Prosecution Insights
Last updated: August 17, 2026

Examiner: CHEN, JACK S J

Tech Center 2800 • Art Units: 2893

This examiner grants 77% of resolved cases

Performance Statistics

76.6%
Allow Rate
+8.6% vs TC avg
617
Total Applications
+5.2%
Interview Lift
1075
Avg Prosecution Days
Based on 572 resolved cases, 2023–2026

Rejection Statute Breakdown

0.5%
§101 Eligibility
32.5%
§102 Novelty
31.8%
§103 Obviousness
27.3%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18351975 FAN-OUT SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME Non-Final OA Samsung Electronics Co., Ltd.
18054970 METHOD OF FABRICATING SEMICONDUCTOR DEVICE INCLUDING TWO-DIMENSIONAL MATERIAL LAYER DEFINING AIR-GAP, AND SEMICONDUCTOR DEVICE Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18166126 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME Final Rejection Toshiba Electronic Devices & Storage Corporation
18466180 VERTICAL GAN POWER TRANSISTOR UNIT CELL, VERTICAL GAN POWER TRANSISTOR AND METHOD FOR PRODUCING A VERTICAL GAN POWER TRANSISTOR UNIT CELL Non-Final OA Robert Bosch GmbH
17648146 Semiconductor Device and Method of Stabilizing Heat Spreader on Semiconductor Package Final Rejection STATS ChipPAC Pte. Ltd.
18147375 BOND ENHANCEMENT FOR DIRECT-BONDING PROCESSES Non-Final OA Adeia Semiconductor Bonding Technologies Inc.
17897688 IC FABRICATION FLOW WITH CONTINUOUS DYNAMIC SAMPLING FOR AUTO-VISUAL INSPECTION Non-Final OA TEXAS INSTRUMENTS INCORPORATED
18321239 FERROELECTRIC MEMORY DEVICE WITH SEMICONDUCTOR LAYER Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
18316439 THIN FILM TRANSISTOR STRUCTURE Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
17306414 THIN-FILM TRANSISTORS HAVING HYBRID CRYSTALLINE SEMICONDUCTOR CHANNEL LAYER AND METHODS OF FORMING THE SAME Final Rejection Taiwan Semiconductor Manufacturing Company Limited
18324897 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE Non-Final OA STMICROELECTRONICS S.r.l.
18367807 Dicing Street Design for Hybrid Bonding Non-Final OA International Business Machines Corporation
18065365 HEATSINK PEDESTALS FOR THERMAL INTERFACE MATERIAL FILL Non-Final OA INTERNATIONAL BUSINESS MACHINES CORPORATION
17521076 TRANSISTOR WITH FACETED, RAISED SOURCE/DRAIN REGION Non-Final OA GLOBALFOUNDRIES U.S. Inc.

Facing This Examiner?

IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.

Build Your Strategy

Sign in with your work email

Enter your email to receive a magic link. No password needed.

Personal email addresses (Gmail, Yahoo, etc.) are not accepted.

Free tier: 3 strategy analyses per month