DETAILED ACTION
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
This action is responsive to the following communications: the Amendment filed 5/10/2023.
Claims 1-18 are pending.
Information Disclosure Statement
The information disclosure statements (IDS) submitted on 7/28/2023, 4/22/2024 and 5/21/2025 are in compliance with the provisions of 37 CFR 1.97. Accordingly, the information disclosure statements are being considered by the examiner.
Claim Rejections - 35 USC § 112
The following is a quotation of 35 U.S.C. 112(b):
(b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention.
The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph:
The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention.
Claims 1-18 are rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention.
Claim 1 recites the limitation “the carrier side” in line 5 of the claim. There is insufficient antecedent basis for this limitation in the claim.
Claim 1 recites the limitation “both ends thereof” in line 6 of the claim, however it is unclear what specific element is being referenced in the term “thereof”. The Examiner suggests amending the limitation to expressly recite the specific element being referenced in the limitation “both ends thereof”.
Claim 1 recites the limitation “the metal layer side” in line 11 of the claim. There is insufficient antecedent basis for this limitation in the claim.
Claim 18 recites the limitation “the metal layer side” in line 6 of the claim. There is insufficient antecedent basis for this limitation in the claim.
Note the dependent claims 2-17 necessarily inherit the indefiniteness of the claims on which they depend.
Allowable Subject Matter
Claims 1-18 would be allowable if rewritten or amended to overcome the rejection(s) under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), 2nd paragraph, set forth in this Office action.
Regarding independent claim 1, Shimokawa et al. (US 2020/0266089 A1, hereinafter “Shimokawa”) discloses a method for manufacturing a wiring substrate, comprising:
providing a laminated sheet comprising a release layer 14 (“release layer”- ¶0012), a metal layer 20 (“interconnect layer”, which includes metal- ¶0027), and a device layer 30 (“semiconductor element”- ¶0029) in order on a carrier 11 (“substrate”- ¶0012) (see Figs. 1-3B).
Shimokawa does not expressly disclose making a cut line from a surface of the laminated sheet on the carrier side so that the cut line passes through an inside of a contour of the device layer and both ends thereof reach an end of the laminated sheet when the laminated sheet is seen in a planar view, and so as to pass through the carrier, the release layer, and the metal layer when the laminated sheet is seen in a cross-sectional view and removing outer edge portions outside the cut line in the carrier, the release layer, and the metal layer, thereby exposing part of a surface of the device layer on the metal layer side to form a pressurizable exposed portion for promoting release of the carrier.
Thus, regarding independent claim 1 (which claims 2-17 depend from), the prior art of record including Shimokawa, either singularly or in combination, does not disclose or suggest the combination of limitations including, but not limited to, “making a cut line from a surface of the laminated sheet on the carrier side so that the cut line passes through an inside of a contour of the device layer and both ends thereof reach an end of the laminated sheet when the laminated sheet is seen in a planar view, and so as to pass through the carrier, the release layer, and the metal layer when the laminated sheet is seen in a cross-sectional view” and “removing outer edge portions outside the cut line in the carrier, the release layer, and the metal layer, thereby exposing part of a surface of the device layer on the metal layer side to form a pressurizable exposed portion for promoting release of the carrier”.
Regarding independent claim 18, Figure 3B of Shimokawa discloses a wiring substrate material comprising a release layer 14 (“release layer”- ¶0012), a metal layer 20 (“interconnect layer”, which includes metal- ¶0027), and a device layer 30 (“semiconductor element”- ¶0029) in order on a carrier 11 (“substrate”- ¶0012).
Shimokawa does not expressly disclose wherein outer edge portions of the carrier, the release layer, and the metal layer are missing in at least one place along at least one line passing through an inside of a contour of the device layer when the wiring substrate material is seen in a planar view, whereby part of a surface of the device layer on the metal layer side is exposed.
Thus, regarding independent claim 18, the prior art of record including Shimokawa, either singularly or in combination, does not disclose or suggest the combination of limitations including, but not limited to, “wherein outer edge portions of the carrier, the release layer, and the metal layer are missing in at least one place along at least one line passing through an inside of a contour of the device layer when the wiring substrate material is seen in a planar view, whereby part of a surface of the device layer on the metal layer side is exposed”.
Conclusion
The prior art made of record and not relied upon is considered pertinent to applicant's disclosure:
Matsuura et al. (US 2019/0378727 A1), which discloses a wiring substrate comprising a releaser layer, a metal layer and a device layer.
Any inquiry concerning this communication or earlier communications from the examiner should be directed to JAY C CHANG whose telephone number is (571)272-6132. The examiner can normally be reached Mon- Fri 12pm-10pm.
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/JAY C CHANG/ Primary Examiner, Art Unit 2817