DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Election/Restrictions
Applicant’s election without traverse of Invention II (including claims 8-9) in the reply filed on 10/28/2025 is acknowledged.
Claims 1-7 are withdrawn from further consideration pursuant to 37 CFR 1.142(b) as being drawn to a nonelected invention, there being no allowable generic or linking claim. Election was made without traverse in the reply filed on 10/28/2025.
Priority
Receipt is acknowledged of certified copies of papers required by 37 CFR 1.55.
Status of Claims
Claims 1-9 are pending.
Claims 1-7 are withdrawn.
Claims 8-9 are original.
Claims 8-9 are rejected herein.
Specification
The title of the invention is not descriptive. A new title is required that is clearly indicative of the invention to which the claims are directed.
The following title is suggested: SEMICONDUCTOR MODULE WITH RESIN HOUSING HAVING FACING SIDEWALLS EACH INCLUDING A WIRING BAR.
The lengthy specification has not been checked to the extent necessary to determine the presence of all possible minor errors. Applicant’s cooperation is requested in correcting any errors of which applicant may become aware in the specification.
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
(a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention.
Claim 8 is rejected under 35 U.S.C. 102(a)(1) as being anticipated by Takeuchi (US 4635026 A).
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ANNOTATED FIG. 4 OF TAKEUCHI
Regarding claim 8, Takeuchi discloses (see generally, e.g., annotated FIG. 4 herein):
A semiconductor module (see FIG. 4), comprising:
a housing (6) formed of a resin (column 6, lines 17-19), the housing (6) including a first sidewall (upper sidewall), a second sidewall (lower sidewall) facing the first sidewall (upper sidewall), and a third sidewall (right sidewall) connecting an end (right end) of the first sidewall (upper sidewall) and an end (right end) of the second sidewall (lower sidewall),
a first wiring bar (5) inscribed to the resin of the first sidewall (upper sidewall), the first wiring bar (5) extending in an extending direction (horizontally) of the first sidewall (upper sidewall), and
a second wiring bar (4) inscribed to the resin of the second sidewall (lower sidewall), the second wiring bar (4) extending in the extending direction (horizontally) of the first sidewall (upper sidewall),
wherein the first wiring bar (5) and the second wiring bar (4) are electrically connected to an outside (exterior) of the housing (6) from the resin of the third sidewall (right sidewall).
Note, Applicant’s specification explicitly recites that the state of being “inscribed” means that a wiring bar contacts the resin of the sidewall from the inside of the housing. See, e.g., paragraph [0086]. Accordingly, insomuch Takeuchi discloses that the first wiring bar (5) contacts the resin of the first sidewall (upper sidewall) from the inside of the housing (6), the first wiring bar (5) is “inscribed” to the resin of the first sidewall (upper sidewall) as claimed.
Claim 9 is rejected under 35 U.S.C. 102(a)(1) as being anticipated by Takeuchi (US 4635026 A), as evidenced by NPL1 ("Hollow." Merriam-Webster.com Dictionary, Merriam-Webster, www.merriam-webster.com/dictionary/hollow. Accessed 24 Nov. 2025).
Regarding claim 9, Takeuchi as applied to claim 8 discloses the semiconductor module (see FIG. 4) according to claim 8.
Takeuchi further discloses wherein the housing (6) has a hollow (H) formed therein, adjacent to the third sidewall (right sidewall) of the housing (6), and extending to the first sidewall (upper sidewall) through the resin between the first wiring bar (5) and the second wiring bar (4).
Note, under the broadest reasonable interpretation (BRI), a “hollow” is an unfilled space or a depressed or low part of a surface. As evidence, see, e.g., NPL1, page 2, defining the noun “hollow.” Accordingly, the region (H) reads on a hollow as claimed insomuch as the region (H) is an unfilled space and/or depression which extends vertically through the resin of the third sidewall (right sidewall). That is to say, the hollow (H) defines a depression and/or an unfilled space in the resin of the right sidewall, e.g., as compared to at the protruding part (61) of the right sidewall, the resin of the right sidewall corresponding to the location of the hollow (H) is depressed or thinned leaving an unfilled space. The hollow (H) also extends to the first sidewall (upper sidewall). See, e.g., annotated FIG. 4 herein. To the extent that the hollow (H) extends vertically between the protruding part (61) and the upper sidewall, the hollow (H) extends through the resin. Additionally, the hollow (H) extends through the resin at a location between the first wiring bar (5) and the second wiring bar (4). In short, under the BRI, a hollow extending to the first sidewall through the resin between the first wiring bar and the second wiring bar is being read as an unfilled space or depression in the resin forming the housing, wherein the unfilled space or depression reaches (i.e., extends to) the first sidewall and is located between the first and second wiring bars. The indicated hollow (H) satisfies such a reading.
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to JOHN P CORNELY whose telephone number is (571)272-4172. The examiner can normally be reached Monday - Thursday 8:30 AM - 4:00 PM.
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If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Davienne Monbleau can be reached at (571) 272-1945. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
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JOHN P. CORNELY
Examiner
Art Unit 2812
/J.P.C./Examiner, Art Unit 2812
/DAVIENNE N MONBLEAU/Supervisory Patent Examiner, Art Unit 2812
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