Tech Center 2800 • Art Units: 2813
This examiner grants 87% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18364434 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18229446 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18350405 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18213851 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18311289 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18284457 | PHOTOELECTRIC CONVERSION ELEMENT AND METHOD FOR MANUFACTURING PHOTOELECTRIC CONVERSION ELEMENT | Non-Final OA | IDEMITSU KOSAN CO.,LTD. |
| 18535631 | DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd |
| 17994446 | SENSOR PACKAGE WITH LOW ASPECT RATIO THROUGH SILICON VIA | Non-Final OA | Texas Instruments Incorporated |
| 18772202 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18460600 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18340519 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17838637 | DUAL METAL SILICIDE FOR STACKED TRANSISTOR DEVICES | Non-Final OA | Intel Corporation |
| 18189673 | INTEGRATED DEVICE COMPRISING STACKED INDUCTORS WITH LOW OR NO MUTUAL INDUCTANCE | Non-Final OA | QUALCOMM Incorporated |
| 18200590 | MULTI-DIE QFN HYBRID PACKAGE | Non-Final OA | MEDIATEK INC. |
| 18459421 | HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18317617 | MEMORY DEVICE AND MANUFACTURING METHOD OF THE MEMORY DEVICE | Non-Final OA | SK hynix Inc. |
| 17962687 | SEMICONDUCTOR DEVICE INCLUDING THROUGH VIAS WITH DIFFERENT WIDTHS AND METHOD OF MANUFACTURING THE SAME | Final Rejection | SK hynix Inc. |
| 18227266 | INTEGRATED PACKAGE DEVICE, FABRICATION METHOD THEREOF AND MEMORY SYSTEM | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18220096 | MEMORY DEVICES AND METHODS FOR FORMING THE SAME | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18206858 | SEMICONDUCTOR PACKAGE STRUCTURE, FABRICATING METHOD THEREOF, AND MEMORY SYSTEM | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18126767 | SYSTEM AND METHOD OF BUMP MAP DETERMINATION AND BUMP ARRAY FORMATION | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18241237 | SEMICONDUCTOR CHIP ALIGNMENT APPARATUS AND METHOD FOR PACKAGING | Non-Final OA | KOREA ATOMIC ENERGY RESEARCH INSTITUTE |
| 18140683 | DISPLAY PANEL AND DISPLAY DEVICE | Final Rejection | Xiamen Tianma Microelectronics Co., Ltd. |
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