Prosecution Insights
Last updated: October 02, 2026

Examiner: CORNELY, JOHN PATRICK

Tech Center 3700 • Art Units: 2812 2826 3761

This examiner grants 75% of resolved cases

Analysis

John Patrick Cornely serves in Tech Center 3700 and Art Unit 2812. He has overseen 80 resolved cases. The allowance rate for these applications is 75.0%. The median days to allowance for these resolutions is 1293 days. This 1293-day duration serves as a benchmark for the time required to reach a grant.

The data also shows an interview lift of 16.3%. This figure indicates that cases involving an interview have a higher probability of allowance than those that do not. With 80 resolved cases, the 75.0% allowance rate is a primary indicator of prosecution outcomes in Art Unit 2812. The 16.3% lift suggests that oral communication is a factor in securing a favorable result. Applicants in Tech Center 3700 can use these figures to inform their strategy.

Written from this page's own data; every figure is computed from USPTO records and verified before publication.

Performance Statistics

75.0%
Allow Rate
+5.0% vs TC avg
94
Total Applications
+16.3%
Interview Lift
1293
Avg Prosecution Days
Based on 80 resolved cases, 2023–2026

Rejection Statute Breakdown

0%
§101 Eligibility
25.8%
§102 Novelty
49.5%
§103 Obviousness
22.3%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
17580059 LIGHT EMITTING ELEMENT INCLUDING SEMICONDUCTOR LAYER HAVING HYDROGEN CONCENTRATION GRADIENT Non-Final OA Samsung Display Co., LTD.
18492051 HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE Final Rejection Murata Manufacturing Co., Ltd.
18172698 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE Non-Final OA FUJI ELECTRIC CO., LTD.
17780260 QUANTUM DOT, WAVELENGTH CONVERSION MATERIAL, BACKLIGHT UNIT, IMAGE DISPLAY DEVICE, AND METHOD FOR PRODUCING QUANTUM DOT Final Rejection SHIN-ETSU CHEMICAL CO., LTD.
18523952 DISPLAY PANEL Final Rejection Guangzhou China Star Optoelectronics Semiconductor Display Technology Co., LTd.
18749681 Preparation Method of Chip Package Structure and Package Structure Non-Final OA Guangdong Fozhixin Microelectronics Technology Research Co., Ltd

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