Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2899
This examiner grants 50% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18332105 | SEMICONDUCTOR PACKAGE | Final Rejection | Samsung Electronics Co., Ltd. |
| 18043605 | SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING THE SAME, AND POWER CONVERSION DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18004429 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 17892297 | SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE USING SAME | Non-Final OA | Mitsubishi Electric Corporation |
| 17814298 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Mitsubishi Electric Corporation |
| 18060569 | SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE | Final Rejection | NIDEC CORPORATION |
| 17973939 | SEMICONDUCTOR DIE SHIELDING STRUCTURE | Non-Final OA | Cypress Semiconductor Corporation |
| 17850688 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 17820151 | SEMICONDUCTOR MOUNTING STRUCTURE | Final Rejection | FUJIFILM Corporation |
| 17708890 | HETEROGENEOUS PACKAGES HAVING THERMAL TOWERS | Final Rejection | Intel Corporation |
| 17705878 | PACKAGE LAYERS FOR STRESS MONITORING AND METHOD | Final Rejection | Intel Corporation |
| 17698430 | MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS | Non-Final OA | Intel Corporation |
| 17698365 | MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS | Final Rejection | Intel Corporation |
| 17552581 | MICROELECTRONIC ASSEMBLIES WITH GLASS SUBSTRATES AND THIN FILM CAPACITORS | Non-Final OA | Intel Corporation |
| 18134684 | POWER MODULE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Kia Corporation |
| 17888625 | Method for Producing Power Semiconductor Module and Power Semiconductor Module | Non-Final OA | Huawei Digital Power Technologies Co., Ltd. |
| 17872005 | LIDDED SEMICONDUCTOR PACKAGE | Final Rejection | MEDIATEK INC. |
| 17866566 | SEMICONDUCTOR PACKAGE WITH REDUCED CONNECTION LENGTH | Final Rejection | MEDIATEK INC. |
| 18333036 | ELECTRONIC COMPONENT PACKAGE | Final Rejection | Murata Manufacturing Co., Ltd. |
| 18099951 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18151222 | Integrated Circuit Packages and Methods of Forming the Same | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17891634 | INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17684202 | Multi-Bandgap Charge-Coupled Device (CCD) | Final Rejection | The Board of Regents of the University of Oklahoma |
| 18202272 | Package, Lead Frame and Roughening Method Thereof | Final Rejection | Diodes Incorporated |
| 18329387 | METHODS FOR MOUNTING AN ELECTRONIC PACKAGE TO A CIRCUIT BOARD | Final Rejection | Skyworks Solutions, Inc. |
| 17814566 | HETEROGENEOUS EMBEDDED POWER DEVICE PACKAGE USING DAM AND FILL | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 17977640 | Semiconductor Package with Molded Heat Dissipation Plate | Final Rejection | Infineon Technologies Austria AG |
| 18321129 | PACKAGE STRUCTURE INCLUDING A PACKAGE LID HAVING A PATTERNED BOTTOM SURFACE AND METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18110009 | THERMAL INTERFACE MATERIAL LAYER PROTECTION STRUCTURES AND METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18447315 | SEMICONDUCTOR DEVICES WITH PYRAMIDAL SHIELDING AND METHOD FOR MAKING THE SAME | Non-Final OA | STATS ChipPAC Pte. Ltd. |
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