Prosecution Insights
Last updated: July 17, 2026
Application No. 18/171,746

CHIP PACKAGING MODULE AND ELECTRONIC DEVICE

Non-Final OA §102§103
Filed
Feb 21, 2023
Priority
Aug 25, 2020 — CN 202010861960.2 +1 more
Examiner
BULLARD-CONNOR, GENEVIEVE GRACE
Art Unit
2899
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Vivo Mobile Communication Co., Ltd.
OA Round
3 (Non-Final)
50%
Grant Probability
Moderate
3-4
OA Rounds
3m
Est. Remaining
97%
With Interview

Examiner Intelligence

Grants 50% of resolved cases
50%
Career Allowance Rate
7 granted / 14 resolved
-18.0% vs TC avg
Strong +47% interview lift
Without
With
+46.7%
Interview Lift
resolved cases with interview
Typical timeline
3y 8m
Avg Prosecution
38 currently pending
Career history
72
Total Applications
across all art units

Statute-Specific Performance

§103
85.2%
+45.2% vs TC avg
§102
11.4%
-28.6% vs TC avg
§112
3.4%
-36.6% vs TC avg
Black line = Tech Center average estimate • Based on career data from 14 resolved cases

Office Action

§102 §103
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Continued Examination Under 37 CFR 1.114 A request for continued examination under 37 CFR 1.114, including the fee set forth in 37 CFR 1.17(e), was filed in this application after final rejection. Since this application is eligible for continued examination under 37 CFR 1.114, and the fee set forth in 37 CFR 1.17(e) has been timely paid, the finality of the previous Office action has been withdrawn pursuant to 37 CFR 1.114. Applicant's submission filed on March 19 2026 has been entered. Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. (a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention. Claims 1-3 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Hill (US 2005/0087881). Regarding claim 1, Hill discloses a chip packaging module (Figures 3, 4), comprising: a bearing plate (4b), a die (chip 1 and conductive layer 3b), conductive adhesive (9), a connection reinforcing part (10), and a packaging layer (5), wherein the die (1/3b) is electrically connected to the bearing plate (4b) through the conductive adhesive (9, para. [0011] discloses that the connection reinforcing part 10 electrically connects the bearing plate 4b with the die 1/3b, and since the conductive adhesive is solder and electrically conductive, the conductive adhesive 9 also electrically connects the bearing plate 4b to the die 1/3b), the connection reinforcing part (10) is connected to the bearing plate (4b, see Figure 3), at least part of the connection reinforcing part (10) is disposed in the conductive adhesive (9, see Figure 4 where the conductive adhesive 9 embeds the connection reinforcing part 10), and the packaging layer (5) is disposed on the bearing plate (4b), and covers the die (1/3b, the packaging layer 5 covers at least lateral side surfaces of the die 1/3b), the conductive adhesive (9), and the connection reinforcing part (10, see Figure 4); an orthogonal projection of the die (1/3b) onto the bearing plate (4b) at least partially vertically overlaps with an orthogonal projection of the connection reinforcing part (10) onto the bearing plate (4b, see Figure 4 which shows vertical overlap in the vertical direction); and the connection reinforcing part (10) is in direct physical contact with the die (1/3b, see Figures 3 and 4). Regarding claim 2, Hill discloses wherein the connection reinforcing part (10) is buried in the conductive adhesive (9, see Figure 4). Regarding claim 3, Hill discloses wherein the connection reinforcing part (10) is welded to the bearing plate (through solder 9), and the connection reinforcing part (10) is electrically connected to the bearing plate (4b) and the die (1/3b, see para. [0011]). Claim Rejections - 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. Claims 4-6 are rejected under 35 U.S.C. 103 as being unpatentable over Hill as applied to claim 1 above, and further in view of Dando, III et al. (“Dando” US 2007/0159799). Regarding claim 4, Hill discloses wherein the connection reinforcing part (10) comprises a strip-shaped conductive elastic member (“flexible metal-element segments” 10, see para. [0037]), the strip-shaped conductive elastic member (10) is bent in a first preset direction (vertical direction in Figures 3 and 4, see para. [0018] which discloses bending), and the first preset direction is a direction from the bearing plate (4b) to the die (1/3b); the first preset direction (vertical direction in Figures 3 and 4) is perpendicular to the plane where the bearing plate (4b) is located (the bearing plate 4b is located in