Office Action Predictor
Application No. 17/969,799

HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE

Non-Final OA §103
Filed
Oct 20, 2022
Examiner
PAPE, ZACHARY
Art Unit
2835
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Clevo CO.
OA Round
6 (Non-Final)
72%
Grant Probability
Favorable
6-7
OA Rounds
2y 5m
To Grant
92%
With Interview

Examiner Intelligence

72%
Career Allow Rate
792 granted / 1094 resolved
Without
With
+19.9%
Interview Lift
avg trend
2y 5m
Avg Prosecution
33 pending
1127
Total Applications
career history

Statute-Specific Performance

§101
0.2%
-39.8% vs TC avg
§103
46.5%
+6.5% vs TC avg
§102
27.9%
-12.1% vs TC avg
§112
19.6%
-20.4% vs TC avg
Black line = Tech Center average estimate • Based on career data

Office Action

§103
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Continued Examination Under 37 CFR 1.114 A request for continued examination under 37 CFR 1.114, including the fee set forth in 37 CFR 1.17(e), was filed in this application after final rejection. Since this application is eligible for continued examination under 37 CFR 1.114, and the fee set forth in 37 CFR 1.17(e) has been timely paid, the finality of the previous Office action has been withdrawn pursuant to 37 CFR 1.114. Applicant's submission filed on 8/7/2025 has been entered. Claim Rejections - 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. This application currently names joint inventors. In considering patentability of the claims the examiner presumes that the subject matter of the various claims was commonly owned as of the effective filing date of the claimed invention(s) absent any evidence to the contrary. Applicant is advised of the obligation under 37 CFR 1.56 to point out the inventor and effective filing dates of each claim that was not commonly owned as of the effective filing date of the later invention in order for the examiner to consider the applicability of 35 U.S.C. 102(b)(2)(C) for any potential 35 U.S.C. 102(a)(2) prior art against the later invention. Claim 1-5, 8-10 are rejected under 35 U.S.C. 103 as being unpatentable over Dunwoody et al. (US 2015/0366105 – hereinafter, “Dunwoody”) in view of Lin (US 2018/0317343). With respect to claim 1, Dunwoody teaches (In Figs 2a-2c) a heat dissipation structure, comprising: a first plate body (204); a second plate body (206); and a plurality of thermally conductive members (218) disposed between the first plate body and the second plate body (See Figs 2B, 2C); wherein a part (See Fig A below) of the plurality of thermally conductive members are arranged along a length direction of the first plate body and a length direction of the second plate body (See Fig A below), and another part (See Fig A below) of the plurality of thermally conductive members are arranged along a width direction of the first plate body and a width direction of the second plate body (See Fig A below), and the another part of the plurality of thermally conductive members are arranged outside of the part of the plurality of thermally conductive members (See Fig A below). Dunwoody fails to specifically teach or suggest that the part of the plurality of thermally conductive members are spaced apart by air at a predetermined distance. Lin, however, teaches (In Figs 2-3) two heat pipes (250) where ends of the heat pipe are spaced apart from each other by air (See Fig 3A). It would have been obvious to one having ordinary skill in the art before the effective filing date of the claimed invention to combine the teachings of Lin with that of Dunwoody, such that the part of the plurality of thermally conductive members of Dunwoody are spaced apart by air at a predetermined distance, as taught by Lin, since doing so would allow for the thermally conductive members to have a thermal break between the two preventing unwanted heat from transferring from one heat pipe to another. PNG media_image1.png 432 627 media_image1.png Greyscale With respect to claim 2, Dunwoody further teaches that the first plate body and the second plate body are made of a same material or different materials (204 and 206 will either be made of the same material or different materials). With respect to claim 3, Dunwoody further teaches that the first plate body is made of copper, copper alloy, aluminum, aluminum alloy, gold, gold alloy, silver, or silver alloy (¶ 0056). With respect to claim 4, Dunwoody further teaches that the second plate body is made of copper, copper alloy, aluminum, aluminum alloy, gold, gold alloy, silver, or silver alloy (¶ 0056). With respect to claim 5, Dunwoody further teaches that the first plate body is made of copper, copper alloy, aluminum (¶ 0054), aluminum alloy, gold, gold alloy, silver, or silver alloy, and the second plate body is made of copper, copper alloy, aluminum (¶ 0054), aluminum alloy, gold, gold alloy, silver, or silver alloy. With respect to claims 8-9, Dunwoody teaches (In Figs 2A-2C) an electronic device, comprising: a CPU (¶ 0045, “processing components”); and at least one heat dissipation structure (200), the at least one heat dissipation structure including a first plate body (204), a second plate body (206), and a plurality of thermally conductive members (218), and one end of at least one of the plurality of thermally conductive members is arranged adjacent to the CPU (Not shown in Fig 2, however Dunwoody teaches that the thermally conductive members cool a component and thus the members must be arranged adjacent to the CPU. See, ¶ 0052, for example.) wherein the plurality of thermally conductive members are disposed between the first plate body and the second plate body (See Fig 2B); wherein a part of the plurality of thermally conductive members are arranged along a length direction of the first plate body and a length direction of the second plate body, and another part of the plurality of thermally conductive members are arranged along a width direction of the first plate body and a width direction of the second plate body, wherein the part of the plurality of thermally