Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2813
This examiner grants 87% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18367549 | INTEGRATED CIRCUIT INCLUDING STANDARD CELL WITH A METAL LAYER HAVING A PATTERN AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18364434 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18350405 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18311289 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 17930706 | GATE ALL AROUND TRANSISTORS WITH HETEROGENEOUS CHANNELS | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 17838637 | DUAL METAL SILICIDE FOR STACKED TRANSISTOR DEVICES | Final Rejection | Intel Corporation |
| 18200590 | MULTI-DIE QFN HYBRID PACKAGE | Non-Final OA | MEDIATEK INC. |
| 18772202 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18460600 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18340519 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18317617 | MEMORY DEVICE AND MANUFACTURING METHOD OF THE MEMORY DEVICE | Non-Final OA | SK hynix Inc. |
| 17962687 | SEMICONDUCTOR DEVICE INCLUDING THROUGH VIAS WITH DIFFERENT WIDTHS AND METHOD OF MANUFACTURING THE SAME | Final Rejection | SK hynix Inc. |
| 18220096 | MEMORY DEVICES AND METHODS FOR FORMING THE SAME | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18046519 | STACKING SEMICONDUCTOR DEVICES BY BONDING FRONT SURFACES OF DIFFERENT DIES TO EACH OTHER | Non-Final OA | ADVANCED MICRO DEVICES, INC. |
| 18380325 | SEMICONDUCTOR DEVICE WITH POLYMER LINER AND METHOD FOR FABRICATING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18241237 | SEMICONDUCTOR CHIP ALIGNMENT APPARATUS AND METHOD FOR PACKAGING | Non-Final OA | KOREA ATOMIC ENERGY RESEARCH INSTITUTE |
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