a horizontal plane, and the first present direction which is the vertical direction is perpendicular to the horizontal direction in Figures 3 and 4). Hill does not explicitly disclose the bearing plate is provided with first pads, two ends of the strip-shaped conductive elastic member are correspondingly welded to the first pads, and the first pads are all located on a same plane where the bearing plate is located. Dando discloses in Figure 6, however, a bearing plate (12) provided with first pads (80b), two ends of the strip-shaped conductive elastic member (76, ends around component 68 connected to the bearing plate 12) are correspondingly welded to the first pads (80b), and the first pads (80b) are all located on a same plane where the bearing plate (12) is located (see Figure 6). It would have been obvious to a person having ordinary skill in the art to incorporate the teachings of Dando into the teachings of Hill to include the pads as claimed for the purpose of enhancing the interface between the bearing plate and the electrical components/dies (Dando, para. [0051]). Regarding claim 5, Hill discloses wherein the strip-shaped conductive elastic member (10) is in a pre-pressed state, and comprises a first section, a second section, and a third section that are formed via bending, a first end of the first section (Figure 3, the first section is a portion of one horse shoe-shaped portion of the conductive elastic member the extends vertically between the bearing plate 4 and the die 1/3b, see also annotated Figure 3 below) is connected to the bearing plate (4b), a second end of the first section (lower end at dotted line in annotated Figure 3) is connected to a first end of the second section (left end of the second section labeled in annotated Figure 3, which is the section of the horse shoe shape that extends horizontally and is directly contacting the die 1/3b), a second end of the second section (right end of the second section in annotated Figure 3) is connected to a first end of the third section (third section is the opposite side of the horse shoe shape to the first section, also extending vertically), a second end of the third section (upper end) is connected to the bearing plate (4b), and the die (1/3b) is in direct physical contact with and electrically connected to (para. [0011]) the second section (see annotated Figure 3). PNG media_image1.png 470 671 media_image1.png Greyscale Regarding claim 6, Hill discloses wherein there are a plurality of strip-shaped conductive elastic members (10, see Figure 5), and the plurality of strip-shaped conductive elastic members (10) are disposed in a second preset direction (horizontal direction of Figure 5, which is the in/out of page direction in Figures 3 and 4) side by side (see Figure 5). Response to Arguments Applicant’s arguments with respect to claims 1-6 have been considered but are moot because the new ground of rejection does not rely on any reference applied in the prior rejection of record for any teaching or matter specifically challenged in the argument. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to Genevieve G Bullard-Connor whose telephone number is (571)270-0609. The examiner can normally be reached Mon-Fri, 9am-5pm. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Dale Page can be reached at 571-270-7877. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /Genevieve G Bullard-Connor/Examiner, Art Unit 2899 /DALE E PAGE/Supervisory Patent Examiner, Art Unit 2899
Read full office action

Prosecution Timeline

Feb 21, 2023
Application Filed
Oct 01, 2025
Non-Final Rejection mailed — §102, §103
Jan 01, 2026
Response Filed
Jan 27, 2026
Final Rejection mailed — §102, §103
Mar 19, 2026
Request for Continued Examination
Mar 25, 2026
Response after Non-Final Action
Jun 25, 2026
Non-Final Rejection mailed — §102, §103 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12685163
SEMICONDUCTOR DEVICE
3y 8m to grant Granted Jul 14, 2026
Patent 12667010
SEMICONDUCTOR DEVICE
3y 6m to grant Granted Jun 23, 2026
Patent 12525517
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
3y 5m to grant Granted Jan 13, 2026
Study what changed to get past this examiner. Based on 3 most recent grants.

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Prosecution Projections

3-4
Expected OA Rounds
50%
Grant Probability
97%
With Interview (+46.7%)
3y 8m (~3m remaining)
Median Time to Grant
High
PTA Risk
Based on 14 resolved cases by this examiner. Grant probability derived from career allowance rate.

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