Detailed Action
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Information Disclosure Statement
The information disclosure statement (IDS) submitted on February 8th, 2023 was filed before the mailing date of the first office action on the merits. The submission is in compliance with the provisions of 37 CFR 1.97. Accordingly, the information disclosure statement is being considered by the examiner.
Drawings
The drawings are objected to under 37 CFR 1.83(a). The drawings must show every feature of the invention specified in the claims. Therefore, the limitations of Claims 8 and 10 must be shown or the features canceled from the claims. The terminal lugs (16) are not shown to be connected to the drive circuit board (20). No new matter should be entered.
Corrected drawing sheets in compliance with 37 CFR 1.121(d) are required in reply to the Office action to avoid abandonment of the application. Any amended replacement drawing sheet should include all of the figures appearing on the immediate prior version of the sheet, even if only one figure is being amended. The figure or figure number of an amended drawing should not be labeled as “amended.” If a drawing figure is to be canceled, the appropriate figure must be removed from the replacement sheet, and where necessary, the remaining figures must be renumbered and appropriate changes made to the brief description of the several views of the drawings for consistency. Additional replacement sheets may be necessary to show the renumbering of the remaining figures. Each drawing sheet submitted after the filing date of an application must be labeled in the top margin as either “Replacement Sheet” or “New Sheet” pursuant to 37 CFR 1.121(d). If the changes are not accepted by the examiner, the applicant will be notified and informed of any required corrective action in the next Office action. The objection to the drawings will not be held in abeyance.
Claim Rejections - 35 USC § 112
The following is a quotation of the first paragraph of 35 U.S.C. 112(a):
(a) IN GENERAL.—The specification shall contain a written description of the invention, and of the manner and process of making and using it, in such full, clear, concise, and exact terms as to enable any person skilled in the art to which it pertains, or with which it is most nearly connected, to make and use the same, and shall set forth the best mode contemplated by the inventor or joint inventor of carrying out the invention.
The following is a quotation of the first paragraph of pre-AIA 35 U.S.C. 112:
The specification shall contain a written description of the invention, and of the manner and process of making and using it, in such full, clear, concise, and exact terms as to enable any person skilled in the art to which it pertains, or with which it is most nearly connected, to make and use the same, and shall set forth the best mode contemplated by the inventor of carrying out his invention.
Claims 8 and 10 are rejected under 35 U.S.C. 112(a) or 35 U.S.C. 112 (pre-AIA ), first paragraph, as failing to comply with the written description requirement. The claim(s) contains subject matter which was not described in the specification in such a way as to reasonably convey to one skilled in the relevant art that the inventor or a joint inventor, or for applications subject to pre-AIA 35 U.S.C. 112, the inventor(s), at the time the application was filed, had possession of the claimed invention.
In this instance, Claim 8 recites “the semiconductor power module is connected in electrically conductive manner by the terminal lugs for the electrical contacting of the semiconductor power module to the drive circuit board”. The applicant’s specification only states that “electrical contacts 14 for connection to a drive circuit board 20” (Page 4, Line 12) and “the power module 10 is connected in electrically conducting manner across the circuit board 12 and the electrical terminal contacts 14 to the drive circuit board 20” (Page 4, Lines 21-23). Therefore, applicant’s specification does not support the limitations of Claim 8.
Similarly, Claim 10 recites “the terminal lugs for the electrical contacting of the semiconductor power module are secured in corresponding openings of the drive circuit board by press-fit”. The applicant’s specification only states that “electrical contacts 14 for connection to a drive circuit board 20” (Page 4, Line 12) and “the power module 10 is connected in electrically conducting manner across the circuit board 12 and the electrical terminal contacts 14 to the drive circuit board 20” (Page 4, Lines 21-23). Therefore, applicant’s specification does not support the limitations of Claim 10.
The following is a quotation of 35 U.S.C. 112(b):
(b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention.
The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph:
The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention.
Claims 4, 6, and 10 are rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention.
Claim 4 recites the limitation "the top side" in line 2. There is insufficient antecedent basis for this limitation in the claim. The limitation will be interpreted as “a top side”.
Claim 6 recites the limitation "the top side" in line 2. There is insufficient antecedent basis for this limitation in the claim. The limitation will be interpreted as “a top side”.
Claim 10 recites the limitation "the terminal lugs" in line 1. There is insufficient antecedent basis for this limitation in the claim. The limitation will be interpreted as “terminal lugs”.
Claim Rejections - 35 USC § 102
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claims 1-4 and 7-10 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Mao et al. (CN 113295913 A; hereinafter Mao).
