Prosecution Insights
Last updated: October 02, 2026
Application No. 18/169,761

3D INTEGRATED CHARGE-COUPLED DEVICE MEMORY AND METHOD OF FABRICATING THE SAME

Non-Final OA §103
Filed
Feb 15, 2023
Priority
Feb 16, 2022 — EU 22156961.9
Examiner
BAUMAN, SCOTT E
Art Unit
2815
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Imec Vzw
OA Round
3 (Non-Final)
47%
Grant Probability
Moderate
3-4
OA Rounds
0m
Est. Remaining
74%
With Interview

Examiner Intelligence

Grants 47% of resolved cases
47%
Career Allowance Rate
89 granted / 189 resolved
-20.9% vs TC avg
Strong +27% interview lift
Without
With
+27.1%
Interview Lift
resolved cases with interview
Typical timeline
3y 7m
Avg Prosecution
33 currently pending
Career history
231
Total Applications
across all art units

Statute-Specific Performance

§103
45.4%
+5.4% vs TC avg
§102
24.4%
-15.6% vs TC avg
§112
26.5%
-13.5% vs TC avg
Black line = Tech Center average estimate • Based on career data from 189 resolved cases

Office Action

§103
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Continued Examination Under 37 CFR 1.114 A request for continued examination under 37 CFR 1.114, including the fee set forth in 37 CFR 1.17(e), was filed in this application after final rejection. Since this application is eligible for continued examination under 37 CFR 1.114, and the fee set forth in 37 CFR 1.17(e) has been timely paid, the finality of the previous Office action has been withdrawn pursuant to 37 CFR 1.114. Applicant's submission filed on April 21, 2026 has been entered. Claim Rejections - 35 USC § 103 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. The factual inquiries for establishing a background for determining obviousness under 35 U.S.C. 103 are summarized as follows: 1. Determining the scope and contents of the prior art. 2. Ascertaining the differences between the prior art and the claims at issue. 3. Resolving the level of ordinary skill in the pertinent art. 4. Considering objective evidence present in the application indicating obviousness or nonobviousness. Claim(s) 1, 4-7, 9, 10, 14, 15 are rejected under 35 U.S.C. 103 as being unpatentable over Ookuma et al (U.S. 2021/0134828), Boyle et al (U.S. 3,858,232), and Fukuzumi et al (U.S. 2013/0075918). Regarding claim 1. Ookuma et al discloses a three-dimensional integrated charge-coupled device (CCD) memory (FIG. 1 and 3, [0037]) comprising: a gate stack (FIG. 3, item 44) comprising a plurality of gate layers (FIG. 3, item 62) and spacer layers (FIG. 3, item 46) alternatingly arranged one on the other ([0050]) along a first direction (FIG. 3, item V), a plurality of semiconductor-based channels (FIG. 1, item 54) extending in the gate stack (FIG. 3, item 44), and a plurality of dielectric layers (FIG. 1, item 50), each dielectric layer (FIG. 1, item 50) being arranged between ([0066]) one of the semiconductor-based channels (FIG. 1, item 54) and at least one of the gate layers (FIG. 3, item 62); and a readout layer (FIG. 3, item 90), wherein the gate stack (FIG. 3, item 44) is arranged ([0059]) on the readout layer (FIG. 3, item 90), wherein each ([0066]) semiconductor-based channel (FIG. 1, item 54) forms ([0066]), in combination ([0066]) with the gate layers (FIG. 1, item 62) and at least one ([0066]) of the dielectric layers (FIG. 1, item 50), a string of charge storage capacitors ([0037]-[0038]; , the memory film layer 50 can be a stack, in the order of formation, of a blocking dielectric, a charge storage region (e.g., a charge storage layer)) arranged along the first direction (FIG. 3, item V) wherein each string of charge storage capacitors (FIG. 3, item 42; [0037]-[0038], i.e. The channel and memory structure (e.g., pillar structure) 42 can be formed within each memory opening through the alternating stack 46, 48) is a CCD register ([0037]-[0038]), wherein the readout layer (FIG. 3, item 90) comprises a plurality of readout stages (FIG. 3, item 58) readout stage (FIG. 3, item 58) , a first and second respective CCD register (Annotated FIG. 3; [0037]-[0038]), a first and second respective string of charge storage capacitors (Annotated FIG. 3; [0037]-[0038]) PNG media_image1.png 876 674 media_image1.png Greyscale Ookuma et al fails to explicitly disclose wherein each string of charge storage capacitors is operable as a CCD register, and wherein the readout layer comprises a plurality of readout stages configured to individually readout stored charge from each of the CCD registers, a first and second readout stage. wherein readout stage of respective CCD register is disposed under respective string of charge storage capacitors arranged along the first direction. However, Boyle et al teaches wherein each string of charge storage capacitors (Col 1, lines 46-55) is operable as a CCD register (FIG. 2; Col 3, lines 59 to Col 4 lines 13; i.e. shift register), and wherein the readout layer comprises a plurality of readout stages (FIG. 10, item 85) configured to individually readout stored charge (Col 12, lines 43-59) from