DETAILED ACTION
Drawings
The drawings are objected to under 37 CFR 1.83(a). The drawings must show every feature of the invention specified in the claims. Therefore, a first plurality of interconnects located on a first metal layer of the substrate, and a second plurality of interconnects located on a second metal layer (claims 1, and 13) must be shown or the feature(s) canceled from the claim(s). No new matter should be entered.
Corrected drawing sheets in compliance with 37 CFR 1.121(d) are required in reply to the Office action to avoid abandonment of the application. Any amended replacement drawing sheet should include all of the figures appearing on the immediate prior version of the sheet, even if only one figure is being amended. The figure or figure number of an amended drawing should not be labeled as “amended.” If a drawing figure is to be canceled, the appropriate figure must be removed from the replacement sheet, and where necessary, the remaining figures must be renumbered and appropriate changes made to the brief description of the several views of the drawings for consistency. Additional replacement sheets may be necessary to show the renumbering of the remaining figures. Each drawing sheet submitted after the filing date of an application must be labeled in the top margin as either “Replacement Sheet” or “New Sheet” pursuant to 37 CFR 1.121(d). If the changes are not accepted by the examiner, the applicant will be notified and informed of any required corrective action in the next Office action. The objection to the drawings will not be held in abeyance.
Claim Rejections - 35 USC § 112
The following is a quotation of 35 U.S.C. 112(b):
(b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention.
The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph:
The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention.
Claims 1 thru 20 are rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention.
In lines 5-7 of claim 1, the applicant states “a first plurality of interconnects located on a first metal layer of the substrate; and a second plurality of interconnects located on a second metal layer”; however, it appears (see, for example FIG. 1) none of the plurality of interconnects 122 are located on a first metal layer 122a or the second metal layer 122b. The first metal layer 122a and the second metal layer 122b appear to be single layers that are part of the flexible portion of the substrate 102, and distant from the plurality of interconnects 122. The same applies to claim 13. Appropriate clarification and/or correction are required.
Claims 1, and 13 recites the limitation "the plurality of solder interconnects" in line 13. There is insufficient antecedent basis for this limitation in the claim. The same applies to claim 13.
Response to Arguments
Regarding the Drawing Objection, and 112 rejections above, the applicant states (see, for example, the annotated drawing on page 11 of the amendment filed 7/28/25) that the first metal layer M1 being layer 122a in the flexible portion of the package, and the second metal layer M2 being layer 122b in the flexible portion of the package; however, the corrected drawing filed 7/28/25 shows the first metal layer M1 and second metal layer M2 pointing to dielectric layers 140 and 110 respectively. Further, the plurality of interconnects 122, which are the vertical structures that are shown to run through the layers 125/120 are not formed on first metal layer 122a. The first metal layer 112a appears to be only in the flexible portion of the substrate, and is a single layer that does not have a first plurality of interconnects located thereon. The same applies to the second metal layer 112b, which does not have a second plurality of interconnects located thereon. It appears (see, for example, Examiner’s annotated FIG. 3 below) the applicant is also referring to the unlabeled layers that are formed on the vertical structures 122, and not only the layer 122a and layer 122b formed in the flexible portion as the first metal layer and second metal layer respectively; however, further clarification and/or correction are required.
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Further, it appears the applicant is stating two different labels for the first metal layer as element 122a, and M1 and the second metal layer as element 122b, and M2; however, further clarification and/or correction are required. It is unclear whether the applicant is stating M1 as being the entire set of metal layers that are collectively on the vertical plurality of interconnects 122 and also the layer 122a. It appears the layer (i.e. first metal layer) 122a is only a portion of M1; however, such an interpretation would contradict the limitation “a first plurality of interconnects located on a first metal layer of the substrate” as the first metal layer 122a does not have any interconnects on it. The same applies to M2. Also see 112 antecedent basis rejection above.
INFORMATION ON HOW TO CONTACT THE USPTO
Any inquiry concerning this communication or earlier communications from the examiner should be directed to EUGENE LEE whose telephone number is (571)272-1733. The examiner can normally be reached M-F 730-330 PM.
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Eugene Lee
March 3, 2026
/EUGENE LEE/Primary Examiner, Art Unit 2815