Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2899
This examiner grants 50% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18739548 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18171746 | CHIP PACKAGING MODULE AND ELECTRONIC DEVICE | Non-Final OA | VIVO MOBILE COMMUNICATION CO., LTD. |
| 17820151 | SEMICONDUCTOR MOUNTING STRUCTURE | Final Rejection | FUJIFILM Corporation |
| 17708890 | HETEROGENEOUS PACKAGES HAVING THERMAL TOWERS | Final Rejection | Intel Corporation |
| 17705878 | PACKAGE LAYERS FOR STRESS MONITORING AND METHOD | Final Rejection | Intel Corporation |
| 17698430 | MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS | Final Rejection | Intel Corporation |
| 17552581 | MICROELECTRONIC ASSEMBLIES WITH GLASS SUBSTRATES AND THIN FILM CAPACITORS | Final Rejection | Intel Corporation |
| 18044637 | SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND MOBILE BODY | Final Rejection | Mitsubishi Electric Corporation |
| 18004429 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Final Rejection | Mitsubishi Electric Corporation |
| 18065509 | SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Mitsubishi Electric Corporation |
| 18303693 | SEMICONDUCTOR PACKAGE | Final Rejection | MEDIATEK INC. |
| 17866566 | SEMICONDUCTOR PACKAGE WITH REDUCED CONNECTION LENGTH | Final Rejection | MEDIATEK INC. |
| 17812786 | SEMICONDUCTOR PACKAGE ASSEMBLY | Final Rejection | MEDIATEK INC. |
| 18513430 | MICROELECTRONIC DEVICES INCLUDING STADIUM STRUCTURES, AND RELATED MEMORY DEVICES AND ELECTRONIC SYSTEMS | Non-Final OA | Micron Technology, Inc. |
| 18507100 | MEMORY DEVICE AND METHOD OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18366620 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17833208 | Semiconductor Device and Method Forming Same | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18223838 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE | Final Rejection | STMicroelectronics S.r.l. |
| 18297971 | DUAL-SIDED MOLDED PACKAGE WITH EXPOSED BACKSIDE DIE FOR THERMAL DISSIPATION | Final Rejection | Skyworks Solutions, Inc. |
| 18153761 | ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | NEXPERIA B.V. |
| 17850688 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 17951366 | PACKAGED FLIP CHIP RADIO FREQUENCY TRANSISTOR AMPLIFIER CIRCUITS | Non-Final OA | MACOM Technology Solutions Holdings, Inc. |
| 17711084 | SELECTIVE ETCHING OF SILICON LAYERS IN A SEMICONDUCTOR DEVICE | Final Rejection | MACOM Technology Solutions Holdings, Inc. |
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