Prosecution Insights
Last updated: October 02, 2026
Application No. 18/148,717

METHODS AND APPARATUS TO DETECT DEFECTS DURING SEMICONDUCTOR CHIP FABRICATION AND/OR TO DEBUG SEMICONDUCTOR CHIPS AFTER FABRICATION

Non-Final OA §102§103
Filed
Dec 30, 2022
Examiner
MEHTA, RATISHA
Art Unit
2817
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Intel Corporation
OA Round
1 (Non-Final)
90%
Grant Probability
Favorable
1-2
OA Rounds
0m
Est. Remaining
95%
With Interview

Examiner Intelligence

Grants 90% — above average
90%
Career Allowance Rate
578 granted / 645 resolved
+21.6% vs TC avg
Moderate +6% lift
Without
With
+5.6%
Interview Lift
resolved cases with interview
Fast prosecutor
2y 0m
Avg Prosecution
34 currently pending
Career history
671
Total Applications
across all art units

Statute-Specific Performance

§101
0.9%
-39.1% vs TC avg
§103
47.4%
+7.4% vs TC avg
§102
27.9%
-12.1% vs TC avg
§112
12.7%
-27.3% vs TC avg
Black line = Tech Center average estimate • Based on career data from 645 resolved cases

Office Action

§102 §103
3DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Election/Restrictions Applicant’s election without traverse of Invention I in the reply filed on 5/29/2026 is acknowledged. Claims 14-26 are withdrawn from further consideration pursuant to 37 CFR 1.142(b) as being drawn to a nonelected Invention, there being no allowable generic or linking claim. Election was made without traverse in the reply filed on 5/29/2026. Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention. Claim(s) 1-8, 11-13 are rejected under 35 U.S.C. 102(a)(2) as being anticipated by Kwon et al (US 2023/0061418; hereinafter Kwon). Regarding claim 1, Fig 4 of Kwon discloses an apparatus comprising: a substrate (110; Fig 4; ¶ [0023]); integrated circuitry (120; Fig 4; ¶ [0025]) on a first side (Bottom side; Fig 4) of the substrate (110; Fig 4; ¶ [0023]); and an array of pins (140/132; Fig 4; ¶ [0022]) extending through the substrate (110; Fig 4; ¶ [0023]), the pins (140/132; Fig 4; ¶ [0022]) including first ends (Bottom ends; Fig 4) on the first side (Bottom side; Fig 4) of the substrate (110; Fig 4; ¶ [0023]) and second ends (132; Fig 4) protruding beyond a second side (Top side; Fig 4) of the substrate opposite the first side. Regarding claim 2, Fig 4 of Kwon discloses the integrated circuitry (120; Fig 4; ¶ [0025]) includes an application-specific integrated circuit (ASIC) with active semiconductor components (¶ [0087]). Regarding claim 3, Fig 4 of Kwon discloses the integrated circuitry includes passive circuitry (¶ [0026]) to enable electrical coupling of the array of pins to external processor circuitry. (¶ [0026], [0087]) Regarding claim 4, Fig 4 of Kwon discloses the second ends (132; Fig 4) of the pins (140/132; Fig 4; ¶ [0022]) are exposed to enable the pins ((140/132; Fig 4; ¶ [0022]) to contact structural features of semiconductor components (220; Fig 4; ¶ [0034]) fabricated on a semiconductor wafer (210; Fig 4; ¶ [0034]), the semiconductor wafer (210; Fig 4; ¶ [0034]) distinct from the substrate (110; Fig 4; ¶ [0023]). Regarding claim 5, Fig 4 of Kwon discloses the semiconductor components (220; Fig 4; ¶ [0034]) correspond to transistors (¶ [0026]) not yet completely fabricated on the semiconductor wafer. Regarding claim 6, Fig 4 of Kwon discloses portions of the pins (140/132; Fig 4; ¶ [0022]) extending between the second side (Top side; Fig 4) of the substrate (110; Fig 4; ¶ [0023]) and the exposed second ends are covered by a dielectric material (231; Fig 4; ¶ [0046]). Regarding claim 7, Fig 4 of Kwon discloses first ones of the pins are to provide an excitation signal to the structural features and second ones of the pins are to capture a response signal based on a path of the excitation signal through the structural features. (¶ [0084]) Regarding claim 8, Fig 4 of Kwon discloses the pins (140/132; Fig 4; ¶ [0022]) are distributed across a first area, the semiconductor wafer (210; Fig 4; ¶ [0034]) including regions corresponding to a plurality of semiconductor chips (220; Fig 4), a first one of the semiconductor chips corresponding to a second area of the semiconductor wafer, a size of the first area of approximately equal the second area (Fig 4). Regarding claim 11, Fig 4 of Kwon discloses the pins (140/132; Fig 4; ¶ [0022]) include cobalt (¶ [0025]). Regarding claim 12, Fig 4 of Kwon discloses the substrate (110; Fig 4; ¶ [0023]) is a semiconductor substrate (Fig 4). Regarding claim 13, Fig 4 of Kwon discloses the substrate is a dielectric substrate (Fig 4). Claim Rejections - 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. Claim(s) 9-10 are rejected under 35 U.S.C. 103 as being unpatentable over Kwon et al (US 2023/0061418; hereinafter Kwon). Regarding claim 9, Kwon does not expressly disclose adjacent ones of the pins are spaced less than 1 µm apart. However, the ordinary artisan would have recognized the size and width of the pins to be a result effective variable affecting pitch or spacing between the pins. Thus, it would have been obvious to vary the size and width of the pins in order to achieve the desired spacing within the claimed range, since optimum or workable ranges of such variables are discoverable through routine experimentation. see MPEP 2144.05 II.B Regarding claim 10, Kwon does not expressly disclose the array of pins include more than 10000 pins. However, the ordinary artisan would have recognized the number of the pins to be a result effective variable affecting the electrical performance. Thus, it would have been obvious to vary the number of the pins within the claimed range, since optimum or workable ranges of such variables are discoverable through routine experimentation. see MPEP 2144.05 II.B Conclusion The prior art made of record and not relied upon is considered pertinent to applicant's disclosure: Jang (US 2022/0102245) Nakamura et al (US 2022/0053648) Any inquiry concerning this communication or earlier communications from the examiner should be directed to RATISHA MEHTA whose telephone number is (571)270-7473. The examiner can normally be reached Monday-Friday: 9:00am - 5:00 pm. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Eliseo Ramos Feliciano can be reached at 571-272-7925. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /RATISHA MEHTA/Primary Examiner, Art Unit 2817
Read full office action

Prosecution Timeline

Dec 30, 2022
Application Filed
Jul 19, 2023
Response after Non-Final Action
Aug 10, 2026
Non-Final Rejection mailed — §102, §103 (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
90%
Grant Probability
95%
With Interview (+5.6%)
2y 0m (~0m remaining)
Median Time to Grant
Low
PTA Risk
Based on 645 resolved cases by this examiner. Grant probability derived from career allowance rate.

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