Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2814 2892 2897
This examiner grants 90% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18367704 | INTEGRATED CIRCUIT DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18359098 | SEMICONDUCTOR MODULE, POWER CONVERTER, AND POWER CONVERTER MANUFACTURING METHOD | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18129400 | BACKSIDE TRANSISTOR CONTACT SURROUNDED BY OXIDE | Non-Final OA | Intel Corporation |
| 17747166 | Memory Arrays Comprising Strings Of Memory Cells And Methods Used In Forming A Memory Array Comprising Strings Of Memory Cells | Non-Final OA | Micron Technology, Inc. |
| 18533252 | ELECTRONIC DEVICES WITH SUBSTRATES LESS THAN 50 µm THICK AND METHODS OF MANUFACTURE | Non-Final OA | Microchip Technology Incorporated |
| 18869222 | OPTO-ELECTRONIC DEVICE WITH TRANSPARENT APERTURES IN NON-UNIFORM LAYOUT | Non-Final OA | OTI LUMIONICS INC. |
| 18343845 | METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE ASSEMBLY AND A SEMICONDUCTOR PACKAGE ASSEMBLY MANUFACTURED USING THIS METHOD | Non-Final OA | NEXPERIA B.V. |
| 18345308 | TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18344292 | FLIP CHIP AND PRE-MOLDED CLIP POWER MODULES | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
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