each of the CCD registers (FIG. 2), a first (FIG. 10, item channel 1, item 85) and second (FIG. 10, item channel 2, item 85) readout stage. a first (FIG. 10, item channel 1) and second (FIG. 10, item channel 2) respective CCD register (FIG. 2), Since Ookuma et al, and Boyle et al teach memory devices, it would have been obvious to one having ordinary skill in the art of semiconductors before the effective filing date of the claimed invention to have combined the three-dimensional integrated charge-coupled device (CCD) memory as disclosed to modify Ookuma et al and Boyle et al with the teachings of wherein each string of charge storage capacitors is operable as a CCD register as disclosed by Boyle et al. The use of shift registers in Boyle et al provides for a storage medium with sufficient carrier mobility for charge carrier transfer especially important for high speed operation (Boyle et al, [Col 2, lines 15-17]). Ookuma et al and Boyle et al fails to explicitly disclose wherein the readout stage of the respective CCD register is disposed under the respective string of charge storage capacitors arranged along the first direction. However, Fukuzumi et al teaches wherein the readout stage (FIG. 8, items 202; [0074]) of the respective CCD register (FIG. 8, item 111) is disposed under ([0072]-[0075]) the respective string of charge storage capacitors ([0080]) arranged along the first direction (FIG. 8, item Z). Since Ookuma et al, Boyle et al and Fukuzumi et al teach memory devices, it would have been obvious to one having ordinary skill in the art of semiconductors before the effective filing date of the claimed invention to have combined the three-dimensional integrated charge-coupled device (CCD) memory as disclosed to modify Ookuma et al and Boyle et al with the teachings of wherein the readout layer comprises a plurality of readout stages configured to individually readout stored charge from each of the CCD registers wherein the readout stage of the respective CCD register is disposed under the respective string of charge storage capacitors arranged along the first direction as disclosed by Fukuzumi et al. The use data is read, the electrons in the channel layer are transferred downward by the shift operation described in the first embodiment, and the electrons are transferred to the diffusion layer and read as data (Fukuzumi et al, [0074]). Regarding claim 4. Ookuma et al, Boyle et al, and Fukuzumi et al discloses all the limitations of the CCD memory according to claim 1 above. Ookuma et al further discloses wherein at least one semiconductor-based channel is made of a silicon-based semiconductor material ([0042]-[0043]) or III-V semiconductor material. Regarding claim 5. Ookuma et al, Boyle et al, and Fukuzumi et al discloses all the limitations of the CCD memory according to claim 1 above. Boyle et al further discloses wherein each CCD register (FIG. 2; Col 3, lines 59 to Col 4 lines 13; i.e. shift register) is connected to one of the readout stages (FIG. 2, items 28-32; Col 5 lines 11-39), which is configured to readout stored charge (Col 7, lines 33-37) from the connected CCD register (FIG. 2; Col 3, lines 59 to Col 4). Regarding claim 6. Ookuma et al, Boyle et al, and Fukuzumi et al discloses all the limitations of the CCD memory according to claim 1 above. Boyle et al further discloses wherein each CCD register (FIG. 2; Col 3, lines 59 to Col 4 lines 13) is connected to a write stage (FIG. 2; item 25) configured to push charge (Col 6, lines 53-61) into the CCD register (FIG. 2; Col 3, lines 59 to Col 4 lines 13). Regarding claim 7. Ookuma et al, Boyle et al, and Fukuzumi et al discloses all the limitations of the CCD memory according to claim 6 above. Boyle et al further discloses wherein the readout stage (FIG. 2, items 28-32; Col 5 lines 11-39) and the write stage (FIG. 2; item 25) of the CCD register (FIG. 2; Col 3, lines 59 to Col 4 lines 13) are connected to different ends (Col 16, lines 1-23) of the semiconductor-based channel (FIG.2, item 20) that is associated with the CCD register (FIG. 2; Col 3, lines 59 to Col 4 lines 13). Regarding claim 9. Ookuma et al, Boyle et al, and Fukuzumi et al discloses all the limitations of the CCD memory according to claim 1 above. Ookuma et al further discloses wherein at least a part of each semiconductor-based channel (FIG. 1, item 54) extends along the first direction (FIG. 1, item V) and/or extends perpendicular to parallel surfaces of the gate layers (FIG. 1, item 62). Regarding claim 10. Ookuma et al, Boyle et al, and Fukuzumi et al discloses all the limitations of the CCD memory according to claim 1 above. Ookuma et al further discloses wherein at least one semiconductor-based channel (FIG. 3, item 54) is straight in the stack (FIG. 3, item 62). Regarding claim 14. Ookuma et al, Boyle et al, and Fukuzumi et al discloses all the limitations of the CCD memory according to claim 1 above. Ookuma et al further discloses wherein each gate layer (FIG. 1, item 62) surrounds ([0066]) one or more of the semiconductor-based channels (FIG. 1, item 54). Regarding claim 15. Ookuma et al, Boyle et al, and Fukuzumi et al discloses all the limitations of the CCD memory according to claim 1 above. Ookuma et al further discloses wherein the gate stack further comprises an input transfer-gate layer (FIG. 1, item 36) and an output transfer-gate layer (FIG. 1, item 38), which sandwich the gate layers (FIG. 1, item 62) and the spacer layers (FIG. 1, item 46) of the gate stack (FIG. 1, item 36) in the first direction (FIG. 1, item V); wherein the input transfer-gate layer (FIG. 1, item 36) and the output transfer-gate layer (FIG. 1, item 38) respectively comprise a plurality of transfer-gates ([0024]) wherein the output transfer-gate layer (FIG. 1, item 38) of the gate stack (FIG. 1, item 44) is formed ([0045]) on the readout layer (FIG. 1, item 90); and wherein the transfer-gates ([0024]) of the output transfer-gate layer (FIG. 1, item 38) are connected to the readout stages (FIG. 3, item 58) of the readout layer (FIG. 3, item 90). Boyle et al discloses wherein the input transfer-gate layer (Col 6, line 62 through Col 7, line 12) and the output transfer-gate layer (Col 8, lines 5-42) respectively comprise a plurality of transfer-gates (Col 6, line 62 through Col 7, line 12; Col 8, lines 5-42) configured to access the CCD registers (FIG. 2; Col 3, lines 59 to Col 4 lines 13; i.e. shift register); Claims 2 and 3 are rejected under 35 U.S.C. 103 as being unpatentable over Ookuma et al (U.S. 2021/0134828), Boyle et al (U.S. 3,858,232), and Fukuzumi et al (U.S. 2013/0075918) as applied to claim 1 above, and further in view of Sharma et al (U.S. 2019/0198675) Regarding claim 2. Ookuma et al, Boyle et al, and Fukuzumi et al discloses all the limitations of the CCD memory according to claim 1 above. Ookuma et al further discloses wherein at least one semiconductor-based channel is made of a semiconductor material ([0042]-[0043]). Ookuma et al, Boyle et al, and Fukuzumi et al fail to explicitly disclose wherein at least one semiconductor-based channel is made of a semiconductor oxide material However, Sharma et al teaches wherein at least one semiconductor-based channel is made of a semiconductor oxide material ([0040]). Since Ookuma et al, Boyle et al, Fukuzumi et al, and Sharma et al teach transistors, it would have been obvious to one having ordinary skill in the art of semiconductors before the effective filing date of the claimed invention to have combined the three-dimensional integrated charge-coupled device (CCD) memory as disclosed to modify Ookuma et al, Boyle et al, and Fukuzumi et al with the teachings of wherein at least one semiconductor-based channel is made of a semiconductor oxide material as disclosed by Sharma et al. The use of thin channel transistor materials such as IGZO, ITO, IZO in Sharma et al provides for improved lateral area to performance ratio as compared to an integrated circuit based on a planar gate thin film transistor (Sharma et al, [0036]). Regarding claim 3. Ookuma et al, Boyle et al, Fukuzumi et al, and Sharma et al discloses all the limitations of the CCD memory according to claim 2 above. Sharma et al further discloses wherein the semiconductor oxide material ([0040]) comprises at least one of: indium gallium zinc oxide (IGZO), indium tin oxide (ITO), and indium zinc oxide (IZO) ([0040]). Response to Arguments Applicant's arguments filed March 27, 2026 have been fully considered but they are not persuasive. On pages 5 of applicants remarks, applicant appears to argue that Fukuzumi et al Fig. 10 does not teach applicant’s amended claim 1 limitations. Examiner respectfully points out that Fukuzumi et al Figure 10 was not used in the office action, and that Fukuzumi et al Figure 8 was used in the office action. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to SCOTT E BAUMAN whose telephone number is (469)295-9045. The examiner can normally be reached M-F, 9-5 CST. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Joshua Benitez can be reached at 571-270-1435. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /S.E.B./Examiner, Art Unit 2815 /JOSHUA BENITEZ ROSARIO/Supervisory Patent Examiner, Art Unit 2815
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Prosecution Timeline

Feb 15, 2023
Application Filed
Jun 18, 2025
Non-Final Rejection mailed — §103
Oct 14, 2025
Response Filed
Feb 06, 2026
Final Rejection mailed — §103
Mar 27, 2026
Response after Non-Final Action
Apr 21, 2026
Request for Continued Examination
Apr 25, 2026
Response after Non-Final Action
Jul 20, 2026
Non-Final Rejection mailed — §103 (current)

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Prosecution Projections

3-4
Expected OA Rounds
47%
Grant Probability
74%
With Interview (+27.1%)
3y 7m (~0m remaining)
Median Time to Grant
High
PTA Risk
Based on 189 resolved cases by this examiner. Grant probability derived from career allowance rate.

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