Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Information Disclosure Statement
The information disclosure statement (IDS) submitted on 2/24/2023 was filed before the mailing date of the Non-final rejection on 9/28/2025. The submission is in compliance with the provisions of 37 CFR 1.97. Accordingly, the information disclosure statement is being considered by the examiner.
Drawings
The formal drawings filed on 2/24/2023 have been approved by the examiner.
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claims 1, 3-5, 14, and 16-18 are rejected under 35 U.S.C. 102(a)(1) as being clearly anticipated by Hasegawa et al. (US 2015/0028462).
With respect to Claims 1 and 14, Hasegawa teaches an electronic component 3 attached to a package substrate 1,2 , wherein the package substrate 1, 2 having an exposed surface on the microelectronic device. A lead 9 electrically connected to the electronic component 3, wherein the lead 9 extending away from the exposed surface of the package substrate 1, 2. A shielding dielectric material 14 laterally surrounding the lead 9. A heatsink 102 attached to the exposed surface of the package substrate
(see paragraph 39-54; Figs. 1A-1C and 2).
With respect to Claims 3 and 16, Hasegawa teaches the microelectronic device includes a carrier 111 located opposite from the exposed surface of the package substrate. The lead 9 extending through the carrier 111 (see Fig. 2).
With respect to Claims 4 and 17, Hasegawa teaches a second electronic component 7 attached to the package substrate. A second lead 9 electrically connected to the second electronic component 7 and extending away from the exposed surface of the package substrate, and laterally surrounded by the shielding dielectric material (see Fig. 2).
With respect to Claims 5 and 18, Hasegawa teaches the lead has a straight configuration extending away from the exposed surface of the package substrate (see Fig. 2).
Claim Rejections - 35 USC § 103
The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action:
A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made.
The factual inquiries for establishing a background for determining obviousness under 35 U.S.C. 103 are summarized as follows:
1. Determining the scope and contents of the prior art.
2. Ascertaining the differences between the prior art and the claims at issue.
3. Resolving the level of ordinary skill in the pertinent art.
4. Considering objective evidence present in the application indicating obviousness or nonobviousness.
Claims 6, 7, 12, and 13 are rejected under 35 U.S.C. 103 as being unpatentable over Hasegawa et al.(US 2015/0028462) as applied to claims 1 and 14 above, and further in view of Kim et al. (US2023/0245942).
With respect to Claim 6, 7, 12, and 13, Hasegawa discloses the claimed invention except for the lead has a J-lead configuration or a gull wing configuration. However, it is well known in the semiconductor industry to have a lead modified in the shape of a J-lead configuration or a gull wing configuration as evident by Kim (see paragraph 19; Fig. 1C).
Allowable Subject Matter
9. Claims 8-13 are allowed.
10. Claims 2 is objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims.
11. The following is a statement of reasons for the indication of allowance subject matter: none of the prior art of record does not teach or suggest the combination of the electronic component and the package substrate are contacted by an encapsulation material, separate from the shielding dielectric material in claim 2.
Forming a shielding dielectric material laterally surrounding a lead. The lead, the electronic component, and the package substrate are contacted by encapsulation material. An exposed surface of the package substrate extends through the encapsulation material and is exposed on the microelectronic device in claim 8.
The prior art made of record and not relied upon is cited primarily to show the product of the instant invention.
Conclusion
12. Any inquiry concerning the communication or earlier communications from the examiner should be directed to Alonzo Chambliss whose telephone number is (571) 272-1927.
If attempts to reach the examiner by telephone are unsuccessful, the examiner's supervisor, Jacob Y. Choi can be reached on (469) 295-9060. The fax phone number for the organization where this application or proceeding is assigned is (571) 273-8300.
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AC/September 28, 2025 /Alonzo Chambliss/
Primary Examiner, Art Unit 2897