Prosecution Insights
Last updated: August 17, 2026
Application No. 18/140,155

METHODS AND MECHANISMS FOR DAMPING VIBRATIONS IN SUBSTRATE TRANSFER SYSTEMS

Final Rejection §102
Filed
Apr 27, 2023
Examiner
MARU, TEMESGEN MALLEDE
Art Unit
3655
Tech Center
3600 — Transportation & Electronic Commerce
Assignee
Applied Materials Inc.
OA Round
2 (Final)
75%
Grant Probability
Favorable
3-4
OA Rounds
0m
Est. Remaining
75%
With Interview

Examiner Intelligence

Grants 75% — above average
75%
Career Allowance Rate
6 granted / 8 resolved
+23.0% vs TC avg
Minimal +0% lift
Without
With
+0.0%
Interview Lift
resolved cases with interview
Typical timeline
2y 9m
Avg Prosecution
19 currently pending
Career history
20
Total Applications
across all art units

Statute-Specific Performance

§103
62.3%
+22.3% vs TC avg
§102
21.3%
-18.7% vs TC avg
§112
11.5%
-28.5% vs TC avg
Black line = Tech Center average estimate • Based on career data from 8 resolved cases

Office Action

§102
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Response to Amendment The Amendment filed 04/01/2026 has been entered. Claims 1-21 remain pending in the application. Response to Arguments Applicant's arguments filed 04/01/2026 have been fully considered but they are not persuasive. Applicant, on page 7 of remarks, contends that Shindo fails to disclose the claim 1 recitation of "determining, based on the set of input values and prior to initiating movement of the substrate carrier, one or more corrective signals to apply to the substrate carrier during movement of the substrate carrier along the magnetic levitation track". However, Shindo teaches determining corrective control signals prior to movement because it discloses scheduling the position and posture of the magnetically levitated transfer module in advance and, based on that schedule, performing feedforward control to adjust the magnetic forces applied to the module (col. 6, lines 28-48). The schedule position/posture information corresponds to the claimed set of input values, and the resulting force adjustment commands correspond to the claimed corrective signals. Since the feedforward commands are calculated from a predetermined schedule before movement begins and subsequently applied during movement to control the levitated carrier, Shindo teaches "determining, based on the set of input values and prior to initiating movement of the substrate carrier, one or more corrective signals to apply to the substrate carrier during movement of the substrate carrier along the magnetic levitation track". For this reason, claims 1-21 stand rejected as being anticipated by Shindo. Claim Rejections - 35 USC § 102 The text of those sections of Title 35, U.S. Code not included in this action can be found in a prior Office action. Claims 1-21 are rejected under 35 U.S.C. 102(a)(2) as being anticipated by Shindo et al. (U.S. patent No. 12362215) hereinafter Shindo. Regarding claim 1, Shindo discloses a method, comprising: receiving, by a processor, a set of input values associated with moving a substrate carrier from a first position to a second position along a magnetic levitation track (col 10, lines 42-57; identification information of object to be transferred, movement schedule, and model parameter are input signals received); determining, based on the set of input values and prior to initiating movement of the substrate carrier, one or more corrective signals to apply to the substrate carrier during movement of the substrate carrier along the magnetic levitation track (col. 6, lines 28-48, col 10, lines 42-57; based on the schedule and model parameter, force adjustment values to be used in feedforward control are determined in advance); generating a magnetic field to move the substrate carrier on a direction along the magnetic levitation track (col. 12, lines. 10-18); and applying, to the substrate carrier, the one or more corrective signals to reduce vibrations that would be experienced by a substate held by the substrate carrier due to a motion of the substrate carrier (col. 13; lines 26-34; col. 17, lines 9-21; col. 17, lines 43-64, the model parameters, used as input for calculating operating force adjustment values, are selected so that vibration is suppressed. Thus, the corrective signals generated using these model parameter necessarily reduce vibrations during motion). Regarding claim 2, Shindo discloses all the limitations of claim 1. Shindo further discloses a feedback-correction section (FB-correction section 504) that continually compares the detected position of the substrate carrier with the target position and output correction signal until the deviation becomes small (col. 13, lines 18-34). The limitation determining, based on the set of input values, one or more corrective signals to apply to the substrate carrier after the movement of the substrate carrier ceases is considered inherently disclosed by the continuous feedback process of Shindo et al. Because this feedback loop remains active as the carrier approaches and reaches its final position, the control method necessarily continues to generate and apply corrective signals while deviation or vibration is actively sensed by the sensor, even after the carrier movement has ceased. Therefore, the claimed “when the movement of the substrate carrier ceases” limitation does not impart a patentable distinction over the disclosure of Shindo. Regarding claim 3, Shindo discloses all the limitations of claim 1. Shindo further discloses the one or more corrective signals are determined by performing a lookup in a reference table (col. 10, lines 42-57, col. 17, lines 43-50). Regarding claim 4, Shindo discloses all the limitations of claim 