Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2815
This examiner grants 82% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18805670 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18735313 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18664690 | SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18652312 | INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD |
| 18407986 | DISPLAY MODULE AND WEARABLE ELECTRONIC DEVICE COMPRISING SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18529551 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18382546 | SEMICONDUCTOR DEVICE HAVING THROUGH-VIA STRUCTURE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18340101 | SEMICONDUCTOR PACKAGES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18700127 | SEMICONDUCTOR DEVICE, SOLID-STATE IMAGING DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18291389 | OXIDE THIN FILM TRANSISTOR AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18243627 | SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18315614 | CONDUCTIVE ELEMENT, DISPLAY DEVICE, AND METHOD OF FABRICATING DISPLAY DEVICE | Final Rejection | Samsung Display Co., LTD. |
| 17951702 | PACKAGE COMPRISING A FLEXIBLE SUBSTRATE | Non-Final OA | QUALCOMM Incorporated |
| 18433254 | IMAGE SENSING DEVICE INCLUDING SLOPED ISOLATION STRUCTURE | Non-Final OA | SK hynix Inc. |
| 18429438 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | SK hynix Inc. |
| 18622547 | SEMICONDUCTOR PACKAGES WITH COMPACT LEAD DESIGN | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18459230 | INTEGRATED CIRCUIT WITH INDUCTOR IN MAGNETIC PACKAGE | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18458193 | INTEGRATED CIRCUIT INCLUDING FLASH MEMORY AND CMOS LOGIC CIRCUITRY | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18772224 | PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18779017 | TRANSISTOR INCLUDING AN ACTIVE REGION AND METHODS FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18641473 | BONDING SCHEME TO PROVIDE IMPROVED COPLANARITY AND HIGH JOINT YIELDS WITH REDUCED COSTS AND METHODS FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18401902 | HYBRID SEMICONDUCTOR WAFER AND METHOD OF FORMING | Non-Final OA | Microchip Technology Incorporated |
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