Tech Center 2800 • Art Units: 2815
This examiner grants 48% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18133964 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17964900 | OLED PANEL FOR LIGHTING DEVICE WITH MOISTURE INTRUSION DELAY EFFECT | Non-Final OA | LG Display Co., Ltd. |
| 15913621 | ELECTRONIC CIRCUIT WITH GUARD FEATURES FOR RELIABILITY IN HUMID ENVIRONMENTS | Non-Final OA | Texas Instruments Incorporated |
| 14967515 | WAFER ASSEMBLY PACKAGE METHOD FOR INTEGRATED CIRCUIT HAVING MEMS STRUCTURE | Non-Final OA | Texas Instruments Incorporated |
| 17457597 | APPARATUS FOR FABRICATING A SEMICONDUCTOR DEVICE HAVING REDUCED CONTACT RESISTANCE | Final Rejection | Applied Materials, Inc. |
| 18320464 | SEMICONDUCTOR STRUCTURE WITH MEMORY DEVICES AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 17584716 | MEMORY DEVICE WITH DUAL CHANNEL TRANSISTOR | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 17812233 | MEMORY DEVICE ASSEMBLY WITH REDISTRIBUTION LAYER BETWEEN TRANSISTORS AND CAPACITORS | Final Rejection | Micron Technology, Inc. |
| 17372397 | SEMICONDUCTOR DEVICE HAVING PLURAL CELL CAPACITORS EMBEDDED IN EMBEDDING MATERIAL | Final Rejection | Micron Technology, Inc. |
| 18227785 | DETECTION DEVICE AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | Japan Display Inc. |
| 18194654 | SEMICONDUCTOR DEVICE HAVING STORAGE NODE CONTACT PLUGS AND METHOD FOR FABRICATING THE SAME | Non-Final OA | SK hynix Inc. |
| 17974092 | SEMICONDUCTOR DEVICE OF A THREE-DIMENSIONAL STRUCTURE AND METHOD FOR FABRICATING THE SAME | Final Rejection | SK hynix Inc. |
| 18364614 | METHODS FOR REDUCING SCRATCH DEFECTS IN CHEMICAL MECHANICAL PLANARIZATION | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17107420 | METHOD OF FORMING BIOLOGICAL FIELD EFFECT TRANSISTORS INTEGRATED WITH HEATERS | Non-Final OA | Taiwan Semiconductor manufacturing Co., Ltd. |
| 17843077 | Etching Composition for Silicon Nitride Layer and Etching Method Using the Same | Non-Final OA | Industry-Academic Cooperation Foundation, Yonsei University |
| 17693534 | DYNAMIC RANDOM ACCESS MEMORY DEVICES WITH ENHANCED DATA RETENTION AND METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 17849987 | METHOD FOR FORMING A SEMI-BURIED BIT LINE STRUCTURE AND PERIPHERAL GATE SIMULTANEOUSLY | Final Rejection | CHANGXIN MEMORY TECHNOLOGIES, INC. |
| 18111412 | SEMICONDUCTOR DEVICE HAVING A MULTI-PURPOSE CAPACITIVE STRUCTURE | Final Rejection | AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD. |
| 17815895 | THIN-FILM TRANSISTOR CONTROL CIRCUITS | Non-Final OA | Obsidian Sensors, Inc. |
| 17507752 | CASCADED TYPE II SUPERLATTICE INFRARED DETECTOR OPERATING AT 300 K | Non-Final OA | FIREFLY PHOTONICS, LLC |
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