DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Response to Amendment
Applicant’s amendment to claim 8 overcomes the objection to claim 8. Accordingly, the objection to claim 8 is withdrawn.
Applicant's arguments with respect to claims 15, 17, and 18 have been considered but are moot in view of the new ground(s) of rejection.
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claims 15, and 17 – 18 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Chun et al. (KR 10-2019-0124503).
Regarding claim 15, in Figure 21, Chun discloses a printed circuit board, comprising: an insulating layer (top layer 210) having one surface and another surface opposing each other; a pad (rightmost pad 224) embedded in the insulating layer, and having one surface exposed from one surface of the insulating layer (Figure 21) and substantially coplanar with the one surface of the insulating layer (middle surface portion of pad 224 is coplanar with the upper surface of the layer 210; Figure 21); a first solder resist layer (250) disposed on the one surface of the insulating layer, and having an opening exposing a region of the insulating layer where the pad is embedded (Figure 21); and a gold (Au) or nickel (Ni) layer (230) disposed on the pad to be in direct contact with the pad (Figure 21) and to be spaced apart from the first solder resist layer (Figure 21); and a circuit pattern (comprising 228, 222) disposed on the another surface of the insulating layer, wherein a boundary surface between the gold (Au) or nickel (Ni) layer and the pad is substantially coplanar with the one surface of the insulating layer (Figure 21).
Regarding claim 17, Chun discloses a via penetrating through the insulating layer and connecting the circuit pattern to the pad (Figure 21).
Regarding claim 18, Chun discloses wherein the via is tapered in a direction from the circuit pattern to the pad (Figure 21).
Allowable Subject Matter
Claims 1, 2, 4 – 14, and 19 – 21 are allowed.
Conclusion
Applicant's amendment necessitated the new ground(s) of rejection presented in this Office action. Accordingly, THIS ACTION IS MADE FINAL. See MPEP § 706.07(a). Applicant is reminded of the extension of time policy as set forth in 37 CFR 1.136(a).
A shortened statutory period for reply to this final action is set to expire THREE MONTHS from the mailing date of this action. In the event a first reply is filed within TWO MONTHS of the mailing date of this final action and the advisory action is not mailed until after the end of the THREE-MONTH shortened statutory period, then the shortened statutory period will expire on the date the advisory action is mailed, and any nonprovisional extension fee (37 CFR 1.17(a)) pursuant to 37 CFR 1.136(a) will be calculated from the mailing date of the advisory action. In no event, however, will the statutory period for reply expire later than SIX MONTHS from the mailing date of this final action.
Any inquiry concerning this communication or earlier communications from the examiner should be directed to TREMESHA W BURNS whose telephone number is (571)270-3391. The examiner can normally be reached Monday-Friday 8am - 4:30 pm EST.
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TREMESHA W. BURNS
Primary Examiner
Art Unit 2847
/TREMESHA W BURNS/Primary Examiner, Art Unit 2847