Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2815
This examiner grants 87% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18536334 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18238872 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18382858 | ORGANIC LIGHT EMITTING ELEMENT AND DISPLAY DEVICE | Non-Final OA | LG DISPLAY CO., LTD. |
| 17806954 | DEEP TRENCH BYPASS CAPACITOR FOR ELECTROMAGNETIC INTERFERENCE NOISE REDUCTION | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18284400 | NITRIDE SEMICONDUCTOR LIGHT-EMITTING ELEMENT | Non-Final OA | ASAHI KASEI KABUSHIKI KAISHA |
| 17961774 | HIGH DENSITY TRENCH CAPACITOR | Non-Final OA | International Business Machines Corporation |
| 17955001 | INTERCONNECT WITH DISCONNECTED LINER AND METAL CAP | Non-Final OA | International Business Machines Corporation |
| 18129258 | METAL INSULATOR METAL (MIM) CAPACITOR ARCHITECTURES | Non-Final OA | Intel Corporation |
| 17948586 | THIN FILM CAPACITORS | Non-Final OA | Intel Corporation |
| 17753685 | DRIVING SUBSTRATE, MANUFACTURING METHOD THEREOF, AND DISPLAY PANEL | Non-Final OA | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 18351877 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18219248 | METAL-INSULATOR-METAL CAPACITORS | Non-Final OA | Taiwan Semiconductor Manufacturing Company LTD |
| 18330531 | CAPACITOR HAVING CONDUCITVE PILLAR STRUCTURES CONFIGURED TO INCREASE CAPACITANCE DENSITY | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18384259 | CHIP-PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF, MEMORY SYSTEM AND ELECTRONIC APPARATUS | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18461308 | PACKAGING METHODS AND PACKAGING APPARATUS | Non-Final OA | Yangtze Memory Technologies Co., Ltd. |
| 18223448 | THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18451879 | INTEGRATED CIRCUIT WITH OVERLAPPING STRESSORS | Non-Final OA | NXP USA, INC. |
| 18536035 | DISPLAY PANELS AND MANUFACTURING METHODS THEREOF, AND DISPLAY APPARATUSES | Non-Final OA | Guangzhou China Star Optoelectronics Semiconductor Display Technology Co., LTd. |
| 18354325 | THREE-DIMENSIONAL MEMORY DEVICES WITH LATERAL BLOCK ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 18279054 | SEMICONDUCTOR PACKAGING METHOD | Final Rejection | JUSUNG ENGINEERING CO., LTD. |
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