Prosecution Insights
Last updated: April 19, 2026
Application No. 17/960,116

INNER SPACER RELIABILITY MACRO DESIGN AND WELL CONTACT FORMATION

Non-Final OA §102
Filed
Oct 04, 2022
Examiner
LEE, CHEUNG
Art Unit
2812
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
International Business Machines Corporation
OA Round
1 (Non-Final)
92%
Grant Probability
Favorable
1-2
OA Rounds
2y 0m
To Grant
96%
With Interview

Examiner Intelligence

Grants 92% — above average
92%
Career Allow Rate
1045 granted / 1135 resolved
+24.1% vs TC avg
Minimal +4% lift
Without
With
+4.2%
Interview Lift
resolved cases with interview
Fast prosecutor
2y 0m
Avg Prosecution
19 currently pending
Career history
1154
Total Applications
across all art units

Statute-Specific Performance

§101
1.4%
-38.6% vs TC avg
§103
39.7%
-0.3% vs TC avg
§102
31.5%
-8.5% vs TC avg
§112
13.0%
-27.0% vs TC avg
Black line = Tech Center average estimate • Based on career data from 1135 resolved cases

Office Action

§102
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Claim Objections Claims 1-15 and 17-20 are objected to because of the following informalities: In claim 1, line 7, add --metal-- before “vertical portion.” In claim 1, line 11, add --metal-- before “vertical portion.” In claim 3, line 1, add --metal-- before “vertical portion.” In claim 9, line 8, delete “the” before “sides of the second trench.” In claim 10, line 2, add --sacrificial-- before “nanosheets.” In claim 15, line 1, substitute “claim 9” with --claim 11-- (changing dependency) since “the dielectric plugs” in line 3 is introduced in claim 11 for the first time. In claim 15, line 2, substitute “the” with --a-- before “well contact.” In claim 17, line 5, add --metal-- before “vertical portion.” In claim 17, line 9, add --metal-- before “vertical portion.” In claim 19, line 1, substitute “claim 16” with --claim 17-- (changing dependency) since “the well portion” in line 2 is introduced in claim 17 for the first time. In claim 20, line 1, substitute “claim 16” with --claim 17-- (changing dependency) since “the well portion” in line 2 is introduced in claim 17 for the first time. Claim 2, 4-8, 11-14 and 18 variously depend from claim 1, 3, 9 or 17, so they are objected for the same reason. Claim Rejections - 35 USC § 102 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claim 16 is rejected under 35 U.S.C. 102(a)(1) as being anticipated by Ishimatsu et al. (US Pub. 2022/0165724; hereinafter “Ishimatsu”). Regarding Claim 16, Ishimatsu discloses an integrated circuit apparatus that comprises: a substrate 2 (page 1, paragraph 12); an array of transistors (10, 20) on the substrate 2 (page 1, paragraph 11; see figs. 2 and 3); and a well contact (31, 33) (a well contact diffusion region; page 1, paragraph 12) that is formed among the array of transistors (10, 20) on the substrate 2 (see fig. 3). Allowable Subject Matter Claims 17 and 18 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims. Note that claims 19 and 20 are objected for improper dependency, as indicated above. Accordingly, once the objections are overcome, claims 19 and 20 will be objected to as being dependent on an objected base claim (claim 17) that contains allowable subject matter, as indicated below. The following is a statement of reasons for the indication of allowable subject matter: Claim 17 recites a metal vertical portion that contacts the substrate immediately between the first and second source/drain structures; inner spacers that electrically insulate the metal vertical portion from the adjacent source/drain structures; bottom dielectric isolation that electrically insulates the source/drain structures from the substrate. These features in combination with the other elements of the base claim are neither disclosed nor suggested by the prior art of record. Claims 18-20 depend from claim 17, so they are or will be objected for the same reason. Claims 1-15 will be allowed after overcoming the objections indicated above. The following is an examiner’s statement of reasons for allowance: Claim 1 recites a metal vertical portion that contacts the substrate immediately between the first and second source/drain structures; inner spacers that electrically insulate the metal vertical portion from the adjacent source/drain structures; bottom dielectric isolation that electrically insulates the source/drain structures from the substrate. Claim 9 recites forming a liner at sides of the first trench; etching a second trench through the first and second sacrificial nanosheets; forming first gaps at sides of the second trench by etching the first sacrificial nanosheets; and forming second gaps at the sides of the second trench by releasing the second sacrificial nanosheets. These features in combination with the other elements of the claim are neither disclosed nor suggested by the prior art of record. Claims 2-8 and 10-15 variously depend from claim 1 or 9, so they will be allowed for the same reason. Conclusion The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. US Pub. 2023/0411515 discloses a semiconductor device comprising a plurality of transistors on a substrate, and well contacts on the substrate (fig. 1). Any inquiry concerning this communication or earlier communications from the examiner should be directed to CHEUNG LEE whose telephone number is (571)272-5977. The examiner can normally be reached 9 AM - 5:30 PM. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, DAVIENNE MONBLEAU can be reached at (571)272-1945. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /CHEUNG LEE/Primary Examiner, Art Unit 2812 November 14, 2025
Read full office action

Prosecution Timeline

Oct 04, 2022
Application Filed
May 13, 2024
Response after Non-Final Action
Nov 14, 2025
Non-Final Rejection — §102 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12604519
SEMICONDUCTOR STRUCTURE HAVING MULTIPLE NANOSTRUCTURES WITH DIFFERENT WIDTHS AND METHOD FOR FORMING THE SAME
2y 5m to grant Granted Apr 14, 2026
Patent 12598800
WIDE BANDGAP TRANSISTOR LAYOUT WITH STAGGERED GATE ELECTRODE FINGERS AND SPLIT ACTIVE REGIONS
2y 5m to grant Granted Apr 07, 2026
Patent 12598936
CHIP MANUFACTURING METHOD
2y 5m to grant Granted Apr 07, 2026
Patent 12581717
FRONTSIDE AND BACKSIDE EPI CONTACT
2y 5m to grant Granted Mar 17, 2026
Patent 12581932
INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
2y 5m to grant Granted Mar 17, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

AI Strategy Recommendation

Get an AI-powered prosecution strategy using examiner precedents, rejection analysis, and claim mapping.
Powered by AI — typically takes 5-10 seconds

Prosecution Projections

1-2
Expected OA Rounds
92%
Grant Probability
96%
With Interview (+4.2%)
2y 0m
Median Time to Grant
Low
PTA Risk
Based on 1135 resolved cases by this examiner. Grant probability derived from career allow rate.

Sign in with your work email

Enter your email to receive a magic link. No password needed.

Personal email addresses (Gmail, Yahoo, etc.) are not accepted.

Free tier: 3 strategy analyses per month