Tech Center 2800 • Art Units: 2800 2817 2895
This examiner grants 85% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18391804 | SEMICONDUCTOR DEVICE INCLUDING A PERIPHERAL CIRCUIT DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18516097 | IMAGE SENSOR AND METHOD OF FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18494449 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18381945 | HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18320456 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18595905 | SEMICONDUCTOR DEVICE HAVING TAPERED METAL COATED SIDEWALLS | Non-Final OA | Texas Instruments Incorporated |
| 18542752 | MICRO LED STRUCTURE AND MICRO LED PANEL | Non-Final OA | Jade Bird Display (Shanghai) Limited |
| 18494706 | METHOD OF MANUFACTURING DISPLAY DEVICE AND DISPLAY DEVICE MANUFACTURED BY THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18492936 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18518235 | ORGANIC DEVICE, DISPLAY APPARATUS INCLUDING THE SAME, PHOTOELECTRIC CONVERSION APPARATUS, ELECTRONIC APPARATUS, ILLUMINATION APPARATUS, MOVING OBJECT, AND WEARABLE DEVICE | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18542683 | Display Panel | Non-Final OA | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. |
| 18478071 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18453688 | INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18309277 | Millimeter-Wave Passive Circuit Designs with Wafer-Level Chip-Scale Package | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18197994 | SYSTEM IN A PACKAGE (SIP) WITH AIR CAVITY AND EPOXY SEAL | Non-Final OA | Qorvo US, Inc. |
| 18115840 | PACKAGE MODULE WITH A MODULE STIFFENER AND METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18494495 | PACKAGE LAYOUTS UTILIZING NON-RECTANGULAR PERIPHERAL CHIPS | Non-Final OA | NVIDIA Corp. |
| 18387627 | TRANSISTOR MANUFACTURING METHOD | Non-Final OA | STMicroelectronics (Crolles 2) SAS |
| 18498189 | LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | XIAMEN SAN’AN OPTOELECTRONICS CO., LTD. |
| 18329140 | Packaging of Dies Including TSVs using Sacrificial Carrier | Non-Final OA | Taiwan Semiconductor Manufactoring Co., Ltd. |
| 18116296 | FAN-OUT WATER-LEVEL PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | JCET ADVANCED PACKAGING CO., LTD. |
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