Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2815
This examiner grants 82% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18382546 | SEMICONDUCTOR DEVICE HAVING THROUGH-VIA STRUCTURE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18459230 | INTEGRATED CIRCUIT WITH INDUCTOR IN MAGNETIC PACKAGE | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18458193 | INTEGRATED CIRCUIT INCLUDING FLASH MEMORY AND CMOS LOGIC CIRCUITRY | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18560482 | DISPLAY APPARATUS, DISPLAY PANEL AND METHOD OF PREPARING THE SAME | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18662759 | DISPLAY APPARATUS | Non-Final OA | Seoul Semiconductor Co., Ltd. |
| 18464511 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18315614 | CONDUCTIVE ELEMENT, DISPLAY DEVICE, AND METHOD OF FABRICATING DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18382471 | HYBRID HIGH BANDWIDTH MEMORY STACK | Non-Final OA | International Business Machines Corporation |
| 17951702 | PACKAGE COMPRISING A FLEXIBLE SUBSTRATE | Non-Final OA | QUALCOMM Incorporated |
| 18452556 | SILICON-ON-INSULATOR (SOI) STRUCTURES FOR CHARGE DAMAGE PROTECTION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18149312 | THRESHOLD VOLTAGE MODULATION FOR THIN FILM TRANSISTORS | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18487835 | ASSEMBLIES WITH EMBEDDED SEMICONDUCTOR DEVICE MODULES AND RELATED METHODS | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18493049 | SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18193409 | LIGHT-EMITTING DIODE AND LIGHT-EMITTING DEVICE | Final Rejection | Quanzhou Sanan Semiconductor Technology Co., Ltd. |
| 18545467 | Semiconductor Device and Method of Forming Protective Layer on Substrate to Avoid Damage During Encapsulation | Non-Final OA | JCET STATS ChipPAC Korea Limited |
| 18559755 | METHOD FOR PREPARING RESERVOIR ELEMENT | Non-Final OA | INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES |
| 18164232 | SEMICONDUCTOR LIGHT-EMITTING DEVICE AND LIGHT-EMITTING APPARATUS INCLUDING THE SAME | Final Rejection | Xiamen San'An Optoelectronics Co., Ltd. |
| 18320955 | CHIP HEAT DISSIPATING STRUCTURE, PROCESS AND SEMICONDUCTOR DEVICE | Final Rejection | HEFEI SMAT TECHNOLOGY CO.,LTD. |
| 18116542 | Ultraviolet (UV) Device Packaging Structure | Final Rejection | Zhixin Semiconductor (Hangzhou) Co., Ltd. |
| 18130837 | MICROMECHANICAL STRUCTURE WITH BONDED COVER | Non-Final OA | SiTime Corporation |
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