Prosecution Insights
Last updated: April 19, 2026
Application No. 17/961,774

HIGH DENSITY TRENCH CAPACITOR

Non-Final OA §102
Filed
Oct 07, 2022
Examiner
DIAZ, JOSE R
Art Unit
2815
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
International Business Machines Corporation
OA Round
1 (Non-Final)
87%
Grant Probability
Favorable
1-2
OA Rounds
2y 6m
To Grant
94%
With Interview

Examiner Intelligence

Grants 87% — above average
87%
Career Allow Rate
799 granted / 922 resolved
+18.7% vs TC avg
Moderate +8% lift
Without
With
+7.5%
Interview Lift
resolved cases with interview
Typical timeline
2y 6m
Avg Prosecution
26 currently pending
Career history
948
Total Applications
across all art units

Statute-Specific Performance

§101
0.2%
-39.8% vs TC avg
§103
39.3%
-0.7% vs TC avg
§102
36.3%
-3.7% vs TC avg
§112
7.8%
-32.2% vs TC avg
Black line = Tech Center average estimate • Based on career data from 922 resolved cases

Office Action

§102
Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claims 1-20 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Singh et al. (WO 2011/090440). Regarding claim 1, Singh discloses a semiconductor structure, comprising: a capacitor structure at least partially disposed in a trench (consider cavity of trench 404a/404b formed within layer 442) of an interlayer dielectric (400/442) [Fig. 4F and paragraph 0042], the capacitor structure comprising first and second electrode layers (444/448) separated by a dielectric layer (446), a top surface (464) of the first electrode layer (444) being below a top surface of the second electrode layer (448) and the dielectric layer (446) [Fig. 4F]; a spacer disposed on the first electrode layer [Fig. 4G and paragraph 0121]; and a contact (482b) disposed in the trench and connected to the second electrode layer (448) and the spacer [Fig. 4H and paragraph 0122]. Regarding claim 2, Singh discloses wherein the contact (482b) is isolated from the first electrode layer (444) by the spacer [Fig. 4H and paragraphs 0121-0122]. PNG media_image1.png 559 892 media_image1.png Greyscale Regarding claim 10, Singh discloses a semiconductor structure, comprising: a capacitor structure at least partially disposed in a trench (consider cavity of trench 404a/404b formed within layer 442) of an interlayer dielectric layer(400/442) [Fig. 4F and paragraph 0042], the capacitor structure comprising first and second electrode layers (444/448) separated by a dielectric layer (446), a top surface (470) of the second electrode layer (448) being below a top surface of the first electrode layer (444) and the dielectric layer (446) [Fig. 4F]; a spacer disposed on the second electrode layer [Fig. 4G and paragraph 0121]; and a contact (482a) disposed in the trench and connected to the first electrode layer (444)and the spacer [Fig. 4H and paragraph 0122]. Regarding claim 11, Singh discloses wherein the contact (482a) is isolated from the second electrode layer (448)by the spacer [Fig. 4H and paragraphs 0121-0122]. Regarding claims 3 and 12, Singh discloses at least two first electrode layers (444) and at least two second electrode layers (448); wherein adjacent ones of the first and second electrode layers (444/448) are separated by the dielectric layer (446) [Fig. 4H]. Regarding claim 4, Singh discloses wherein each of the at least two first electrode layers (444) comprise the spacer disposed on a top surface of each respective first electrode layer [Figs. 4F-4G and paragraph 0121]. Regarding claim 5, Singh discloses wherein the spacer and the at least two second electrode layers (448) are coterminous with the dielectric layer (446) [Fig. 4H]. Regarding claim 13, Singh discloses wherein each of the at least two second electrode layers (448) comprise the spacer disposed on a top surface of each respective second electrode layer [Figs. 4F-4G and paragraph 0121]. Regarding claim 14, Singh discloses wherein the spacer and the at least two first electrode layers (44) are coterminous with the dielectric layer (446) [Fig. 4H]. Regarding claims 6 and 15, Singh discloses wherein the first electrode layer (444), the second electrode layer (448) and the dielectric layer (446) comprise u-shaped layers [Fig. 4H]. Regarding claims 7 and 16, Singh discloses a sidewall spacer (442) along sidewalls of the trench (consider cavity of trench 404a/404b formed within layer 442) [Fig. 4F]. Regarding claims 8 and 17, Singh discloses wherein the first electrode layer (444) comprises a first material and the second electrode layer (448) comprises a second material different from the first material [Fig. 4H and paragraphs 0042 and 0060]. Regarding claims 9 and 18, Singh discloses wherein the spacer comprises a dielectric material [Figs. 4F-4G and paragraphs 0112 and 0121]. Regarding claim 19, Singh discloses a semiconductor structure, comprising: a capacitor structure at least partially disposed in a trench (consider cavity of trench 404a/404b formed within layer 442) of an interlayer dielectric layer (400/442) [Fig. 4F and paragraph 0042], the capacitor structure comprising a plurality of first and second electrode layers (444/448) arranged in alternating relation with each other and having a dielectric layer (446) disposed between adjacent first and second electrode layers [Fig. 4H], wherein the plurality of first electrode layers (444), the plurality of second electrode layers (448) and the dielectric layer (446) are in a u-shaped configuration [Fig. 4H], wherein one of the plurality of first electrode layers (444) and the plurality of second electrode layers (448) have a top surface (464/470) below a top surface of the other one of the plurality of first electrode layers (444) and the plurality of second electrode layers (448) [Fig. 4F]; a spacer on the top surface of the respective one of the plurality of first electrode layers (444) and the plurality of second electrode layers (448) having the top surface (464/470) below the top surface of the other one of the plurality of first electrode layers and the plurality of second electrode layers [Figs. 4F-4G, and paragraph 0121] ; and a contact (482a/482b) disposed in the trench and connected to the other one of the plurality of first electrode layers and the plurality of second electrode layers and the spacer [Fig. 4H and paragraph 0122]. Regarding claim 20, Singh discloses wherein the capacitor structure forms at least part of a metal-insulator-metal capacitor [Fig. 4H and paragraph 0020]. Conclusion The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. Tigelaar et al. (US 4685197) teaches a trench capacitor comprising spacers (39/42) in Figure 3f; and Lindert (US 2012/0161280) teaches the same in Figures 2-3B. Correspondence Any inquiry concerning this communication or earlier communications from the examiner should be directed to JOSE R DIAZ whose telephone number is (571)272-1727. The examiner can normally be reached Monday-Friday. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Joshua Benitez can be reached at 571-270-1435. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /Jose R Diaz/Primary Examiner, Art Unit 2815
Read full office action