1. Shindo further discloses obtaining substrate data associated with one or more properties of the substrate; and determining the one or more corrective signals based on the set of input values and the substrate data (col. 7, lines 35-45). Regarding claim 5, Shindo discloses all the limitations of claim 1. Shindo further discloses obtaining sensor data from a sensor; and adjusting the corrective signals based on the sensor data (col. 13, lines 7-17; Fig. 4, sensors 51). Regarding claim 6, Shindo discloses all the limitations of claim 1. Shindo further discloses the one or more corrective signals are applied to at least one of the substrate carrier, the magnetic levitation track, or an end effector coupled to the substrate carrier (col. 17, lines 9-21; col. 17, lines 47-52, Fig. 11). Regarding claim 7, Shindo discloses all the limitations of claim 1. Shindo further discloses the one or more corrective signals adjust an elevation of at least one of the substrate carrier, the magnetic levitation track, or an end effector coupled to the substrate carrier (col. 17, lines 43-52). Regarding claim 8, Shindo discloses an electronic device manufacturing system (Abstract), comprising; a substrate carrier configured to secure a substrate (col. 4, lines 9-11; Fig. 1; substrate carrier 30); and a controller, operatively coupled to the substrate carrier (col. 5, lines 22-25; Fig. 4, controller 5), the controller configured to perform operations comprising: receiving, by a processor, a set of input values associated with moving a substrate carrier from a first position to a second position along a magnetic levitation track (col 10, lines 42-57; identification information of object to be transferred, movement schedule, and model parameter are input signals received); determining, based on the set of input values and prior to initiating movement of the substrate carrier, one or more corrective signals to apply to the substrate carrier during movement of the substrate carrier along the magnetic levitation track (col. 6, lines 28-48, col 10, lines 42-57; based on the schedule and model parameter, force adjustment values to be used in feedforward control are determined in advance); generating a magnetic field to move the substrate carrier on a direction along the magnetic levitation track (col. 12, lines. 10-18); and applying, to the substrate carrier, the one or more corrective signals to reduce vibrations that would be experienced by a substate held by the substrate carrier due to a motion of the substrate carrier (col. 13; lines 26-34; col. 17, lines 9-21; col. 17, lines 43-64, the model parameters, used as input for calculating operating force adjustment values, are selected so that vibration is suppressed. Thus, the corrective signals generated using these model parameter necessarily reduce vibrations during motion). Regarding claim 9, Shindo discloses all the limitations of claim 8. Shindo further discloses a feedback-correction section (Fig. 4; FB-correction section 504) that continually compares the detected position of the substrate carrier with the target position and output correction signal until the deviation becomes small (col. 13, lines 18-34). The limitation determining, based on the set of input values, one or more corrective signals to apply to the substrate carrier after the movement of the substrate carrier ceases is considered inherently disclosed by the continuous feedback process of Shindo because this feedback loop remains active as the carrier approaches and reaches its final position, the control method necessarily continues to generate and apply corrective signals while deviation or vibration is actively sensed by the sensor, even after the carrier movement has ceased. Therefore, the claimed “when the movement of the substrate carrier ceases” limitation does not impart a patentable distinction over the disclosure of Shindo. Regarding claim 10, Shindo discloses all the limitations of claim 8. Shindo further discloses the one or more corrective signals are determined by performing a lookup in a reference table (col. 10, lines 42-57, col. 17, lines 43-50, Fig. 4; parameter store 503). Regarding claim 11, Shindo discloses all the limitations of claim 8. Shindo further discloses obtaining substrate data associated with one or more properties of the substrate; and determining the one or more corrective signals based on the set of input values and the substrate data (col. 7, lines 35-45). Regarding claim 12, Shindo discloses all the limitations of claim 8. Shindo further discloses obtaining sensor data from a sensor; and adjusting the corrective signals based on the sensor data (col. 13, lines 7-17; Fig. 4, sensors 51). Regarding claim 13, Shindo discloses all the limitations of claim 8. Shindo further discloses the one or more corrective signals are applied to at least one of the substrate carrier, the magnetic levitation track, or an end effector coupled to the substrate carrier (col. 17, lines 9-21; col. 17, lines 47-52, Fig. 11). Regarding claim 14, Shindo discloses all the limitations of claim 8. Shindo further discloses the one or more corrective signals adjust an elevation of at least one of the substrate carrier, the magnetic levitation track, or an end effector coupled to the substrate carrier (col. 17, lines 43-52). Regarding claim 15, Shindo discloses a non-transitory computer-readable storage medium comprising instructions that, when executed by a processing device operatively coupled to a memory (col. 5, lines 25-32), performs operations comprising: receiving, by a processor, a set of input values associated with moving a substrate carrier from a first position to a second position along a magnetic levitation track (col 10, lines 42-57; identification information of object to be transferred, movement schedule, and model parameter are input signals received); determining, based on the set of input values and prior to initiating movement of the substrate carrier, one or more corrective signals to apply to the substrate carrier during movement of the substrate carrier along the magnetic levitation track (col. 6, lines 28-48, col 10, lines 42-57; based on the schedule and model parameter, force adjustment values to be used in feedforward control are determined in advance); generating a magnetic field to move the substrate carrier on a direction along the magnetic levitation track (col. 12, lines. 