Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2818 2848 2894 2897 2898
This examiner grants 76% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18479820 | SEMICONDUCTOR PACKAGE | Final Rejection | Samsung Electronics Co., Ltd. |
| 18347938 | CAPACITOR, SEMICONDUCTOR DEVICE INCLUDING THE SAME AND ELECTRONIC APPARATUS | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17930820 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 17872139 | SEMICONDUCTOR PACKAGE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18495975 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | Samsung Display Co., LTD. |
| 18306421 | GATE-ALL-AROUND (GAA) FIELD-EFFECT TRANSISTOR (FET) DEVICE EMPLOYING STRAIN MATERIAL IN INACTIVE GATE REGION(S) FOR APPLYING CHANNEL STRAIN FOR INCREASED CARRIER MOBILITY, AND RELATED FABRICATION METHODS | Non-Final OA | QUALCOMM Incorporated |
| 19033078 | INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK | Non-Final OA | Intel Corporation |
| 18601774 | PACKAGE STACKING USING CHIP TO WAFER BONDING | Final Rejection | Intel Corporation |
| 18400772 | INTEGRATED CIRCUIT STRUCTURES HAVING DIELECTRIC ANCHOR AND CONFINED EPITAXIAL SOURCE OR DRAIN STRUCTURE | Non-Final OA | Intel Corporation |
| 17847559 | GATE ALL AROUND TRANSISTORS ON ALTERNATE SUBSTRATE ORIENTATION | Final Rejection | Intel Corporation |
| 17711978 | MICROELECTRONIC STRUCTURE INCLUDING DIE BONDING FILM BETWEEN EMBEDDED DIE AND SURFACE OF SUBSTRATE CAVITY, AND METHOD OF MAKING SAME | Final Rejection | Intel Corporation |
| 17553161 | INTEGRATED CIRCUIT STRUCTURES HAVING DIELECTRIC ANCHOR AND CONFINED EPITAXIAL SOURCE OR DRAIN STRUCTURE | Final Rejection | Intel Corporation |
| 18514862 | MULTI-LAYERED SPACER AND DOUBLE-SIDED COOLING POWER MODULE INCLUDING SAME | Non-Final OA | Kia Corporation |
| 18495837 | SENSOR ELECTRONIC DEVICE | Non-Final OA | Texas Instruments Incorporated |
| 18141153 | INTEGRATED CIRCUIT WITH IMPROVED ISOLATION | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18322882 | SEMICONDUCTOR DEVICE INCLUDING POLYSILICON STRUCTURES AND METHOD OF MAKING | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18303822 | ISOLATION OF ADJACENT STRUCTURES | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18155491 | IMAGE SENSOR PACKAGING AND METHODS FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18783347 | INTEGRATED PHOTORESIST REMOVAL AND LASER ANNEALING | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18750737 | Source/Drain Feature to Contact Interfaces | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18581604 | Methods, Structures and Devices for Intra-Connection Structures | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18414292 | BARRIER FOR LIQUID METAL THERMAL INTERFACE MATERIAL IN AN ELECTRONIC DEVICE | Non-Final OA | NVIDIA CORPORATION |
| 18346558 | FORMATION OF PHOTODIODE ABSORPTION REGION USING A SACRIFICIAL REGION | Final Rejection | Cisco Technology, Inc. |
| 18317736 | AVALANCHE PHOTODIODE USING A SILICON CAP LAYER | Final Rejection | Cisco Technology, Inc. |
| 17815457 | CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES | Non-Final OA | International Business Machines Corporation |
| 18488050 | LIGHT EMITTING DIODE AND LIGHT EMITTING DEVICE | Final Rejection | Tianjin Sanan Optoelectronics Co., Ltd. |
| 18320425 | SEMICONDUCTOR PACKAGE STRUCTURE | Final Rejection | MediaTek Singapore Pte. Ltd. |
| 18439938 | ANTENNA-INTEGRATED HIGH-FREQUENCY SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME | Non-Final OA | KOREA ELECTRONICS TECHNOLOGY INSTITUTE |
| 18660223 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 18531679 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | UNITED MICROELECTRONICS CORP. |
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