Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2899
This examiner grants 46% of resolved cases
Genevieve Grace Bullard-Connor works in Tech Center 2800 and Art Unit 2899. Her profile includes 24 resolved cases, with an allowance rate pct of 45.8. This shows that less than half of the applications she examines result in a patent grant. The median days to allowance for these successful cases is 1419, which outlines the timeframe for prosecution in her unit from filing to grant.
The interview lift pct of 41.4 is a significant metric for practitioners. It indicates that interviews are effective at increasing the probability of an allowance. In Art Unit 2899, the 41.4 interview lift pct suggests that oral advocacy is a key strategy for overcoming rejections and moving toward the 45.8 allowance rate pct from the 24 resolved cases. This lift is a strong indicator of examiner receptivity.
With 24 resolved cases, the examiner's data provides a picture of her examination style. The 1419 median days to allowance reflects a long prosecution cycle, but the 41.4 interview lift pct offers a way to improve outcomes. Applicants should consider the 45.8 allowance rate pct as a baseline and use interviews to maximize their chances of success in Tech Center 2800.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18739548 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18648097 | SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17820151 | SEMICONDUCTOR MOUNTING STRUCTURE | Final Rejection | FUJIFILM Corporation |
| 17698430 | MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS | Final Rejection | Intel Corporation |
| 17550236 | MICROELECTRONIC ASSEMBLIES WITH GLASS SUBSTRATES AND PLANAR INDUCTORS | Non-Final OA | Intel Corporation |
| 17481257 | MOAT PROTECTION TO PREVENT CRACK PROPAGATION IN GLASS CORE SUBSTRATES OR GLASS INTERPOSERS | Non-Final OA | Intel Corporation |
| 18043605 | SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING THE SAME, AND POWER CONVERSION DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 17892297 | SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE USING SAME | Final Rejection | Mitsubishi Electric Corporation |
| 18289002 | DISPLAY DEVICE AND MANUFACTURING METHOD OF DISPLAY DEVICE | Non-Final OA | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| 18513736 | OPTIMIZED INNER SPACER WITH BACKSIDE CONTACT | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18223838 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE | Final Rejection | STMicroelectronics S.r.l. |
| 18635310 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18404467 | REDUCTION OF SIZE OF EDGE CELL REGION IN MEMORY DEVICES | Final Rejection | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18507100 | MEMORY DEVICE AND METHOD OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18099951 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 17873060 | 3D SEMICONDUCTOR PACKAGE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17891634 | INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17833208 | Semiconductor Device and Method Forming Same | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18321129 | PACKAGE STRUCTURE INCLUDING A PACKAGE LID HAVING A PATTERNED BOTTOM SURFACE AND METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18110009 | THERMAL INTERFACE MATERIAL LAYER PROTECTION STRUCTURES AND METHODS OF FORMING THE SAME | Final Rejection | Taiwan Semiconductor Manufacturing Company Limited |
| 18612241 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18509410 | HYBRID BONDED INVERTED MEMORY-LOGIC STACK | Non-Final OA | Advanced Micro Devices, Inc. |
| 18329387 | METHODS FOR MOUNTING AN ELECTRONIC PACKAGE TO A CIRCUIT BOARD | Non-Final OA | Skyworks Solutions, Inc. |
| 18297971 | DUAL-SIDED MOLDED PACKAGE WITH EXPOSED BACKSIDE DIE FOR THERMAL DISSIPATION | Final Rejection | Skyworks Solutions, Inc. |
| 18376450 | ELECTROSTATIC DISCHARGE PROTECTION DEVICE | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 17814566 | HETEROGENEOUS EMBEDDED POWER DEVICE PACKAGE USING DAM AND FILL | Final Rejection | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
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