Last updated: July 17, 2026

Application No. 18/099,106

DIE BONDING DEVICE, DIE BONDING METHOD AND VACUUM CONTROL METHOD FOR PICK-AND-PLACER THEREOF

Non-Final OA

Filed

Jan 19, 2023

Priority

Nov 23, 2022 — provisional 63/427,593

Examiner

BRAHJA, BRIAN

Art Unit

3654

Tech Center

3600 — Transportation & Electronic Commerce

Assignee

Taiwan Semiconductor Manufacturing Company, Ltd.

OA Round

1 (Non-Final)

Interview Optional

— +0.0% interview lift. Interview lift (+0.0%) is below the 15.0% threshold. A written response is recommended.

Based on 1 resolved cases, 2023–2026

Examiner Intelligence

BRAHJA, BRIAN View full profile →

Grants 100% — above average

Career Allowance Rate

1 granted / 1 resolved

+48.0% vs TC avg

Minimal +0% lift

Without

With

+0.0%

Interview Lift

resolved cases with interview

Fast prosecutor

2y 0m

Avg Prosecution

6 currently pending

Career history

Total Applications

across all art units

Statute-Specific Performance

§103

87.5%

+47.5% vs TC avg

§102

12.5%

-27.5% vs TC avg

Black line = Tech Center average estimate • Based on career data from 1 resolved cases

Prosecution Timeline

Jan 19, 2023

Application Filed

Apr 21, 2026

Non-Final Rejection mailed (current)

Strategy Recommendation AI-generated — please review before filing

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Prosecution Projections

1-2

Expected OA Rounds

100%

Grant Probability

99%

With Interview (+0.0%)

2y 0m (~0m remaining)

Median Time to Grant

Low

PTA Risk

Based on 1 resolved cases by this examiner. Grant probability derived from career allowance rate.