Prosecution Insights
Last updated: July 17, 2026
Application No. 18/091,150

ZERO MISALIGNED PAD AND VIA METALLIZATION STRUCTURES IN GLASS PACKAGE SUBSTRATES

Non-Final OA §102
Filed
Dec 29, 2022
Examiner
HENRY, CALEB E
Art Unit
2818
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Intel Corporation
OA Round
1 (Non-Final)
87%
Grant Probability
Favorable
1-2
OA Rounds
0m
Est. Remaining
93%
With Interview

Examiner Intelligence

Grants 87% — above average
87%
Career Allowance Rate
1082 granted / 1248 resolved
+18.7% vs TC avg
Moderate +6% lift
Without
With
+6.1%
Interview Lift
resolved cases with interview
Typical timeline
2y 3m
Avg Prosecution
32 currently pending
Career history
1285
Total Applications
across all art units

Statute-Specific Performance

§101
0.9%
-39.1% vs TC avg
§103
71.9%
+31.9% vs TC avg
§102
22.9%
-17.1% vs TC avg
§112
1.3%
-38.7% vs TC avg
Black line = Tech Center average estimate • Based on career data from 1248 resolved cases

Office Action

§102
Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Election/Restrictions Applicant’s election without traverse of claims 1-14 in the reply filed on 2/3/2026 is acknowledged. Claim Rejections - 35 USC § 102 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention. Claims 1-3, 5 and 8 are rejected under 35 U.S.C. 102(a)(2) as being anticipated by Tsai (20230062138). PNG media_image1.png 380 355 media_image1.png Greyscale Regarding claim 1, Tsai teaches a apparatus, comprising: a glass core substrate (fig. 2: 102; par. 19) comprising a first surface (surface directly contacting 122) and an opposing second surface (surface opposite surface directly contacting 122); and a metallization structure (fig. 2: 125/106/104) within an opening of the glass core substrate (see fig. 2 above), the metallization structure comprising: a first portion (fig. 2: 125); and a second portion (fig. 2: 106) continuous with the first portion, the second portion on the first portion at an interface between the first and second portions, the first portion having a first lateral width (fig.2: d1’) at the interface and the second portion having a second lateral width (fig. 2: d1) at the interface, wherein the second lateral (d1) width is not less than 25% greater than the first lateral width (par. 60 teaches that d1 and d1’, having width ranges that allow for this percentage, reads on this limitation), and wherein the second portion comprises a top surface substantially coplanar with the second surface of the glass core substrate (please see fig. 2 above). Regarding claim 2, Tsai teaches a apparatus of claim 1, wherein the second lateral width is not less than 50% greater than the first lateral width (please see par. 60). Regarding claim 3, Tsai teaches a apparatus of claim 1, wherein the first portion has a first centerline extending vertically through a length of the first portion and the second portion has a second centerline extending vertically through a length of the second portion, wherein the first and second centerlines are laterally misaligned by not more than 100 nm (please see fig. 2 above shows centerlines being in the middle of d1 and d1’). Regarding claim 5, Tsai teaches a apparatus of claim 1, wherein the first portion extends through the first surface of the glass core substrate (please see fig. 2 above). Regarding claim 8, Tsai teaches a apparatus of claim 1, wherein the first and second portions of the metallization structure each comprise copper, the copper having a substantially matching microstructure across the interface (par. 22 and 36). Claims 10, 11, 13 and 14 are rejected under 35 U.S.C. 102(a)(2) as being anticipated by Tsai (20230062138). Regarding claim 10, Tsai teaches a system, comprising: a glass core substrate (fig. 2: 102; par. 19) comprising a first surface (surface directly contacting 122) and an opposing second surface (surface opposite surface directly contacting 122); a continuous metallization structure (fig. 2: 125/106/104) within the glass core substrate, the continuous metallization structure comprising a via extending through the first surface and a pad extending through the second surface, the pad on the via at an interface therebetween (please see fig. 2 above), wherein the pad has a first lateral width (fig.2: d1’) at the interface that is not less than 25% greater than a second lateral width (fig. 2: d1) of the via at the interface (par. 60 teaches that d1 and d1’, having width ranges that allow for this percentage, reads on this limitation), and wherein the pad comprises a top surface substantially coplanar with the second surface of the glass core substrate (please see fig. 2 above); and one of an integrated circuit die or a printed circuit board coupled to the pad (please see fig. 1G). Regarding claim 11, Tsai teaches a system of claim 10, wherein the first lateral width is not less than 50% greater than the second lateral width, and wherein the pad has a first centerline and the via has a second centerline laterally misaligned by not more than 50 nm (please see fig. 2 above shows centerlines being in the middle of d1 and d1’). Regarding claim 13, Tsai teaches a system of claim 10, wherein the first and second portions of the metallization structure each comprise copper, the copper having a substantially matching microstructure across the interface (par. 22 and 36). Regarding claim 14, Tsai teaches a system of claim 10, wherein the integrated circuit die is coupled to the pad, the system further comprising the printed circuit board coupled to the first surface of the glass core substrate (see fig. 1G). Allowable Subject Matter Claim 4, dependent on claim 3, is objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims. Claim 6, dependent on claim 5, is objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims. Claim 7 is objected to based on its dependency on claim 6. Claim 9 is objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims. Claim 12 is objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to CALEB E HENRY whose telephone number is (571)270-5370. The examiner can normally be reached Mon-Fri. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Eva Montalvo can be reached at (571) 270-3829. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /CALEB E HENRY/Primary Examiner, Art Unit 2818
Read full office action

Prosecution Timeline

Dec 29, 2022
Application Filed
Jul 11, 2023
Response after Non-Final Action
Apr 16, 2026
Non-Final Rejection mailed — §102 (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
87%
Grant Probability
93%
With Interview (+6.1%)
2y 3m (~0m remaining)
Median Time to Grant
Low
PTA Risk
Based on 1248 resolved cases by this examiner. Grant probability derived from career allowance rate.

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