Prosecution Insights
Last updated: April 19, 2026
Application No. 18/141,153

INTEGRATED CIRCUIT WITH IMPROVED ISOLATION

Non-Final OA §102
Filed
Apr 28, 2023
Examiner
MUNOZ, ANDRES F
Art Unit
2818
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Texas Instruments Incorporated
OA Round
1 (Non-Final)
76%
Grant Probability
Favorable
1-2
OA Rounds
2y 4m
To Grant
94%
With Interview

Examiner Intelligence

Grants 76% — above average
76%
Career Allow Rate
541 granted / 707 resolved
+8.5% vs TC avg
Strong +18% interview lift
Without
With
+17.8%
Interview Lift
resolved cases with interview
Typical timeline
2y 4m
Avg Prosecution
36 currently pending
Career history
743
Total Applications
across all art units

Statute-Specific Performance

§101
0.5%
-39.5% vs TC avg
§103
43.7%
+3.7% vs TC avg
§102
28.6%
-11.4% vs TC avg
§112
21.5%
-18.5% vs TC avg
Black line = Tech Center average estimate • Based on career data from 707 resolved cases

Office Action

§102
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Election/Restrictions Applicant’s election without traverse of Invention I (original claims 1-14 and new claims 21-22) and Species B (Fig. 3; claims 1-14 and 21-22) in the reply filed on 1.20.2026 is acknowledged. Claims 15-20 drawn to Invention II have been canceled. Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claims 1 and 7-9 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Tsuchiko (US 20130069154 A1). Regarding claim 1, Tsuchiko discloses an integrated circuit (Figs. 2 and 14) comprising: a first epitaxial layer (16) having a first conductivity type (P, [0017]) over a semiconductor substrate (14) having a top surface; a second epitaxial layer (18) having (partly) the first conductivity type (P in 148, [0020]) over the first epitaxial layer; a first doped region (136) having a different second conductivity type (N, [0020]) between and extending into the substrate (14) and the first epitaxial layer (16); a second doped region (134) having the second conductivity type (N, [0020]) between and extending into the first epitaxial layer (16) and the second epitaxial layer (18. See Fig. 10: 134 extends into 18); a well region (126/156) having the first conductivity type (P, [0020], [0033]) extending from a top surface of the second epitaxial layer (18) into the second epitaxial layer over the first doped region (136); and an active device (LDMOS) formed over or in the well region over the first doped region (Figs. 2 and 14). Regarding claim 7, Tsuchiko discloses the integrated circuit of claim 1, wherein the active device is a transistor (Fig. 14). Regarding claim 8, Tsuchiko discloses the integrated circuit of claim 1, wherein the active device includes an LDMOS transistor (Fig. 14). Regarding claim 9, Tsuchiko discloses the integrated circuit of claim 1, wherein the first conductivity type is P-type and the second conductivity type is N-type ([0017], [0020], [0033]). Allowable Subject Matter Claims 2-6 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims. Claims 10-14 and 21-22 are allowed. The following is a statement of reasons for the indication of allowable subject matter: Regarding claim 2, the prior art of record fails to disclose or suggest wherein the second doped region has a higher average dopant concentration than does the first doped region. Regarding claim 3, the prior art of record fails to disclose or suggest wherein a portion of the first epitaxial layer between the first and second doped regions has an unmodified dopant concentration. Regarding claim 4, the prior art of record fails to disclose or suggest wherein the first doped region is spaced apart from the top surface of the second epitaxial layer by a first distance and merges with a third doped region having the second conductivity type that is laterally spaced apart from the first doped region and vertically spaced apart from the top surface by a lesser second distance; claims 5-6 depend from claim 4. Regarding claim 10, the prior art of record fails to disclose or suggest a second P-type epitaxial layer extending between the first P-type epitaxial layer and a top surface of the second P-type epitaxial layer; an unmodified portion of the first P-type epitaxial layer between the first N-type buried layer and the P-type buried layer; a second N-type buried layer extending into the first P-type epitaxial layer and laterally spaced apart from and at a same height over the substrate as the P-type buried layer; and a third N-type buried layer in the first P-type epitaxial layer between the second N-type buried layer and the substrate as recited within the context of claim; claims 11-14 and 21-22 depend from claim 10. With regards to independent claim 10, the closest prior art (Tsuchiko, US 20130069154 A1) discloses an integrated circuit (Figs. 1 and 16) comprising: a first N-type buried layer (136) extending into a semiconductor substrate (14); a first P-type epitaxial layer (16) extending from the first N-type buried layer away from the substrate; a P-type buried layer (137) extending into the first P-type epitaxial layer over the first N-type buried layer; a second a P-type well (156) in the second a second N-type buried layer (134) extending into the first P-type epitaxial layer a transistor formed in or over the P-type well (156, Fig. 16). Conclusion The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. See PTO-892. Any inquiry concerning this communication or earlier communications from the examiner should be directed to ANDRES MUNOZ whose telephone number is (571)270-3346. The examiner can normally be reached 8AM-5PM Central Time. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Eva Montalvo can be reached at (571)270-3829. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /Andres Munoz/Primary Examiner, Art Unit 2818
Read full office action

Prosecution Timeline

Apr 28, 2023
Application Filed
Jan 20, 2026
Response after Non-Final Action
Mar 16, 2026
Non-Final Rejection — §102 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12604484
SEMICONDUCTOR DEVICE INCLUDING DATA STORAGE STRUCTURE AND METHOD OF MANUFACTURING DATA STORAGE STRUCTURE
2y 5m to grant Granted Apr 14, 2026
Patent 12598974
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
2y 5m to grant Granted Apr 07, 2026
Patent 12593534
METHOD OF PRODUCING SEMICONDUCTOR DEVICE
2y 5m to grant Granted Mar 31, 2026
Patent 12588268
LINER-FREE CONDUCTIVE STRUCTURES
2y 5m to grant Granted Mar 24, 2026
Patent 12582001
METHODS FOR FUSION BONDING SEMICONDUCTOR DEVICES TO TEMPORARY CARRIER WAFERS WITH CAVITY REGIONS FOR REDUCED BOND STRENGTH, AND SEMICONDUCTOR DEVICE ASSEMBLIES FORMED BY THE SAME
2y 5m to grant Granted Mar 17, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

AI Strategy Recommendation

Get an AI-powered prosecution strategy using examiner precedents, rejection analysis, and claim mapping.
Powered by AI — typically takes 5-10 seconds

Prosecution Projections

1-2
Expected OA Rounds
76%
Grant Probability
94%
With Interview (+17.8%)
2y 4m
Median Time to Grant
Low
PTA Risk
Based on 707 resolved cases by this examiner. Grant probability derived from career allow rate.

Sign in with your work email

Enter your email to receive a magic link. No password needed.

Personal email addresses (Gmail, Yahoo, etc.) are not accepted.

Free tier: 3 strategy analyses per month