DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Election/Restrictions
Applicant’s election without traverse of Species I, with claims 1-2, 4-6, 8-14 and 16 indicated by Applicant to read thereon, in the reply filed on 12/18/2025 is acknowledged.
While Examiner acknowledges that Applicant indicated that claims 8-10 read on the elected specie I, claims 8-10 are drawn to non-elected species III and are hereby withdrawn from further consideration therefor.
Claims 3, 7-10, 15 and 17-25 are withdrawn from further consideration pursuant to 37 CFR 1.142(b) as being drawn to a nonelected species/invention, there being no allowable generic or linking claim. Election was made without traverse in the reply filed on 12/18/2025.
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claims 1-2, 4-6, 11-14 and 16 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Lewis et al., US Pub. No. 2020/0355442 A1.
Re claim 1. Lewis et al. disclose a heat sink comprising: a heat dissipating body 104 (e.g., fig. 1C); and a pedestal 108 (e.g., fig. 1C) in direct contact with the heat dissipating body 104 (e.g., fig. 1C), the pedestal including an interface surface having a single apex and a convex curvature (e.g., fig. 1C), see figs. 1A-4 and pages 1-10 for more details.
Re claim 2. The heat sink of claim 1, wherein the interface surface of the pedestal 108 has a single curvature (e.g., fig. 1C).
Re claim 4. The heat sink of claim 1, wherein the pedestal is centrally positioned on the heat dissipating body (e.g., fig. 1C).
Re claim 5. The heat sink of claim 1, wherein the heat dissipating body has a lid geometry for covering an integrated circuit 120 (e.g., fig. 1C).
Re claim 6. The heat sink of claim 1, wherein the heat dissipating body comprises at least one fin 106 (e.g., fig. 1C).
Re claim 11. Lewis et al. disclose an electrical component, comprising: a heat producing electrical component 120 (e.g., fig. 1C) having a nominal flat surface interface; a heat sink 110 (e.g., fig. 1C) comprising a pedestal 108, wherein the pedestal includes a heat sink interface surface with an apex, wherein the apex of the heat sink interface surface is a portion of the heat sink closest to the heat producing electrical component 120 (e.g., fig. 1C); and a thermal interface material 124 (e.g., fig. 1C) between the nominal flat surface interface of the heat producing element and the heat sink interface of the pedestal to the heat sink. See figs. 1A-4 and pages 1-10 for more details.
Re claim 12. The electrical component of claim 11, wherein a space between the heat producing electrical component 120 and the heat sink interface of the pedestal 108 to the heat sink is filled with thermal interface material 124 and is substantially free of voids (e.g., fig. 1C).
Re claim 13. The electrical component of claim 11, wherein the pedestal 108 of the heat sink has sidewalls with at least one curvature extending through the apex (e.g., fig. 1C).
Re claim 14. The electrical component of claim 13, wherein the apex of the interface surface is a single peak, and the at least one curvature is a single curvature (e.g., fig. 1C).
Re claim 16. The electrical component of claim 11, wherein the thermal interface material 124 (e.g., paste, paragraph 41) is selected from the group consisting of thermal paste, thermal adhesives, thermal gap fill, phase change materials, metal thermal interface materials and combinations thereof.
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to JACK CHEN whose telephone number is (571)272-1689. The examiner can normally be reached Monday to Friday, 8am to 4pm.
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If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Yara J. Green can be reached at (571)270-3035. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
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/JACK S CHEN/Primary Examiner, Art Unit 2893
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