Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2893
This examiner grants 77% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18351975 | FAN-OUT SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18054970 | METHOD OF FABRICATING SEMICONDUCTOR DEVICE INCLUDING TWO-DIMENSIONAL MATERIAL LAYER DEFINING AIR-GAP, AND SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18166126 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | Final Rejection | Toshiba Electronic Devices & Storage Corporation |
| 18466180 | VERTICAL GAN POWER TRANSISTOR UNIT CELL, VERTICAL GAN POWER TRANSISTOR AND METHOD FOR PRODUCING A VERTICAL GAN POWER TRANSISTOR UNIT CELL | Non-Final OA | Robert Bosch GmbH |
| 17648146 | Semiconductor Device and Method of Stabilizing Heat Spreader on Semiconductor Package | Final Rejection | STATS ChipPAC Pte. Ltd. |
| 18147375 | BOND ENHANCEMENT FOR DIRECT-BONDING PROCESSES | Non-Final OA | Adeia Semiconductor Bonding Technologies Inc. |
| 17897688 | IC FABRICATION FLOW WITH CONTINUOUS DYNAMIC SAMPLING FOR AUTO-VISUAL INSPECTION | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18321239 | FERROELECTRIC MEMORY DEVICE WITH SEMICONDUCTOR LAYER | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18316439 | THIN FILM TRANSISTOR STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17306414 | THIN-FILM TRANSISTORS HAVING HYBRID CRYSTALLINE SEMICONDUCTOR CHANNEL LAYER AND METHODS OF FORMING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company Limited |
| 17951438 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING SYSTEM, AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM | Non-Final OA | Kokusai Electric Corporation |
| 18324897 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE | Non-Final OA | STMICROELECTRONICS S.r.l. |
| 18367807 | Dicing Street Design for Hybrid Bonding | Non-Final OA | International Business Machines Corporation |
| 18065365 | HEATSINK PEDESTALS FOR THERMAL INTERFACE MATERIAL FILL | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 17521076 | TRANSISTOR WITH FACETED, RAISED SOURCE/DRAIN REGION | Non-Final OA | GLOBALFOUNDRIES U.S. Inc. |
| 18200385 | DISPLAY APPARATUS | Final Rejection | SEOUL VIOSYS CO., LTD. |
| 18798016 | WIRING BOARD AND SEMICONDUCTOR DEVICE | Non-Final OA | SHINKO ELECTRIC INDUSTRIES CO., LTD. |
| 18093343 | GATE TRENCH POWER SEMICONDUCTOR DEVICES HAVING SELF-ALIGNED TRENCH SHIELDING REGIONS AND RELATED METHODS | Non-Final OA | Wolfspeed, Inc. |
| 16950414 | METHODS AND APPARATUSES RELATED TO SHAPING WAFERS FABRICATED BY ION IMPLANTATION | Non-Final OA | Wolfspeed, Inc. |
| 16553879 | BOND ENHANCEMENT IN MICROELECTRONICS BY TRAPPING CONTAMINANTS AND ARRESTING CRACKS DURING DIRECT-BONDING PROCESSES | Non-Final OA | ADEIA SEMICONDUCTOR BONDIN TECHNOLOGIES INC. |
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