Prosecution Timeline

Oct 07, 2022
Application Filed
Jun 14, 2024
Response after Non-Final Action
Nov 15, 2025
Non-Final Rejection — §102 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12598759
HIGH-DENSITY METAL-INSULATOR-METAL CAPACITOR INTEGRATION WTH NANOSHEET STACK TECHNOLOGY
2y 5m to grant Granted Apr 07, 2026
Patent 12588251
SEMICONDUCTOR MEMORY DEVICE
2y 5m to grant Granted Mar 24, 2026
Patent 12588226
Integrated Assemblies and Methods Forming Integrated Assemblies
2y 5m to grant Granted Mar 24, 2026
Patent 12578645
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
2y 5m to grant Granted Mar 17, 2026
Patent 12581667
MULTISTACK METAL-INSULATOR-METAL (MIM) STRUCTURE USING SPACER FORMATION PROCESS FOR HETEROGENEOUS INTEGRATION WITH DISCRETE CAPACITORS
2y 5m to grant Granted Mar 17, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

AI Strategy Recommendation

Get an AI-powered prosecution strategy using examiner precedents, rejection analysis, and claim mapping.
Powered by AI — typically takes 5-10 seconds

Prosecution Projections

1-2
Expected OA Rounds
87%
Grant Probability
94%
With Interview (+7.5%)
2y 6m
Median Time to Grant
Low
PTA Risk
Based on 922 resolved cases by this examiner. Grant probability derived from career allow rate.

Sign in with your work email

Enter your email to receive a magic link. No password needed.

Personal email addresses (Gmail, Yahoo, etc.) are not accepted.

Free tier: 3 strategy analyses per month