Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2813
This examiner grants 88% of resolved cases
Laura Mary Menz is an examiner in Art Unit 2813 of Tech Center 2800, with 962 resolved cases. The allowance rate is 87.7 percent, and the interview lift is 8.7 percent. These figures indicate a favorable environment for patent applicants. The 8.7 percent lift suggests that interviews are a productive way to resolve any issues that might arise during the 87.7 percent allowance process.
The median time to allowance is 890 days. This 890 day period, combined with the 87.7 percent allowance rate, suggests a predictable and successful prosecution experience. The 8.7 percent interview lift provides a helpful boost for the cases that face initial difficulties. With 962 resolved cases, the examiner has a significant track record of allowing applications in a timely manner. The 890 day timeline is a reliable benchmark for practitioners in Art Unit 2813.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18642368 | HIGH EFFICIENCY SINGLE-PHOTON AVALANCHE DIODE (SPAD) PIXEL | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18229446 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18350405 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18612089 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18781581 | DISPLAY APPARATUS | Non-Final OA | LG Display Co., Ltd. |
| 18665786 | NITRIDE STRUCTURE AND SEMICONDUCTOR DEVICE | Non-Final OA | TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION |
| 18623419 | SEMICONDUCTOR DEVICES AND FABRICATING METHODS THEREOF | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18767665 | OXIDE THIN FILM TRANSISTOR | Non-Final OA | ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE |
| 18529060 | DISCONNECTED GATE DIELECTRIC FOR TRANSISTORS | Non-Final OA | International Business Machines Corporation |
| 18529460 | CONNECTING FRONTSIDE CONTACT WITH BACKSIDE CONTACT OF A SOURCE/DRAIN | Non-Final OA | International Business Machines Corporation |
| 18775002 | Customized heat dissipation from different types of integrated circuit dies packaged on a common substrate | Non-Final OA | Marvell Asia Pte Ltd |
| 18544997 | LOW PROFILE DIE TERMINAL WITH BALL DROP SOLDER | Non-Final OA | Texas Instruments Incorporated |
| 17994446 | SENSOR PACKAGE WITH LOW ASPECT RATIO THROUGH SILICON VIA | Final Rejection | Texas Instruments Incorporated |
| 18514763 | COOLING SYSTEM FOR A SEMICONDUCTOR DEVICE ASSEMBLY | Non-Final OA | Micron Technology, Inc. |
| 18410302 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FABRICATING SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, LTD. |
| 18647736 | DEEP TRENCH SIDEWALL PASSIVATION USING CONFORMAL PLASMA DOPING AND LOW-TEMPERATURE THERMAL TREATMENTS | Non-Final OA | Applied Materials, Inc. |
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