Tech Center 2800 • Art Units: 2800 2815 2817 2895
This examiner grants 85% of resolved cases
Jay C Chang is an examiner in Tech Center 2800 and Art Unit 2800. The examiner has 682 resolved cases. This volume of resolutions provides a basis for analyzing the examiner's prosecution patterns. The data offers a view of how applications are examined within this specific technical unit and the examiner's consistency in decision-making.
The allowance rate is 85.3 percent. This percentage shows the frequency of grants for applications that reach a final resolution with this examiner. The median days to allowance is 835. This figure indicates the time from filing to the grant of a patent. Practitioners can use this duration to estimate the timeline for their own applications in this art unit and plan their intellectual property strategy accordingly.
The interview lift is 13.9 percent. This metric indicates that an interview is associated with an increase in the probability of an allowance. The positive lift suggests that verbal communication is an effective method for resolving rejections with this examiner. Applicants might prioritize scheduling an interview to address the examiner's concerns and potentially accelerate the path to a patent grant.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18779524 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18742833 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18612648 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18516097 | IMAGE SENSOR AND METHOD OF FABRICATING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18320456 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18578895 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18741762 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18521919 | DISPLAY DEVICE INCLUDING A HOLE AREA | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18494706 | METHOD OF MANUFACTURING DISPLAY DEVICE AND DISPLAY DEVICE MANUFACTURED BY THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18432506 | MANUFACTURING METHOD AND TEST METHOD OF POWER MODULE | Non-Final OA | Kia Corporation |
| 18638607 | SEMICONDUCTOR PACKAGE STRUCTURES BASED ON CHIP BACK WAFER BONDING | Non-Final OA | Yangtze Memory Technologies Co., Ltd. |
| 18746297 | Die Package and Method of Manufacturing a Die Package | Non-Final OA | Infineon Technologies AG |
| 18595905 | SEMICONDUCTOR DEVICE HAVING TAPERED METAL COATED SIDEWALLS | Final Rejection | Texas Instruments Incorporated |
| 18774843 | PACKAGE STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18409126 | RESISTIVE RANDOM-ACCESS MEMORY (RRAM) STRUCTURES AND METHODS OF FORMING SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, LTD. |
| 18400104 | THROUGH SUBSTRATE VIA WITH SPACED SHALLOW TRENCH ISOLATION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18527714 | SEMICONDUCTOR DEVICE AND METHODS OF FABRICATION THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18453688 | INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18770750 | Semiconductor Device and Method of Manufacture | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18115840 | PACKAGE MODULE WITH A MODULE STIFFENER AND METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18650097 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | HON HAI PRECISION INDUSTRY CO., LTD. |
| 18721379 | NITRIDE SEMICONDUCTOR SUBSTRATE AND METHOD FOR PRODUCING SAME | Non-Final OA | SHIN-ETSU HANDOTAI CO., LTD. |
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