Tech Center 2800 • Art Units: 2835 2841
This examiner grants 72% of resolved cases
Zachary Pape operates within Tech Center 2800 and Art Unit 2835, where he has handled 1114 resolved cases. This large sample of 1114 cases suggests a deep familiarity with the technical subject matter of his unit. His allowance rate of 72.4% indicates that a majority of applications result in a patent grant. This 72.4% rate provides a clear expectation of success for practitioners filing in Art Unit 2835.
The median days to allowance for his docket is 889. This 889-day period offers a reliable estimate for the time required to navigate the prosecution process from start to finish. For companies managing large portfolios, the 889 days to allowance is a vital statistic for forecasting the timing of patent assets. The 889-day figure reflects the typical pace of examination in Tech Center 2800 under his supervision.
An interview lift of 19.5% suggests that engaging the examiner in a discussion is a productive strategy. This 19.5% lift indicates that applications are significantly more likely to be allowed following an interview. When viewed alongside the 72.4% base allowance rate, the 19.5% lift underscores the value of proactive communication. Practitioners should consider the 19.5% lift as a reason to schedule interviews for their cases among the 1114 resolved cases.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18827564 | DISPLAY DEVICE | Non-Final OA | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 18613360 | Optical Module and Optical Communication Device | Final Rejection | Huawei Technologies Co., Ltd. |
| 18702048 | COOLING DEVICE FOR COOLING ELECTRONIC COMPONENTS | Non-Final OA | Robert Bosch GmbH |
| 18897955 | COLD PLATE ARCHITECTURE FOR LIQUID COOLING OF DEVICES | Non-Final OA | Intel Corporation |
| 17710640 | THIN FORM FACTOR ASSEMBLIES FOR COOLING DIMMS | Non-Final OA | Intel Corporation |
| 18412180 | LEAK PREVENTION AND DETECTION IN LIQUID-COOLED PACKAGES | Final Rejection | LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD. |
| 18394153 | HOT-SWAPPABLE LIQUID-COOLED SOLID STATE DRIVE | Non-Final OA | Microsoft Technology Licensing, LLC |
| 18517183 | OPTIMIZED CHIP COOLING INFRASTRUCTURE | Non-Final OA | Microsoft Technology Licensing, LLC |
| 18706715 | INTEGRATED LIQUID COOLING IN A CARD-BASED COMPUTING DEVICE | Non-Final OA | NVIDIA CORPORATION |
| 18495735 | VEHICLE-MOUNTABLE DEVICE AND VEHICLE | Final Rejection | Yinwang Intelligent Technologies Co., Ltd. |
| 18629354 | SYSTEM AND METHOD FOR COOLING INTERCONNECT MODULES | Non-Final OA | MELLANOX TECHNOLOGIES, LTD. |
| 18618635 | EMBEDDED JET COOLING FOR SEMICONDUCTOR PRODUCTS | Non-Final OA | MELLANOX TECHNOLOGIES, LTD. |
| 18652133 | THERMALLY CONDUCTIVE FOAM COOLING SYSTEM AND METHOD | Non-Final OA | Dell Products L.P. |
| 18703496 | MOUNTING BOARD, AND ELECTRIC APPARATUS EQUIPPED WITH MOUNTING BOARD | Final Rejection | OMRON Corporation |
| 18740674 | SEMICONDUCTOR DEVICE INCLUDING AN INTEGRATED WAFER LEVEL HEAT SINK WINDOW PLATE | Final Rejection | Sandisk Technologies, Inc. |
| 18885416 | DATA CENTER RACK SYSTEM WITH INTEGRATED LIQUID AND DIELECTRIC IMMERSION COOLING | Non-Final OA | OVH |
| 18588720 | BAFFLING ASSEMBLY FOR MITIGATING MOVEMENT OF A HEAT-TRANSFER LIQUID IN AN IMMERSION CASE | Non-Final OA | OVH |
| 18373567 | IMMERSION COOLING CONTAINER | Non-Final OA | OVH |
| 18857287 | THERMAL MANAGEMENT SYSTEM | Non-Final OA | SHELL USA, INC. |
| 18775090 | Electrical Service Adapter for Supply Side Interconnect | Final Rejection | Solaredge Technologies Ltd. |
| 18909099 | Cooling System Assembly | Non-Final OA | Cooler Master Co., Ltd. |
| 18757919 | MANAGING AIR CIRCULATION IN A COMPACT ELECTRONIC DEVICE | Final Rejection | PLUME DESIGN, INC. |
| 18734213 | THERMAL HEAT TRANSFER ASSEMBLY | Final Rejection | PLUME DESIGN, INC. |
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