Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2835 2841
This examiner grants 72% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18786201 | ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION STRUCTURE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18777237 | IN-VEHICLE DEVICE | Non-Final OA | Panasonic Automotive Systems Co., Ltd. |
| 18827564 | DISPLAY DEVICE | Non-Final OA | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 18702048 | COOLING DEVICE FOR COOLING ELECTRONIC COMPONENTS | Non-Final OA | Robert Bosch GmbH |
| 18613360 | Optical Module and Optical Communication Device | Final Rejection | Huawei Technologies Co., Ltd. |
| 17710640 | THIN FORM FACTOR ASSEMBLIES FOR COOLING DIMMS | Non-Final OA | Intel Corporation |
| 18412180 | LEAK PREVENTION AND DETECTION IN LIQUID-COOLED PACKAGES | Final Rejection | LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD. |
| 18394153 | HOT-SWAPPABLE LIQUID-COOLED SOLID STATE DRIVE | Non-Final OA | Microsoft Technology Licensing, LLC |
| 18613262 | Apparatus and method for managing temperature of a high-power pluggable optical module | Non-Final OA | Ciena Corporation |
| 18706715 | INTEGRATED LIQUID COOLING IN A CARD-BASED COMPUTING DEVICE | Final Rejection | NVIDIA CORPORATION |
| 18291775 | HEAT DISSIPATION APPARATUS AND ELECTRONIC DEVICE | Non-Final OA | ZTE CORPORATION |
| 18652133 | THERMALLY CONDUCTIVE FOAM COOLING SYSTEM AND METHOD | Non-Final OA | Dell Products L.P. |
| 18629354 | SYSTEM AND METHOD FOR COOLING INTERCONNECT MODULES | Non-Final OA | MELLANOX TECHNOLOGIES, LTD. |
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