Tech Center 2800 • Art Units: 2812 2826 2896
This examiner grants 92% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 19278903 | METHODS FOR FABRICATING A MULTILEVEL SEMICONDUCTOR DEVICE AND STRUCTURE WITH IMAGE SENSORS AND WAFER BONDING | Non-Final OA | Monolithic 3D inc. |
| 18543978 | Display Device and Transparent Display Device | Non-Final OA | LG Display Co., Ltd. |
| 18473021 | THIN FILM TRANSISTOR SUBSTRATE, DISPLAY DEVICE INCLUDING THE SAME, AND MANUFACTURING METHODS THEREOF | Final Rejection | LG Display Co., Ltd. |
| 18536316 | MRAM DEVICE WITH ASYMMETRIC ELECTRODES | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18462716 | LOW EXTERNAL RESISTANCE LAST NANOSHEET | Final Rejection | International Business Machines Corporation |
| 17960116 | INNER SPACER RELIABILITY MACRO DESIGN AND WELL CONTACT FORMATION | Non-Final OA | International Business Machines Corporation |
| 18090305 | PACKAGE SUBSTRATE EMBEDDED MULTI-LAYERED IN VIA CAPACITORS | Non-Final OA | Intel Corporation |
| 18536751 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 18371150 | ELECTRONIC COMPONENT | Final Rejection | KOA CORPORATION |
| 18239726 | ELECTRONIC DEVICE | Non-Final OA | Advanced Semiconductor Engineering, Inc. |
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