED COLOUR CONVERSION | Non-Final OA | PLESSEY SEMICONDUCTORS LTD |
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