Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2800 2817 2895
This examiner grants 85% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18612648 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18531235 | SEMICONDUCTOR DEVICES | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18515334 | IMAGE SENSOR AND MANUFACTURING METHOD THEREOF | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18320456 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18578895 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18575478 | PROCESS FOR PRODUCING LIGHT-EMITTING DIODES | Non-Final OA | COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES |
| 18163884 | SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME | Non-Final OA | STATS ChipPAC Pte. Ltd |
| 18618967 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18430660 | ELECTRONIC APPARATUS INCLUDING ORGANIC PHOTODETECTOR | Non-Final OA | Samsung Display Co., Ltd. |
| 18521919 | DISPLAY DEVICE INCLUDING A HOLE AREA | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18494706 | METHOD OF MANUFACTURING DISPLAY DEVICE AND DISPLAY DEVICE MANUFACTURED BY THE SAME | Final Rejection | Samsung Display Co., Ltd. |
| 18595905 | SEMICONDUCTOR DEVICE HAVING TAPERED METAL COATED SIDEWALLS | Non-Final OA | Texas Instruments Incorporated |
| 18193506 | FLIP CHIP SEMICONDUCTOR DEVICE PACKAGE | Final Rejection | Texas Instruments Incorporated |
| 18409126 | RESISTIVE RANDOM-ACCESS MEMORY (RRAM) STRUCTURES AND METHODS OF FORMING SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, LTD. |
| 18400104 | THROUGH SUBSTRATE VIA WITH SPACED SHALLOW TRENCH ISOLATION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18527714 | SEMICONDUCTOR DEVICE AND METHODS OF FABRICATION THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18453688 | INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18307793 | SEMICONDUCTOR PACKAGE AND FORMING METHOD OF THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18115840 | PACKAGE MODULE WITH A MODULE STIFFENER AND METHODS OF FORMING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company Limited |
| 18391015 | BOTTOM-UP DIELECTRIC GAP-FILL FOR DEVICE ISOLATION DURING SOURCE/DRAIN EPITAXY IN CFET | Non-Final OA | Applied Materials, Inc. |
| 18494495 | PACKAGE LAYOUTS UTILIZING NON-RECTANGULAR PERIPHERAL CHIPS | Non-Final OA | NVIDIA Corp. |
| 18663120 | FERROELECTRIC CAPACITOR STRUCTURE | Non-Final OA | Powerchip Semiconductor Manufacturing Corporation |
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