Tech Center 2800 • Art Units: 2818 2894 2897
This examiner grants 76% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18479820 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17930820 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17872139 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18141153 | INTEGRATED CIRCUIT WITH IMPROVED ISOLATION | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18322882 | SEMICONDUCTOR DEVICE INCLUDING POLYSILICON STRUCTURES AND METHOD OF MAKING | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18303822 | ISOLATION OF ADJACENT STRUCTURES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18156847 | SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18155491 | IMAGE SENSOR PACKAGING AND METHODS FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 19033078 | INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK | Non-Final OA | Intel Corporation |
| 18601774 | PACKAGE STACKING USING CHIP TO WAFER BONDING | Non-Final OA | Intel Corporation |
| 17847559 | GATE ALL AROUND TRANSISTORS ON ALTERNATE SUBSTRATE ORIENTATION | Non-Final OA | Intel Corporation |
| 17711978 | MICROELECTRONIC STRUCTURE INCLUDING DIE BONDING FILM BETWEEN EMBEDDED DIE AND SURFACE OF SUBSTRATE CAVITY, AND METHOD OF MAKING SAME | Non-Final OA | Intel Corporation |
| 17553161 | INTEGRATED CIRCUIT STRUCTURES HAVING DIELECTRIC ANCHOR AND CONFINED EPITAXIAL SOURCE OR DRAIN STRUCTURE | Non-Final OA | Intel Corporation |
| 16613406 | ORGANIC ELECTROLUMINESCENT DEVICE | Final Rejection | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 18346558 | FORMATION OF PHOTODIODE ABSORPTION REGION USING A SACRIFICIAL REGION | Non-Final OA | Cisco Technology, Inc. |
| 18317736 | AVALANCHE PHOTODIODE USING A SILICON CAP LAYER | Non-Final OA | Cisco Technology, Inc. |
| 18488050 | LIGHT EMITTING DIODE AND LIGHT EMITTING DEVICE | Non-Final OA | Tianjin Sanan Optoelectronics Co., Ltd. |
| 18476619 | SELECTIVE BOTTOM SEED LAYER FORMATION FOR BOTTOM-UP EPITAXY | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18320425 | SEMICONDUCTOR PACKAGE STRUCTURE | Non-Final OA | MediaTek Singapore Pte. Ltd. |
| 18479892 | ELECTRONIC PACKAGE AND HEAT DISSIPATION STRUCTURE THEREOF | Non-Final OA | SILICONWARE PRECISION INDUSTRIES CO., LTD. |
| 18495989 | SEMICONDUCTOR STRUCTURE HAVING DUMMY ACTIVE REGION | Non-Final OA | Winbond Electronics Corp. |
| 18098760 | THREE-DIMENSIONAL SOURCE CONTACT STRUCTURE AND FABRICATION PROCESS METHOD OF MAKING THE SAME | Final Rejection | National Yang Ming Chiao Tung University |
| 18487781 | LIGHT EMITTING DIODE PACKAGE | Non-Final OA | SEOUL VIOSYS CO., LTD. |
| 17877505 | LIGHT EMITTING MODULE AND DISPLAY APPARATUS BY USING THE SAME | Final Rejection | Seoul Viosys Co., Ltd. |
| 18198024 | METHOD FOR MANUFACTURING GaN_BASED POWER DEVICE AND GaN_BASED POWER DEVICE MANUFACTURED THEREBY | Final Rejection | KOREA ATOMIC ENERGY RESEARCH INSTITUTE |
| 17866062 | CIP PACKAGE | Final Rejection | HARUMOTO TECHNOLOGY (SHEN ZHEN) CO., LTD. |
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