Tech Center 2800 • Art Units: 2899
This examiner grants 43% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18044637 | SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND MOBILE BODY | Non-Final OA | Mitsubishi Electric Corporation |
| 18004429 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 17814298 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Mitsubishi Electric Corporation |
| 17820151 | SEMICONDUCTOR MOUNTING STRUCTURE | Final Rejection | FUJIFILM Corporation |
| 18060569 | SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE | Final Rejection | NIDEC CORPORATION |
| 18134684 | POWER MODULE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | Kia Corporation |
| 17850688 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 17873060 | 3D SEMICONDUCTOR PACKAGE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17708890 | HETEROGENEOUS PACKAGES HAVING THERMAL TOWERS | Final Rejection | Intel Corporation |
| 17705878 | PACKAGE LAYERS FOR STRESS MONITORING AND METHOD | Final Rejection | Intel Corporation |
| 17698430 | MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS | Non-Final OA | Intel Corporation |
| 17698365 | MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS | Final Rejection | Intel Corporation |
| 17552581 | MICROELECTRONIC ASSEMBLIES WITH GLASS SUBSTRATES AND THIN FILM CAPACITORS | Non-Final OA | Intel Corporation |
| 18303693 | SEMICONDUCTOR PACKAGE | Non-Final OA | MEDIATEK INC. |
| 17872005 | LIDDED SEMICONDUCTOR PACKAGE | Final Rejection | MEDIATEK INC. |
| 17866566 | SEMICONDUCTOR PACKAGE WITH REDUCED CONNECTION LENGTH | Final Rejection | MEDIATEK INC. |
| 18333036 | ELECTRONIC COMPONENT PACKAGE | Final Rejection | Murata Manufacturing Co., Ltd. |
| 18329387 | METHODS FOR MOUNTING AN ELECTRONIC PACKAGE TO A CIRCUIT BOARD | Final Rejection | Skyworks Solutions, Inc. |
| 18297971 | DUAL-SIDED MOLDED PACKAGE WITH EXPOSED BACKSIDE DIE FOR THERMAL DISSIPATION | Non-Final OA | Skyworks Solutions, Inc. |
| 17891634 | INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17684202 | Multi-Bandgap Charge-Coupled Device (CCD) | Final Rejection | The Board of Regents of the University of Oklahoma |
| 17956682 | ELECTRONIC PACKAGE | Non-Final OA | Advanced Semiconductor Engineering, Inc. |
| 18295217 | POWER MODULE UTILIZING INJECTABLE CONDUCTIVE COMPONENT FOR DIRECT COOLING | Final Rejection | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 17814566 | HETEROGENEOUS EMBEDDED POWER DEVICE PACKAGE USING DAM AND FILL | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18223838 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE | Non-Final OA | STMicroelectronics S.r.l. |
| 17977640 | Semiconductor Package with Molded Heat Dissipation Plate | Final Rejection | Infineon Technologies Austria AG |
| 17711084 | SELECTIVE ETCHING OF SILICON LAYERS IN A SEMICONDUCTOR DEVICE | Final Rejection | MACOM Technology Solutions Holdings, Inc. |
| 17958102 | Thermal management techniques for high power integrated circuits operating in dry cryogenic environments | Non-Final OA | FormFactor, Inc. |
| 18096091 | PACKAGING STRUCTURE AND PACKAGING METHOD | Non-Final OA | Semiconductor Manufacturing International (Beijing) Corporation |
| 18447315 | SEMICONDUCTOR DEVICES WITH PYRAMIDAL SHIELDING AND METHOD FOR MAKING THE SAME | Non-Final OA | STATS ChipPAC Pte. Ltd. |
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