Tech Center 2800 • Art Units: 2835 2845 2847 2873
This examiner grants 84% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18021632 | CIRCUIT BOARD INCLUDING AN INSULATING LAYER DIVIDED INTO MULTIPLE REGIONS CONTAINING DIFFERENT FILLER CONTENTS | Final Rejection | LG INNOTEK CO., LTD. |
| 17879976 | BUS BAR | Final Rejection | Yazaki Corporation |
| 18080786 | INTERPOSER AND SUBSTRATE MODULE | Final Rejection | Murata Manufacturing Co., Ltd. |
| 17582495 | SYSTEMS AND METHODS FOR PROCESSING PRINTED CIRCUIT BOARD FOR MODULAR CIRCUITS | Final Rejection | Dell Products L.P. |
| 17879110 | ORGANIC PACKAGE CORE FOR A SUBSTRATE WITH HIGH DENSITY PLATED HOLES | Final Rejection | ADVANCED MICRO DEVICES, INC. |
| 18337423 | Flexible printed circuit | Non-Final OA | AAC Microtech (Changzhou) Co., Ltd. |
| 18327871 | Flexible printed circuit | Non-Final OA | AAC Microtech (Changzhou) Co., Ltd. |
| 18096039 | SURFACE FINISH STRUCTURE OF MULTI-LAYER SUBSTRATE | Non-Final OA | PRINCO CORP. |
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