Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Claim Rejections - 35 USC § 102
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
(a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention.
Claim(s) 1-8 is/are rejected under 35 U.S.C. 102(a2) as anticipated by IMAYOSHI.(US 2017/0250141 ).
Regarding claim 1, IMAYOSHI discloses a dielectric layer(fig 1, 1, 7); at least one pad layer(fig 1, 6) formed in the dielectric layer(fig 1); and at least one protective metal layer formed on the at least one pad layer and bonded to the at least one pad layer(fig 1, 9), wherein the at least one protective metal layer only covers an upper surface of the at least one pad layer(fig 1)., the at least one protective metal layer is configured to contact an external element(fig 1, layers 11, 12), there is no height difference between an upper surface of the at least one protective metal layer and an upper surface of the dielectric layer(fig 1), and the surface finish structure of the multi-layer substrate is directly and completely bonded to a surface of the external element(fig 1) having metal pads(fig 9B, 16 the metal pad(fig 1, 15) in contact with 18a) without any gap(fig 9B).
Regarding claim 2, IMAYOSHI discloses wherein a material of the dielectric layer is polyimide (para 0068).
Regarding claim 3, IMAYOSHI discloses wherein a material of the at least one pad layer is copper (para 0053, 0088).
Regarding claim 4, IMAYOSHI discloses wherein a material of the at least one protective metal layer is selected from the group consisting of chromium, nickel, palladium, and gold (para 0053).
Regarding claim 5, IMAYOSHI discloses a dielectric layer(fig 1, 1, 7); at least one pad layer(fig 1, 6), wherein a part of the at least one pad layer is formed in the dielectric layer(fig 1); and at least one protective metal layer formed on the at least one pad layer and bonded to the at least one pad layer(fig 1, 9), wherein the at least one protective metal layer only covers an upper surface of the at least one pad layer(fig 1), the at least one protective metal layer is configured to contact an external element,(fig 1, layers 11 and 12) there is no height difference between an upper surface of the at least one protective metal layer adjacent to the dielectric layer and an upper surface of the dielectric layer(fig 1), and the surface finish structure of the multi-layer substrate(fig 1, 1, 7) is directly and completely bonded to a surface of the external element(fig 1, layers 11 and 12) having metal pads(fig 1, 15) without any gap(fig 1).
Regarding claim 6, IMAYOSHI discloses 5, wherein a material of the dielectric layer is polyimide(para 0068).
Regarding claim 7, IMAYOSHI discloses wherein a material of the at least one pad layer is copper(para 0053, 0088).
Regarding claim 8, IMAYOSHI discloses wherein a material of the at least one protective metal layer is selected from the group consisting of chromium, nickel, palladium, and gold(para 0053).
Allowable Subject Matter
Claims 9-12 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims.
Conclusion
THIS ACTION IS MADE FINAL. Applicant is reminded of the extension of time policy as set forth in 37 CFR 1.136(a).
A shortened statutory period for reply to this final action is set to expire THREE MONTHS from the mailing date of this action. In the event a first reply is filed within TWO MONTHS of the mailing date of this final action and the advisory action is not mailed until after the end of the THREE-MONTH shortened statutory period, then the shortened statutory period will expire on the date the advisory action is mailed, and any nonprovisional extension fee (37 CFR 1.17(a)) pursuant to 37 CFR 1.136(a) will be calculated from the mailing date of the advisory action. In no event, however, will the statutory period for reply expire later than SIX MONTHS from the mailing date of this final action.
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/TIMOTHY J THOMPSON/Supervisory Patent Examiner, Art Unit 2847
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