Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2813
This examiner grants 88% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18642368 | HIGH EFFICIENCY SINGLE-PHOTON AVALANCHE DIODE (SPAD) PIXEL | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18402416 | METHOD AND DEVICE FOR TRANSFERRING ELECTRONIC CHIP | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18229446 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18350405 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18701905 | LIGHT-EMITTING CHIP, LIGHT-EMITTING DEVICE AND DISPLAY APPARATUS | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18781581 | DISPLAY APPARATUS | Non-Final OA | LG Display Co., Ltd. |
| 18187990 | LONG CHANNEL FIN TRANSISTORS IN NANORIBBON-BASED DEVICES | Non-Final OA | Intel Corporation |
| 18623419 | SEMICONDUCTOR DEVICES AND FABRICATING METHODS THEREOF | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18767665 | OXIDE THIN FILM TRANSISTOR | Non-Final OA | ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE |
| 18393513 | SEMICONDUCTOR DEVICE INCLUDING MEMORY CELL HAVING SELECTOR | Non-Final OA | SK hynix Inc. |
| 18317617 | MEMORY DEVICE AND MANUFACTURING METHOD OF THE MEMORY DEVICE | Final Rejection | SK hynix Inc. |
| 18544997 | LOW PROFILE DIE TERMINAL WITH BALL DROP SOLDER | Non-Final OA | Texas Instruments Incorporated |
| 17994446 | SENSOR PACKAGE WITH LOW ASPECT RATIO THROUGH SILICON VIA | Final Rejection | Texas Instruments Incorporated |
| 18514763 | COOLING SYSTEM FOR A SEMICONDUCTOR DEVICE ASSEMBLY | Non-Final OA | Micron Technology, Inc. |
| 18772202 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18410302 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FABRICATING SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, LTD. |
| 18647736 | DEEP TRENCH SIDEWALL PASSIVATION USING CONFORMAL PLASMA DOPING AND LOW-TEMPERATURE THERMAL TREATMENTS | Non-Final OA | Applied Materials, Inc. |
| 18419588 | CAVITY TAPE FOR PACKAGE PROTECTION | Non-Final OA | Sandisk Technologies, Inc. |
| 18630008 | BACKSIDE TO FRONTSIDE CONNECTION AMONG DIFFERENT METAL TRACKS | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18529060 | DISCONNECTED GATE DIELECTRIC FOR TRANSISTORS | Non-Final OA | International Business Machines Corporation |
| 18529460 | CONNECTING FRONTSIDE CONTACT WITH BACKSIDE CONTACT OF A SOURCE/DRAIN | Non-Final OA | International Business Machines Corporation |
| 18284457 | PHOTOELECTRIC CONVERSION ELEMENT AND METHOD FOR MANUFACTURING PHOTOELECTRIC CONVERSION ELEMENT | Final Rejection | IDEMITSU KOSAN CO.,LTD. |
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