Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2818 2827 2894
This examiner grants 87% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18410992 | SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18483312 | SEMICONDUCTOR PACKAGES | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18229106 | DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18258214 | DISPLAY DEVICE INCLUDING WAVELENGTH CONVERSION PATTERN IN OPENING OF ENCAPSULATION LAYER | Non-Final OA | Samsung Display Co., LTD. |
| 18121070 | METHOD OF MANUFACTURING DISPLAY DEVICE | Final Rejection | Samsung Display Co., Ltd. |
| 18573115 | IMAGING ELEMENT AND ELECTRONIC DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18526239 | FAN-OUT WAFER-LEVEL PACKAGES AND ASSOCIATED PRODUCTION METHODS | Non-Final OA | Infineon Technologies AG |
| 18544345 | TRANSPARENT DISPLAY DEVICE | Non-Final OA | AUO Corporation |
| 18525198 | WORDLINE CONTACT FORMATION FOR NAND DEVICE | Non-Final OA | Applied Materials, Inc. |
| 18361909 | DISPLAY DEVICE AND DISPLAY SYSTEM | Non-Final OA | Magnolia White Corporation |
| 18324192 | MANUFACTURING METHOD OF DISPLAY DEVICE AND CVD DEVICE | Non-Final OA | Magnolia White Corporation |
| 18488729 | VERTICAL SEMICONDUCTOR COMPONENT ON THE BASIS OF GALLIUM NITRIDE WITH A STRUCTURED INTERMEDIATE LAYER | Non-Final OA | Robert Bosch GmbH |
| 18573268 | LIGHT-EMITTING AND PROTECTED NANOPARTICLE, A MANUFACTURING METHOD THEREOF AND AN APPLICATION THEREOF FOR THE OPTOELECTRONIC DEVICE RADIATION CONVERTERS | Non-Final OA | ALEDIA |
| 18331519 | SEMICONDUCTOR DEVICE INCLUDING MARKS AND PATTERNS | Final Rejection | Kioxia Corporation |
| 18511432 | METHOD OF MANUFACTURING METHOD A SEMICONDUCTOR DEVICE, A SEMICONDUCTOR DEVICE MANUFACTURED USING THIS METHOD AND A MOSFET DEVICE MANUFACTURED ACCORDING TO THE METHOD | Non-Final OA | NEXPERIA B.V. |
| 18534065 | SEMICONDUCTOR DEVICES WITH SIDEWALL RECESSES | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18526086 | PACKAGE STRUCTURE INCLUDING A BACKSIDE METAL FILM ON A SEMICONDUCTOR DIE AND A THERMALLY CONDUCTIVE UNDERFILL LAYER ON THE BACKSIDE METAL FILM AND METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18231448 | SEMICONDUCTOR STRUCTURE | Final Rejection | UNITED MICROELECTRONICS CORP. |
| 18518771 | ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES | Non-Final OA | Amkor Technology Singapore Holding Pte. Ltd. |
| 18573251 | NEGATIVE DIFFERENTIAL RESISTANCE TUNNEL DIODE AND MANUFACTURING METHOD | Non-Final OA | Martin-Luther-Universität Halle-Wittenberg |
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