Prosecution Insights
Last updated: May 29, 2026

Examiner: CHANG, JAY C

Tech Center 2800 • Art Units: 2800 2817 2895

This examiner grants 85% of resolved cases

Performance Statistics

84.7%
Allow Rate
+16.7% vs TC avg
687
Total Applications
+14.5%
Interview Lift
823
Avg Prosecution Days
Based on 647 resolved cases, 2023–2026

Rejection Statute Breakdown

0.3%
§101 Eligibility
18.4%
§102 Novelty
59.8%
§103 Obviousness
19.1%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18391804 SEMICONDUCTOR DEVICE INCLUDING A PERIPHERAL CIRCUIT DEVICE Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18516097 IMAGE SENSOR AND METHOD OF FABRICATING THE SAME Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18494449 SEMICONDUCTOR DEVICE Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18381945 HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD OF MANUFACTURING THE SAME Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18320456 SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME Non-Final OA Samsung Electronics Co., Ltd.
18595905 SEMICONDUCTOR DEVICE HAVING TAPERED METAL COATED SIDEWALLS Non-Final OA Texas Instruments Incorporated
18542752 MICRO LED STRUCTURE AND MICRO LED PANEL Non-Final OA Jade Bird Display (Shanghai) Limited
18494706 METHOD OF MANUFACTURING DISPLAY DEVICE AND DISPLAY DEVICE MANUFACTURED BY THE SAME Non-Final OA Samsung Display Co., Ltd.
18492936 DISPLAY APPARATUS Non-Final OA Samsung Display Co., Ltd.
18518235 ORGANIC DEVICE, DISPLAY APPARATUS INCLUDING THE SAME, PHOTOELECTRIC CONVERSION APPARATUS, ELECTRONIC APPARATUS, ILLUMINATION APPARATUS, MOVING OBJECT, AND WEARABLE DEVICE Non-Final OA CANON KABUSHIKI KAISHA
18542683 Display Panel Non-Final OA Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
18478071 SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
18453688 INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
18309277 Millimeter-Wave Passive Circuit Designs with Wafer-Level Chip-Scale Package Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
18197994 SYSTEM IN A PACKAGE (SIP) WITH AIR CAVITY AND EPOXY SEAL Non-Final OA Qorvo US, Inc.
18115840 PACKAGE MODULE WITH A MODULE STIFFENER AND METHODS OF FORMING THE SAME Non-Final OA Taiwan Semiconductor Manufacturing Company Limited
18494495 PACKAGE LAYOUTS UTILIZING NON-RECTANGULAR PERIPHERAL CHIPS Non-Final OA NVIDIA Corp.
18387627 TRANSISTOR MANUFACTURING METHOD Non-Final OA STMicroelectronics (Crolles 2) SAS
18498189 LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME Non-Final OA XIAMEN SAN’AN OPTOELECTRONICS CO., LTD.
18329140 Packaging of Dies Including TSVs using Sacrificial Carrier Non-Final OA Taiwan Semiconductor Manufactoring Co., Ltd.
18116296 FAN-OUT WATER-LEVEL PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF Non-Final OA JCET ADVANCED PACKAGING CO., LTD.

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