DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Election/Restrictions
Applicant’s election without traverse of Group 1, Species 2 in the reply filed on 12/15/25 is acknowledged.
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claim(s) 1-2, 9-10, 12 is/are rejected under 35 U.S.C. 102a1 as being anticipated by Jiang et al (US 2009/0039523).
1. An integrated package device, comprising: at least one package module, comprising: a first sub-package module (Fig. 3 (10D- note 10C; 10B could also be interpreted as this upper module) and [0022/0024]) comprising first electronic devices (Fig.1-3 (12) and [[0018]) and a first molding body (Fig.1-3 (20) and [0018]) encapsulating the first electronic devices (Fig.1-3 (12) and [[0018]), and each of the first electronic devices (Fig.1-3 (12) and [[0018]) including a first pad (Fig.1-3 (14) and [0018]) on a side (top) thereof;
a second sub-package module (Fig.3 (10C- note 10b/10A could also be interpreted as the lower module) and [0022/0024]) stacked on a side of the first sub-package module (Fig. 3 (10D) and [0022/0024]) away (bottom) from the first pad (Fig.1-3 (14) and [0018]) and comprising second electronic devices (Fig.1-3 (12) and [[0018]) and a second molding body encapsulating (Fig.1-3 (20) and [0018]) the second electronic devices (Fig.1-3 (12) and [[0018]), each of the second electronic devices (Fig.1-3 (12) and [[0018]) including a second pad (Fig.1-3 (14) and [0018]) on a side (top) thereof;
a first re-distribution layer (Fig.1-3 (16 and [0018]) located on a side (top) of the first sub-package module (Fig. 3 (10D) and [0022/0024]) away from the second sub-package module (Fig. 3 (10C) and [0022/0024]) and connected with the first pads (Fig.1-3 (14) and [0018]); and
a second re-distribution layer (Fig.1-3 (16 and [0018]) located on a side (top) of the second sub-package module (Fig. 3 (10C) and [0022/0024]) away from the first sub-package module (Fig. 3 (10D) and [0022/0024]) and connected with each of the second pads (Fig.1-3 (14) and [0018]).
2. The device of claim 1, wherein the at least one package module further comprises: a through-molding via (TMV) (Fig.1-3 (18 and [0018]) extending through the first molding body (Fig.1-3 (20) and [0018]) and the second molding body (Fig.1-3 (20) and [0018]) and connecting the first re-distribution layer (Fig.1-3 (16 and [0018]) and the second re-distribution layer (Fig.1-3 (16 and [0018]).
9. The device of claim 2, wherein: the first electronic devices (Fig.1-3/7G-7I (12) and [[0018]) and the second electronic devices (Fig.1-3/7G-7I (12) and [[0018]) are arranged respectively in at least two columns (Fig.2-3/7G-7I) and [0019-0020]) of electronic devices in a lateral direction(Fig.1-3/7G-7I (12) and [[0018]) perpendicular to a direction in which the first sub-package module (Fig.1-3/7G-7I (12) and [[0018]) and the second sub-package module (Fig.1-3/7G-7I (12) and [[0018]) are stacked, and the TMV (Fig.2-3/7G-7I (18) and [0018]) is located on an outer side of one column of the electronic devices away from the other column (Fig.2-3/7G-7I (18) and [0018]).
10. The device of claim 2, wherein the first electronic devices (Fig.1-3/7G-7I (12) and [[0018]) and the second electronic devices (Fig.1-3/7G-7I (12) and [[0018]) are arranged respectively in at least two columns of the electronic devices (Fig.1-3/7G-7I (12) and [[0018]) in a lateral direction perpendicular to a direction in which the first sub-package module (Fig.1-3/7G-7I (12/10A-D) and [[0018]) and the second sub-package module are stacked (Fig.1-3/7G-7I (12/10A-D) and [[0018]); and the TMV (Fig.2-3/7G-7I (18) and [0018]) is located between the two columns of the electronic devices, and there is at least one TMV (Fig.2-3/7G-7I (18) and [0018]).
12. The device of claim 2, wherein: the at least one package module (Fig.1-3/7G-7I (12/10A-D) and [[0018]) further comprises an external connection structure (Fig.1-3 (24) and [0018]) located on a side of the second re-distribution layer (Fig.1-3 (16 and [0018]) away from the second electronic devices (Fig.1-3/7G-7I (12/10A-D) and [[0018]) and connected with the second re-distribution layer (Fig.1-3 (16 and [0018]), the integrated package device (Fig.1-3/7G-7I (12/10A-D) and [[0018]) further comprises a plurality of the package modules (Fig.1-3/7G-7I (12/10A-D) and [[0018]) that are stacked in a direction in which the first sub-package module (Fig.1-3/7G-7I (12/10A-D) and [[0018]) and the second sub-package module (Fig.1-3/7G-7I (12/10A-D) and [[0018]) are stacked, the external connection structure (Fig.1-3 (24) and [0018]) on one of any two adjacent package modules (Fig.1-3/7G-7I (12/10A-D) and [[0018]) is connected with the first re-distribution layer (Fig.1-3 (16 and [0018]) of the other of the two adjacent package modules (Fig.1-3/7G-7I (12/10A-D) and [[0018]), the integrated package device (Fig.1-3/7G-7I (12/10A-D) and [[0018]) further comprises a protecting layer (Fig.3 (22) and [0023- pad adds protection for solder ball]) covering the first re- distribution layer (Fig.1-3 (16 and [0018]) of the package module (Fig. 3 (10D) and [0022/0024]) outermost in a vertical direction, and the TMVs (Fig.3 (18) and [0018]) in the package modules (Fig. 3 (10A-10D) and [0022/0024]) are aligned or misaligned in the vertical direction (aligned).
Conclusion
The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. Jiang et al (US 20150325554; US 7781877 and US 11594525); Huang et al (US 20150364448); and Vincent (US 20150108661) teach similar structures.
Any inquiry concerning this communication or earlier communications from the examiner should be directed to LAURA M MENZ whose telephone number is (571)272-1697. The examiner can normally be reached Monday-Friday 7:00-3:30.
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/LAURA M MENZ/Primary Examiner, Art Unit 2813
2/16/26