Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2818 2894 2897
This examiner grants 76% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18479820 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17930820 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17872139 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18346558 | FORMATION OF PHOTODIODE ABSORPTION REGION USING A SACRIFICIAL REGION | Non-Final OA | Cisco Technology, Inc. |
| 18317736 | AVALANCHE PHOTODIODE USING A SILICON CAP LAYER | Non-Final OA | Cisco Technology, Inc. |
| 19033078 | INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK | Final Rejection | Intel Corporation |
| 17711978 | MICROELECTRONIC STRUCTURE INCLUDING DIE BONDING FILM BETWEEN EMBEDDED DIE AND SURFACE OF SUBSTRATE CAVITY, AND METHOD OF MAKING SAME | Non-Final OA | Intel Corporation |
| 17553161 | INTEGRATED CIRCUIT STRUCTURES HAVING DIELECTRIC ANCHOR AND CONFINED EPITAXIAL SOURCE OR DRAIN STRUCTURE | Non-Final OA | Intel Corporation |
| 16613406 | ORGANIC ELECTROLUMINESCENT DEVICE | Final Rejection | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 18514862 | MULTI-LAYERED SPACER AND DOUBLE-SIDED COOLING POWER MODULE INCLUDING SAME | Non-Final OA | Kia Corporation |
| 18488050 | LIGHT EMITTING DIODE AND LIGHT EMITTING DEVICE | Non-Final OA | Tianjin Sanan Optoelectronics Co., Ltd. |
| 18476619 | SELECTIVE BOTTOM SEED LAYER FORMATION FOR BOTTOM-UP EPITAXY | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18495840 | METHOD FOR PRODUCING AN INTEGRATED CIRCUIT TO REMEDY DEFECTS OR DISLOCATIONS | Non-Final OA | EM Microelectronic-Marin SA |
| 18191773 | MANUFACTURING PROCESS OF A VERTICAL-CHANNEL SEMICONDUCTOR DEVICE AND VERTICAL-CHANNEL SEMICONDUCTOR DEVICE | Non-Final OA | STMICROELECTRONICS S.r.l. |
| 18495989 | SEMICONDUCTOR STRUCTURE HAVING DUMMY ACTIVE REGION | Non-Final OA | Winbond Electronics Corp. |
| 18487781 | LIGHT EMITTING DIODE PACKAGE | Non-Final OA | SEOUL VIOSYS CO., LTD. |
| 17877505 | LIGHT EMITTING MODULE AND DISPLAY APPARATUS BY USING THE SAME | Final Rejection | Seoul Viosys Co., Ltd. |
| 18175288 | LIGHT EMITTING DIODE WITH VERTICAL STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | ENKRIS SEMICONDUCTOR, INC. |
| 17866062 | CIP PACKAGE | Final Rejection | HARUMOTO TECHNOLOGY (SHEN ZHEN) CO., LTD. |
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