Regarding Claim 1, Mao (figs. 4-8) teaches a system comprising:
a semiconductor power module ([0038]/[n0019], see fig. 4) encased in a plastic compound ([0038]/[n0019], 2) for a pulse inverter of an electric vehicle ([0009]/[n0005], power modules are used in inverters in vehicles), wherein
a busbar ([0038]/[n0019], 4),
an integrated circuit for current metering ([0038]/[n0019], 5) arranged on a circuit board ([0038]/[n0019], 10), and
a U-shaped shield plate ([0038]/[n0019], 9) surrounding the busbar (4) and the circuit board (10) are embedded in the plastic compound (2) of the semiconductor power module and surrounded by it, while
one end of the busbar (4) and electrical terminal contacts ([0039]/[n0020], 11) of the circuit board (10) protrude from the plastic compound (2).
Regarding Claim 2, Mao (figs. 4-8) teaches terminal lugs ([0039]/[n0020], 12) for the electrical contacting of the semiconductor power module protrude from the plastic compound (2).
Regarding Claim 3, Mao (figs. 4-8) teaches the end of the busbar (4) protrudes from a front face (bottom of fig. 5) of the semiconductor power module.
Regarding Claim 4, Mao (figs. 4-8) teaches the electrical terminal contacts (11) protrude from the top side (top of fig. 6) of the semiconductor power module.
Regarding Claim 7, Mao (figs. 4-8) teaches a drive circuit board ([0039]/[n0020], 3) for the semiconductor power module, wherein the integrated circuit for current metering (5) is connected in electrically conductive manner by the electrical terminal contacts (11) to the drive circuit board (3).
Regarding Claim 8, Mao (figs. 4-8) teaches the semiconductor power module is connected in electrically conductive manner by the terminal lugs (12) for the electrical contacting of the semiconductor power module to the drive circuit board (3).
Regarding Claim 9, Mao (figs. 4-8) teaches a method for manufacturing a system comprising:
a semiconductor power module ([0038]/[n0019], see fig. 4) encased in a plastic compound ([0038]/[n0019], 2) for a pulse inverter of an electric vehicle ([0009]/[n0005], power modules are used in inverters in vehicles), wherein
a busbar ([0038]/[n0019], 4),
an integrated circuit for current metering ([0038]/[n0019], 5) arranged on a circuit board ([0038]/[n0019], 10), and
a U-shaped shield plate ([0038]/[n0019], 9) surrounding the busbar (4) and the circuit board (10) are embedded in the plastic compound (2) of the semiconductor power module and surrounded by it, while
one end of the busbar (4) and electrical terminal contacts ([0039]/[n0020], 11) of the circuit board (10) protrude from the plastic compound (2), and
a drive circuit board ([0039]/[n0020], 3) for the semiconductor power module, wherein the integrated circuit for current metering (5) is connected in electrically conductive manner by the electrical terminal contacts (11) to the drive circuit board (3), the method comprising:
mounting the semiconductor power module ([0039]/[n0020], see fig. 8) on the drive circuit board (3); and
securing the electrical terminal contacts (11) in corresponding openings of the drive circuit board (3) by press-fit ([0040]/[n0021]).
Regarding Claim 10, Mao (figs. 4-8) teaches the terminal lugs ([0038]/[n0019], 12) for the electrical contacting of the semiconductor power module are secured in corresponding openings (see fig. 8) of the drive circuit board (3) by press-fit.
Claim Rejections - 35 USC § 103
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action:
A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made.
Claims 5-6 are rejected under 35 U.S.C. 103 as being unpatentable over Mao as applied to Claim 2 above, and further in view of Cottet et al. (2019/0304946 A1; hereinafter Cottet).
Regarding Claim 5, Mao doesn’t explicitly teach that the terminal lugs for the electrical contacting of the semiconductor power module protrude from a front face of the semiconductor power module.
However, Cottet (fig. 2) teaches the terminal lugs ([0062], 46) for the electrical contacting of the semiconductor power module ([0055], 10) protrude from a front face (right side of fig. 2) of the semiconductor power module (10) while still maintaining the function of providing external electrical contacts. One of ordinary skill in the art could have substituted the terminal lugs of Cottet for the terminal lugs of Mao and yielded the predictable results of providing external electrical contact.
Therefore, it would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to substitute the terminal lugs of Cottet for the terminal lugs of Mao, since simple substitution of terminal lugs for another is an appropriate rationale to support a rejection under 35 U.S.C. 103. KSR International Co. v. Teleflex Inc., 550 U.S. 398, 82 USPQ2d 1385 (2007).
Regarding Claim 6, Cottet (fig. 2) teaches the terminal lugs (46) are bent upward (see fig. 2) and their ends point in the direction of the top side (top of fig. 2) of the semiconductor power module (10).
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to ADIN HRNJIC whose telephone number is (571)270-1794. The examiner can normally be reached Monday-Friday 8:00 AM - 4:30 PM.
Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice.
If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Kretelia Graham can be reached at (571) 272-5055. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000.
/A.H./Examiner, Art Unit 2817
/Kretelia Graham/Supervisory Patent Examiner, Art Unit 2817 June 4, 2025