Prosecution Insights
Last updated: August 17, 2026

Examiner: CROWELL, ANNA M

Tech Center 3700 • Art Units: 1712 1713 1716 1792 3722

This examiner grants 45% of resolved cases

Performance Statistics

44.7%
Allow Rate
-25.3% vs TC avg
473
Total Applications
+30.8%
Interview Lift
1402
Avg Prosecution Days
Based on 438 resolved cases, 2023–2026

Rejection Statute Breakdown

0.2%
§101 Eligibility
16.5%
§102 Novelty
57.9%
§103 Obviousness
13.7%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18754531 BARRIER LAYER REMOVAL DEVICE AND BARRIER LAYER REMOVAL METHOD Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18133277 PLASMA ETCHING APPARATUS AND OPERATING METHOD THEREOF Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18773858 Vapor Deposition Processes Non-Final OA ASM IP Holding B.V.
18510043 SYSTEMS AND APPARATUS FOR SEMICONDUCTOR EQUIPMENT Non-Final OA ASM IP Holding B.V.
17729645 REACTOR SYSTEMS AND METHODS FOR CLEANING REACTOR SYSTEMS Non-Final OA ASM IP Holding B.V.
18227097 SEMICONDUCTOR MANUFACTURING CHAMBER WITH PLASMA/GAS FLOW CONTROL DEVICE Non-Final OA Taiwan Semiconductor Manufacturing Company LTD
18663897 MAGNETIC HOLDING STRUCTURES FOR PLASMA PROCESSING APPLICATIONS Non-Final OA Applied Materials, Inc.
18543302 ESC DESIGN WITH ENHANCED TUNABILITY FOR WAFER FAR EDGE PLASMA PROFILE CONTROL Non-Final OA Applied Materials, Inc.
18227767 PROCESS STACK FOR CVD PLASMA TREATMENT Non-Final OA Applied Materials, Inc.
16134200 SYSTEMS AND PROCESSES FOR PLASMA TUNING Final Rejection Applied Materials, Inc.
18450625 PLASMA PROCESSING DEVICE, PLASMA PROCESSING METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD Final Rejection Kioxia Corporation
18789854 HYDROPHOBIZATION TREATMENT APPARATUS, HYDROPHOBIZATION TREATMENT METHOD, AND COMPUTER STORAGE MEDIUM Final Rejection Tokyo Electron Limited
18659116 PLASMA PROCESSING APPARATUS Non-Final OA Tokyo Electron Limited
18240010 PLASMA PROCESSING APPARATUS Final Rejection Tokyo Electron Limited
18199401 SUBSTRATE PROCESSING APPARATUS AND METHOD FOR ALIGNING RING MEMBER Non-Final OA Tokyo Electron Limited
17734125 ETCHING METHOD, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING SYSTEM Non-Final OA Tokyo Electron Limited
18512815 CARBON CONTAINING PRECURSORS FOR BEAM-INDUCED DEPOSITION Non-Final OA FEI Company

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