Prosecution Insights
Last updated: August 16, 2026
Application No. 18/245,185

METHOD FOR PRODUCING A PACKAGE, AND OPTOELECTRONIC DEVICE

Non-Final OA §112
Filed
Mar 14, 2023
Priority
Sep 15, 2020 — DE 10 2020 124 008.2 +1 more
Examiner
LE, THAO P
Art Unit
2818
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Ams-osram AG
OA Round
1 (Non-Final)
93%
Grant Probability
Favorable
1-2
OA Rounds
0m
Est. Remaining
92%
With Interview

Examiner Intelligence

Grants 93% — above average
93%
Career Allowance Rate
751 granted / 811 resolved
+24.6% vs TC avg
Minimal -1% lift
Without
With
+-1.0%
Interview Lift
resolved cases with interview
Fast prosecutor
1y 10m
Avg Prosecution
16 currently pending
Career history
822
Total Applications
across all art units

Statute-Specific Performance

§101
1.2%
-38.8% vs TC avg
§103
42.4%
+2.4% vs TC avg
§102
43.0%
+3.0% vs TC avg
§112
3.3%
-36.7% vs TC avg
Black line = Tech Center average estimate • Based on career data from 811 resolved cases

Office Action

§112
DETAILED ACTION Response to Preliminary Amendment This Office Action is in response to Amendment filed on 03/14/23. Claims 1-15 have been amended. Claims 1-16 are pending. Remark of Applicants has been considered. Information Disclosure Statement The information disclosure statement (IDS) submitted on 03/14/2023 is in compliance with the provisions of 37 CFR 1.97. Accordingly, the information disclosure statement is being considered by the examiner. Claim Rejections - 35 USC § 112 Claim limitation “in particular” invokes 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph. However, the written description fails to disclose the corresponding structure, material, or acts for performing the entire claimed function and to clearly link the structure, material, or acts to the function. Therefore, the claim is indefinite and is rejected under 35 U.S.C. 112(b) or pre-AIA 35 U.S.C. 112, second paragraph. Applicant may: (a) Amend the claim so that the claim limitation will no longer be interpreted as a limitation under 35 U.S.C. 112(f) or pre-AIA 35 U.S.C. 112, sixth paragraph; (b) Amend the written description of the specification such that it expressly recites what structure, material, or acts perform the entire claimed function, without introducing any new matter (35 U.S.C. 132(a)); or (c) Amend the written description of the specification such that it clearly links the structure, material, or acts disclosed therein to the function recited in the claim, without introducing any new matter (35 U.S.C. 132(a)). If applicant is of the opinion that the written description of the specification already implicitly or inherently discloses the corresponding structure, material, or acts and clearly links them to the function so that one of ordinary skill in the art would recognize what structure, material, or acts perform the claimed function, applicant should clarify the record by either: (a) Amending the written description of the specification such that it expressly recites the corresponding structure, material, or acts for performing the claimed function and clearly links or associates the structure, material, or acts to the claimed function, without introducing any new matter (35 U.S.C. 132(a)); or (b) Stating on the record what the corresponding structure, material, or acts, which are implicitly or inherently set forth in the written description of the specification, perform the claimed function. For more information, see 37 CFR 1.75(d) and MPEP §§ 608.01(o) and 2181. Claim 1, line 2 includes “in particular an injection-molded circuit carrier” which is unclear under 112b as to a broad limitation followed by a narrowing limitation in the same paragraph. Therefore, the boundary of the claim is unclear (as to be specific or the broader limitation, also not clear. Also, the number “18” in line 5 should be removed. Claim 4, line 2 and line 3 include “in particular” which are unclear for the same reason as above. Claim 5: line 6 includes “in particular” is unclear for the same reason as above. Claim 7: line 3 includes “in particular” is unclear for the same reason as above, also, “the step of laser induced for electrolytic removal” has no antecedent basis and needs to be clear what this is or where it is coming from. It was never introduced or described in claim 1 which claim 7 depends from. Claims 8-10 and 14, each includes “in particular” which is unclear for the same reason as above. Claims 2-3, 6, 11-13, 15-16 depend on 112(b)-rejected-claims, therefore, claims 2-3, 6, 11-13, 15-16 are also indefinite and are rejected under 35 U.S.C. 112(b). Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to THAO P LE whose telephone number is (571)272-1785. The examiner can normally be reached on Monday-Friday 9AM-6PM. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Jeff Natalini can be reached on 571-272-2266. The fax phone number for the organization where this application or proceeding is assigned is 703-872-9306. Information regarding the status of an application may be obtained from the Patent Application Information Retrieval (PAIR) system. Status information for published applications may be obtained from either Private PAIR or Public PAIR. Status information for unpublished applications is available through Private PAIR only. For more information about the PAIR system, see http://pair-direct.uspto.gov. Should you have questions on access to the Private PAIR system, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). /THAO P LE/Primary Examiner, Art Unit 2818
Read full office action

Prosecution Timeline

Mar 14, 2023
Application Filed
Jan 30, 2026
Non-Final Rejection mailed — §112 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12696814
SEMICONDUCTOR PACKAGE
2y 5m to grant Granted Jul 28, 2026
Patent 12685057
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF
2y 12m to grant Granted Jul 14, 2026
Patent 12684853
SILICON CARBIDE SEMICONDUCTOR DEVICE
2y 4m to grant Granted Jul 14, 2026
Patent 12672586
MICROELECTRONIC DEVICE PACKAGES INCLUDING WIREBONDING AND RELATED METHODS, MEMORY DEVICES, AND ELECTRONIC SYSTEMS
3y 7m to grant Granted Jun 30, 2026
Patent 12672554
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
2y 8m to grant Granted Jun 30, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
93%
Grant Probability
92%
With Interview (-1.0%)
1y 10m (~0m remaining)
Median Time to Grant
Low
PTA Risk
Based on 811 resolved cases by this examiner. Grant probability derived from career allowance rate.

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