10-18); and applying, to the substrate carrier, the one or more corrective signals to reduce vibrations that would be experienced by a substrate held by the substrate carrier due to a motion of the substrate carrier (col. 13; lines 26-34; col. 17, lines 9-21; col. 17, lines 43-64, the model parameters, used as input for calculating operating force adjustment values, are selected so that vibration is suppressed. Thus, the corrective signals generated using these model parameter necessarily reduce vibrations during motion). Regarding claim 16, Shindo discloses all the limitations of claim 15. Shindo further discloses a feedback-correction section (FB-correction section 504) that continually compares the detected position of the substrate carrier with the target position and output correction signal until the deviation becomes small (col. 13, lines 18-34). The limitation determining, based on the set of input values, one or more corrective signals to apply to the substrate carrier after the movement of the substrate carrier ceases is considered inherently disclosed by the continuous feedback process of Shindo. Because this feedback loop remains active as the carrier approaches and reaches its final position, the control method necessarily continues to generate and apply corrective signals while deviation or vibration is actively sensed by the sensor, even after the carrier movement has ceased. Therefore, the claimed “when the movement of the substrate carrier ceases” limitation does not impart a patentable distinction over the disclosure of Shindo. Regarding claim 17, Shindo discloses all the limitations of claim 15. Shindo further discloses the one or more corrective signals are determined by performing a lookup in a reference table (col. 10, lines 42-57). Regarding claim 18, Shindo discloses all the limitations of claim 15. Shindo further discloses obtaining substrate data associated with one or more properties of the substrate; and determining the one or more corrective signals based on the set of input values and the substrate data (col. 7, lines 35-45). Regarding claim 19, Shindo discloses all the limitations of claim 15. Shindo further discloses obtaining sensor data from a sensor; and adjusting the corrective signals based on the sensor data (col. 13, lines 7-17; Fig. 4, sensors 51). Regarding claim 20, Shindo discloses all the limitations of claim 15. Shindo further discloses the one or more corrective signals are applied to at least one of the substrate carrier, the magnetic levitation track, or an end effector coupled to the substrate carrier (col. 17, lines 9-21; col. 17, lines 47-52, Fig. 11). Regarding claim 21, Shindo discloses all the limitations of claim 1. Shindo further discloses, further responsive to receiving one or more external signals during or after the movement of the substate carrier along the magnetic levitation track, applying, to the substrate carrier, the one or more further corrective signals (col. 13, lines 7-17; Fig. 4, sensors 51). Conclusion THIS ACTION IS MADE FINAL. Applicant is reminded of the extension of time policy as set forth in 37 CFR 1.136(a). A shortened statutory period for reply to this final action is set to expire THREE MONTHS from the mailing date of this action. In the event a first reply is filed within TWO MONTHS of the mailing date of this final action and the advisory action is not mailed until after the end of the THREE-MONTH shortened statutory period, then the shortened statutory period will expire on the date the advisory action is mailed, and any nonprovisional extension fee (37 CFR 1.17(a)) pursuant to 37 CFR 1.136(a) will be calculated from the mailing date of the advisory action. In no event, however, will the statutory period for reply expire later than SIX MONTHS from the mailing date of this final action. Any inquiry concerning this communication or earlier communications from the examiner should be directed to TEMESGEN M. MARU whose telephone number is (571)272-0039. The examiner can normally be reached Monday -Friday 8:00AM-5:00PM. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Jacob Scott can be reached at (571)270-3415. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /TEMESGEN M. MARU/Patent Examiner, Art Unit 3655 /JACOB S. SCOTT/Supervisory Patent Examiner, Art Unit 3655
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Prosecution Timeline

Apr 27, 2023
Application Filed
Oct 31, 2025
Non-Final Rejection mailed — §102
Mar 02, 2026
Response Filed
Mar 02, 2026
Response after Non-Final Action
Apr 01, 2026
Response Filed
Jun 18, 2026
Final Rejection mailed — §102 (current)

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Prosecution Projections

3-4
Expected OA Rounds
75%
Grant Probability
75%
With Interview (+0.0%)
2y 9m (~0m remaining)
Median Time to Grant
Moderate
PTA Risk
Based on 8 resolved cases by this examiner. Grant probability derived from career allowance rate.

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