Prosecution Insights
Last updated: April 19, 2026
Application No. 18/236,243

Rigid Sapphire Based Direct Patterning Deposition Mask

Non-Final OA §102§103
Filed
Aug 21, 2023
Examiner
CROWELL, ANNA M
Art Unit
1716
Tech Center
1700 — Chemical & Materials Engineering
Assignee
Emagin Corporation
OA Round
1 (Non-Final)
45%
Grant Probability
Moderate
1-2
OA Rounds
3y 10m
To Grant
76%
With Interview

Examiner Intelligence

Grants 45% of resolved cases
45%
Career Allow Rate
191 granted / 424 resolved
-20.0% vs TC avg
Strong +31% interview lift
Without
With
+31.0%
Interview Lift
resolved cases with interview
Typical timeline
3y 10m
Avg Prosecution
39 currently pending
Career history
463
Total Applications
across all art units

Statute-Specific Performance

§101
0.2%
-39.8% vs TC avg
§103
56.0%
+16.0% vs TC avg
§102
19.1%
-20.9% vs TC avg
§112
13.2%
-26.8% vs TC avg
Black line = Tech Center average estimate • Based on career data from 424 resolved cases

Office Action

§102 §103
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Election/Restrictions Applicant’s election without traverse of Group I (claims 1-4) in the reply filed on December 12, 2025 is acknowledged. Claim 5 is withdrawn from further consideration pursuant to 37 CFR 1.142(b) as being drawn to a nonelected invention, there being no allowable generic or linking claim. Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claim(s) 1 and 3 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by anticipated by Moraes et al. (U.S. 2020/0295265). Referring to Figures 1-10 and paragraphs [0023]-[0037], Moraes et al. disclose a direct patterning deposition mask for OLED deposition (pars.[0015]-[0016]), the mask comprising: (a) a sapphire substrate 100 (Fig. 10, par.[0023]); and (b) Silicon Nitride (SiN) membrane 104 (Fig. 10, par.[0025]). With respect to claim 3, the direct patterning deposition mask of Moraes et al. further includes wherein the sapphire substrate has a diameter in the range of 200mm diameter to 300mm diameter (par.[0023],i.e. diameter of sapphire substrate 100 is equal to the diameter of the processing substrate (i.e. typically ranges from 200mm-300mm diameter)). Claim Rejections - 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. Claim(s) 2 and 4 is/are rejected under 35 U.S.C. 103 as being unpatentable over Moraes et al. (U.S. 2020/0295265) in view of Dong et al. (U.S. 2021/0359210) or Wang (U.S. 2021/0132033). The teachings of Moraes et al. have been discussed above. Moraes et al. is silent on the sapphire substrate thickness is between 0.7 and 2 mm. Referring to paragraphs [0085]-[0086], [0095]-[0096], Dong et al. teach a deposition mask wherein the sapphire substrate thickness is between 0.7 and 2 mm since it is a suitable and conventional thickness used for a shadow mask. Referring to paragraphs [0081],[0085], Wang teaches a deposition mask wherein the sapphire substrate thickness is between 0.7 and 2 mm since it is a suitable and conventional thickness used for a mask. Therefore, it would have been obvious to one of ordinary skill in the art, before the effective filing date of the claimed invention, to have modified the apparatus of Moraes et al. with the sapphire substrate thickness is between 0.7 and 2 mm as taught by Dong et al. or Wang since it is a suitable and conventional thickness used for a deposition mask. With respect to claim 4, the direct patterning deposition mask of Moraes et al. in view of Dong et al. or Wang further includes wherein warpage of the substrate is <10um (i.e. Since the material of the substrate is sapphire and the substrate thickness is between 0.7 and 2 mm, the resulting sapphire substrate would yield a warpage of the substrate is <10um). Conclusion The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. Chan et al.793, Ghosh et al.’543, Ghosh et al.’542, Vazan et al.’925, Vazan et al.’252, Ghosh et al.’901, Ghosh et al.’498, and Chan et al.’652 teach a shadow mask for OLED. Nishida et al.’069 teach a deposition task having substrate made of sapphire. Ju et al.’010 and Walker’881 teach a shadow mask. Korneisel et al. teach controlling the warping of a shadow mask. Any inquiry concerning this communication or earlier communications from the examiner should be directed to Michelle CROWELL whose telephone number is (571)272-1432. The examiner can normally be reached Monday-Thursday 10:00am-6:00pm. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Parviz Hassanzadeh can be reached at 571-272-1435. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /Michelle CROWELL/Examiner, Art Unit 1716 /SYLVIA MACARTHUR/Primary Examiner, Art Unit 1716
Read full office action

Prosecution Timeline

Aug 21, 2023
Application Filed
Jan 09, 2026
Non-Final Rejection — §102, §103 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

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PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
2y 5m to grant Granted Apr 14, 2026
Patent 12604708
ATOMIC LAYER ETCH SYSTEMS FOR SELECTIVELY ETCHING WITH HALOGEN-BASED COMPOUNDS
2y 5m to grant Granted Apr 14, 2026
Patent 12555741
MAGNETIC HOUSING SYSTEMS
2y 5m to grant Granted Feb 17, 2026
Patent 12548739
PLASMA SOURCE FOR SEMICONDUCTOR PROCESSING
2y 5m to grant Granted Feb 10, 2026
Patent 12525439
APPARATUS FOR PLASMA PROCESSING AND METHOD OF ETCHING
2y 5m to grant Granted Jan 13, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
45%
Grant Probability
76%
With Interview (+31.0%)
3y 10m
Median Time to Grant
Low
PTA Risk
Based on 424 resolved cases by this examiner. Grant probability derived from career allow rate.

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