Prosecution Insights
Prosecution Insights
Tech Center 3700 • Art Units: 2800 2814 2838 2892 2897 3722
This examiner grants 90% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18639331 | SEMICONDUCTOR DEVICE WITH POROUS CAPILLARY STRUCTURE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18635635 | THREE DIMENSIONAL SWITCHING VOLTAGE REGULATOR | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18700731 | Organic Light-Emitting Transistor, Manufacturing Method thereof, Light Emitting Substrate, and Display Apparatus | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18753973 | ELECTRONIC DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18625458 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 17879672 | DISPLAY DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME | Final Rejection | Samsung Display Co., Ltd. |
| 18825302 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION |
| 18782893 | LIGHT DETECTION DEVICE AND LIGHT DETECTION SYSTEM | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18895330 | SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE | Non-Final OA | VueReal Inc. |
| 18331964 | EMBEDDED SEMICONDUCTOR DEVICE | Non-Final OA | Intel Corporation |
| 18798747 | SEMICONDUCTOR DEVICE AND METHOD OF MOUNTING SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18770603 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18734813 | INCREASED BACKSIDE SOURCE/DRAIN CONTACT AREA AND SOURCE/DRAIN VOLUME | Non-Final OA | International Business Machines Corporation |
| 18641849 | SEMICONDUCTOR MODULE ARRANGEMENTS | Non-Final OA | Infineon Technologies AG |
| 18629224 | HIGH-PERFORMANCE SEMICONDUCTOR FAN OUT PACKAGE | Final Rejection | Micron Technology, Inc |
| 18782439 | HIGH ASPECT RATIO BOSCH DEEP ETCH | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18407524 | SEMICONDUCTOR DEVICE WITH HYBRID SUBSTRATE AND MANUFACTURING METHODS THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18783688 | IPD MODULES WITH FLEXIBLE CONNECTION SCHEME IN PACKAGING | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18639882 | COMMON CO-PIXEL OLED DEVICE | Non-Final OA | Applied Materials, Inc. |
| 18736590 | SEMICONDUCTOR INTERCONNECT STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | United Microelectronics Corp. |
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