Tech Center 2800 • Art Units: 2812 2826 2896
This examiner grants 92% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18767390 | SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR CHIP MANUFACTURING METHOD | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18592266 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronic Co., Ltd. |
| 18204864 | SELF-ALIGNED VIA PATTERNING FOR BACKSIDE INTERCONNECTS | Non-Final OA | Intel Corporation |
| 18202046 | IN-SITU MICRO-FLUIDIC CHANNELS FOR HEAT DISSIPATION IN GLASS SUBSTRATE | Non-Final OA | Intel Corporation |
| 19278903 | METHODS FOR FABRICATING A MULTILEVEL SEMICONDUCTOR DEVICE AND STRUCTURE WITH IMAGE SENSORS AND WAFER BONDING | Non-Final OA | Monolithic 3D inc. |
| 18753024 | SEMICONDUCTOR DEVICE WITH GATE CUT FEATURE AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18621673 | CONDUCTIVE POST WITH FOOTING PROFILE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18655086 | INTEGRATED CIRCUIT WITH NANOSTRUCTURE TRANSISTORS AND FLEXIBLE BOTTOM SOURCE/DRAIN EPITAXY FOR DEVICE PERFORMANCE | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18596501 | VERTICAL HETEROSTRUCTURE SEMICONDUCTOR MEMORY CELL AND METHODS FOR MAKING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18653498 | HYBRID SILICON PHOTONICS-ON-GLASS SUBSTRATE | Non-Final OA | Cisco Technology, Inc. |
| 18732818 | SEMICONDUCTOR MODULE, POWER ELECTRONIC SUBSTRATE AND METHOD FOR FABRICATING A SEMICONDUCTOR MODULE | Non-Final OA | Infineon Technologies AG |
| 18757525 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | UNITED MICROELECTRONICS CORP. |
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