Tech Center 3700 • Art Units: 1712 1716 1792 3722
This examiner grants 45% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 17970163 | PLASMA CONTROL APPARATUS AND PLASMA PROCESSING SYSTEM | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 17729645 | REACTOR SYSTEMS AND METHODS FOR CLEANING REACTOR SYSTEMS | Non-Final OA | ASM IP Holding B.V. |
| 18663897 | MAGNETIC HOLDING STRUCTURES FOR PLASMA PROCESSING APPLICATIONS | Final Rejection | Applied Materials, Inc. |
| 18099846 | FORMATION OF METALLIC FILMS ON ELECTROLESS METAL PLATING OF SURFACES | Final Rejection | Applied Materials, Inc. |
| 17370619 | SHOWERHEAD ASSEMBLY WITH RECURSIVE GAS CHANNELS | Final Rejection | Applied Materials, Inc. |
| 16134200 | SYSTEMS AND PROCESSES FOR PLASMA TUNING | Final Rejection | Applied Materials, Inc. |
| 18450625 | PLASMA PROCESSING DEVICE, PLASMA PROCESSING METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | Non-Final OA | Kioxia Corporation |
| 18101676 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | Non-Final OA | Tokyo Electron Limited |
| 18088870 | PLASMA PROCESSING APPARATUS AND ELECTROSTATIC CHUCK MANUFACTURING METHOD | Non-Final OA | Tokyo Electron Limited |
| 17894296 | ELECTROSTATIC CHUCK, SUBSTRATE SUPPORT, PLASMA PROCESSING APPARATUS, AND METHOD OF MANUFACTURING ELECTROSTATIC CHUCK | Non-Final OA | Tokyo Electron Limited |
| 17882834 | PLASMA PROCESSING APPARATUS AND FILM FORMING METHOD | Non-Final OA | Tokyo Electron Limited |
| 17641871 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | Final Rejection | Hitachi High-Tech Corporation |
| 16815284 | SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM | Final Rejection | KOKUSAI ELECTRIC CORPORATION |
| 17894374 | SUBSTRATE TREATING APPARATUS | Non-Final OA | SEMES CO., LTD. |
| 17868048 | APPARATUS FOR TREATING SUBSTRATE | Non-Final OA | SEMES CO., LTD. |
| 17335239 | APPARATUS FOR TREATING SUBSTRATE | Non-Final OA | SEMES CO., LTD. |
| 18283810 | METAL ORGANIC CHEMICAL VAPOR DEPOSITION APPARATUS | Non-Final OA | TES CO., LTD |
| 17221021 | Core-Shell Particles and Composite Material Synthesized Therefrom | Final Rejection | Persimmon Technologies Corporation |
| 18512815 | CARBON CONTAINING PRECURSORS FOR BEAM-INDUCED DEPOSITION | Non-Final OA | FEI Company |
| 18236243 | Rigid Sapphire Based Direct Patterning Deposition Mask | Non-Final OA | eMagin Corporation |
| 18234899 | WAFER SUPPORT PLATE AND SEMICONDUCTOR MANUFACTURING APPARATUS INCLUDING SAME | Non-Final OA | United Semiconductor Japan Co., Ltd. |
| 17070735 | ELECTROSTATIC CHUCK, METHOD OF MANUFACTURING ELECTROSTATIC CHUCK, AND PLASMA PROCESSING APPARATUS | Non-Final OA | ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA |
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