conductive members are spaced apart by air at a predetermined distance, and the another part of the plurality of thermally conductive members are arranged outside of the part of the plurality of thermally conductive members (See Fig A above). Dunwoody fails to specifically teach or suggest that the part of the plurality of thermally conductive members are spaced apart by air at a predetermined distance. Lin, however, teaches (In Figs 2-3) two heat pipes (250) where ends of the heat pipe are spaced apart from each other by air (See Fig 3A) by a predetermined distance. It would have been obvious to one having ordinary skill in the art before the effective filing date of the claimed invention to combine the teachings of Lin with that of Dunwoody, such that the part of the plurality of thermally conductive members of Dunwoody are spaced apart by air at a predetermined distance, as taught by Lin, since doing so would allow for the thermally conductive members to have a thermal break between the two preventing unwanted heat from transferring from one heat pipe to another. With respect to claim 10, Dunwoody further teaches at least one heat dissipation member (¶ 0054, “cooling clamp engagements”), wherein another end of the at least one of the plurality of thermally conductive members is connected to the at least one heat dissipation member (¶ 0054, “In some embodiments, one or more cooling clamp engagements (e.g., corresponding with one or more module guides) may be disposed along outer ends of cooling frame 102 corresponding with the external heat exchange interface regions, such as outer ends 108 and 110 that respectively correspond with external heat exchange interface regions 120 and 118.”). Claim 6 is rejected under 35 U.S.C. 103 as being unpatentable over Dunwoody in view of Lin and further in view of Lai et al. (US 2009/0151898 – hereinafter, “Lai”). With respect to claim 6, Dunwoody as modified by Lin teaches the limitations of claim 1 as per above but fails to specifically teach or suggest wherein the m thermally conductive members are fixedly connected between the first plate body and the second plate body by welding. Lai, however, teaches m thermally conductive members (60) which are fixedly connected between the first plate body and the second plate body by welding (¶ 0022, “the heat pipes 60 are sandwiched between the lower plate 20 and the upper plate 30 and directly welded on the lower plate 20”). It would have been obvious to one having ordinary skill in the art before the effective filing date of the claimed invention to combine the teachings of Lai with that of Dunwoody, such that the m thermally conductive members of Dunwoody are fixedly connected between the first plate body and the second plate body by welding, as taught by Lai, since doing so would secure the thermally conductive members preventing them from moving. Response to Arguments With respect to the Applicant’s remarks to claims 1 and 8 that, “Dunwoody disclosed a configurable heat transfer grid 200. Channel surfaces 210 and/or 212 of contoured components 204 and 206, respectively, may be configured to receive one or more cooling elements 218 when contoured component 204 is separated from contoured component 206. In that sense, the one or more cooling elements 218 can be disposed in one or more of the receptacles of configurable heat transfer grid 200. Configurable heat transfer grid 200 may be configured to include various arrangements of cooling elements 218 that can be changed subsequent to the separation of contoured component 204 from contoured component 206 of split cooling frame 202. Therefore, Dunwoody fails to disclosed "a part of the plurality of thermally conductive members are arranged along a length direction of the first plate body and a length direction of the second plate body, and another part of the plurality of thermally conductive members are arranged along a width direction of the first plate body and a width direction of the second plate body" and "the part of the plurality of thermally conductive members are spaced apart by air at a predetermined distance, and the another part of the plurality of thermally conductive members are arranged outside of the part of the plurality of thermally conductive members," as recited in amended claim 1 of the present application. " as recited in amended claim 1 of the present application. " (Present remarks page 7) the Examiner respectfully disagrees and notes the above rejection to claim 1 (with particular attention to Fig A above) where it is shown that Dunwoody is believed to teach the amended limitations of claim 1 (as well as claim 8). Accordingly, claims 1 and 8 are believed to be prima facie obvious in view of Dunwoody and Lin. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to ZACHARY M PAPE whose telephone number is (571)272-2201. The examiner can normally be reached M-F: 9am - 6pm EST. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Jayprakash N Gandhi can be reached at 571-272-3740. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /ZACHARY PAPE/Primary Examiner, Art Unit 2835
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Prosecution Timeline

Oct 20, 2022
Application Filed
Jul 10, 2024
Non-Final Rejection — §103
Oct 11, 2024
Response Filed
Oct 21, 2024
Final Rejection — §103
Jan 15, 2025
Request for Continued Examination
Jan 18, 2025
Response after Non-Final Action
Mar 03, 2025
Non-Final Rejection — §103
May 23, 2025
Response Filed
Jun 03, 2025
Final Rejection — §103
Aug 07, 2025
Request for Continued Examination
Aug 09, 2025
Response after Non-Final Action
Oct 27, 2025
Non-Final Rejection — §103
Jan 14, 2026
Response Filed
Jan 14, 2026
Response after Non-Final Action
Mar 25, 2026
Response Filed
Apr 08, 2026
Final Rejection — §103 (current)

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Prosecution Projections

6-7
Expected OA Rounds
72%
Grant Probability
92%
With Interview (+19.9%)
2y 5m
Median Time to Grant
High
PTA Risk
Based on 1094 resolved cases by this examiner