Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2847
This examiner grants 94% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18770005 | ELECTRONIC DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18691902 | CIRCUIT BOARD ASSEMBLY, DISPLAY MODULE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18835151 | PRINTED DE-COUPLING PLANE FOR PRINTED CIRCUIT BOARDS | Non-Final OA | Microsoft Technology Licensing, LLC |
| 18406451 | SUBSTRATE SUPPORT WITH PRINTED HEATER | Non-Final OA | Tokyo Electron Limited |
| 18782574 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | InnoLux Corporation |
| 18790090 | PRINTED CIRCUIT BOARD | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18772137 | Pre-Plating of Solder Layer on Solderable Elements for Diffusion Soldering | Non-Final OA | Infineon Technologies AG |
| 18844362 | BGA Radio Frequency Module, Substrate for BGA Radio Frequency Module and Optical Communication Module | Non-Final OA | NTT, Inc. |
| 18704926 | FLEXIBLE SUBSTRATE AND TESTING JIG | Non-Final OA | YOKOWO CO., LTD. |
| 18713194 | ASSEMBLY | Final Rejection | YOKOWO CO., LTD. |
| 18912838 | INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME | Non-Final OA | SHINKO ELECTRIC INDUSTRIES CO., LTD. |
| 18819430 | WIRING BOARD AND LAMINATED WIRING BOARD | Non-Final OA | SHINKO ELECTRIC INDUSTRIES CO., LTD. |
| 18698103 | ELECTRICAL FEEDTHROUGH AND METHOD FOR THE PRODUCTION THEREOF | Final Rejection | Vitesco Technologies GmbH |
| 18731214 | ELECTRONIC DEVICE | Non-Final OA | Advanced Semiconductor Engineering, Inc. |
| 18605706 | ELECTRONIC DEVICE | Final Rejection | Advanced Semiconductor Engineering, Inc. |
| 18859963 | PREPREG, LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | Non-Final OA | Resonac Corporation |
| 18858330 | MEMBER FOR SEMICONDUCTOR DEVICE PRODUCTION, AND METHOD FOR PRODUCING SAME | Non-Final OA | Resonac Corporation |
| 18836471 | MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING MEMBER FOR FORMING WIRING, AND FORMED WIRING MEMBER | Non-Final OA | Resonac Corporation |
| 18836527 | MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING MEMBER FOR FORMING WIRING, AND FORMED WIRING MEMBER | Non-Final OA | Resonac Corporation |
| 18924057 | CIRCUIT BOARD STRUCTURE | Non-Final OA | Tripod (WUXI) Electronic Co., Ltd. |
| 18848638 | POLYIMIDE PRECURSOR COMPOSITION FOR FLEXIBLE WIRING BOARDS, POLYIMIDE FILM, AND POLYIMIDE METAL LAMINATE | Non-Final OA | UBE Corporation |
| 18796006 | INSULATED ELECTRIC CONDUCTOR | Non-Final OA | hpw Metallwerk GmbH |
| 18440183 | ULTRAFINE COAXIAL CABLE | Final Rejection | Creganna Unlimited Company |
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