Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2835 2847
This examiner grants 78% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18502883 | PLATED STANDOFF FEATURE FOR PROVIDING STANDOFF BETWEEN CIRCUIT BOARD AND CIRCUIT PACKAGE | Non-Final OA | Dell Products L.P. |
| 18126824 | CERAMIC SUBSTRATE, CERAMIC DIVIDED SUBSTRATE, AND METHOD FOR MANUFACTURING CERAMIC SUBSTRATE | Final Rejection | Proterial, Ltd. |
| 18642619 | Adjustable-Depth Electrical Boxes | Non-Final OA | ERICO International Corporation |
| 18629124 | WIRING SUBSTRATE AND METHOD OF MANUFACTURING WIRING SUBSTRATE | Non-Final OA | SHINKO ELECTRIC INDUSTRIES CO., LTD. |
| 18033827 | WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE | Non-Final OA | KYOCERA Corporation |
| 18547107 | METHOD FOR MANUFACTURING CIRCUIT SUBSTRATE, AND ELECTRONIC DEVICE | Final Rejection | HITACHI ASTEMO, LTD. |
| 17964972 | SOLDER COMPOSITION AND ELECTRONIC COMPONENT | Non-Final OA | TDK CORPORATION |
| 18671139 | MODULE AND SEMICONDUCTOR COMPOSITE APPARATUS | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18672545 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18386053 | CIRCUIT BOARD, ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF | Final Rejection | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18199071 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF | Non-Final OA | Samsung Electro-Mechanics Co., Ltd. |
| 18342878 | CORE SUBSTRATE AND INTERPOSER | Non-Final OA | NGK INSULATORS, LTD. |
| 18713194 | ASSEMBLY | Non-Final OA | YOKOWO CO., LTD. |
| 18678028 | CIRCUIT BOARD | Non-Final OA | CHIPBOND TECHNOLOGY CORPORATION |
| 18670986 | CERAMIC SUBSTRATE, JOINED BODY, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING CERAMIC SUBSTRATE, AND METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOARD | Non-Final OA | Niterra Materials Co., Ltd. |
| 18307055 | WIRING SUBSTRATE | Final Rejection | IBIDEN CO., LTD. |
| 18314099 | CIRCUIT SUBSTRATE HAVING IMPROVED BONDING STRUCTURE | Final Rejection | TONG HSING ELECTRONIC INDUSTRIES, LTD. |
| 18697158 | Metal-ceramic substrate and method for producing a metal ceramic substrate | Non-Final OA | Rogers Germany GmbH |
| 18610958 | POWER SUPPLY CIRCUIT, PCB CIRCUIT BOARD AND POWER SUPPLY DEVICE | Non-Final OA | Black Sesame Technologies (Chongqing) Co., Ltd. |
| 18605706 | ELECTRONIC DEVICE | Non-Final OA | Advanced Semiconductor Engineering, Inc. |
| 18394736 | PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF | Final Rejection | AaltoSemi Inc. |
| 18548211 | DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING CIRCUIT ASSEMBLIES HAVING PATTERNS OF DEFORMABLE CONDUCTIVE MATERIAL FORMED THEREIN | Non-Final OA | Liquid Wire Inc. |
| 18178489 | Hotline Clamp For Covered Conductors | Final Rejection | Preformed Line Products Co. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy